为了提高镀锡板产品质量，降低生产成本，研究了电镀锡溶液组成、电流密度、温度等电镀工艺条件对镀锡板孔隙率的影响。结果表明：镀锡液各成分对镀锡板孔隙率的影响次序是EN〉PSA〉ENSA〉Sn2＋；最优配方是5g／LENSA，5g／LEN，16g／LPSA，22g／LSn2＋；随着电流密度从0．5A／dm2增加到3．0A／dm2，电沉积的锡晶粒度逐渐细化，孔隙率逐渐降低，至3．0A／dm2时，锡晶粒度最小，孔隙率也最小；随着镀液温度的升高，镀锡板铁溶出值（PHG）值先减小，后增大，在40℃附近出现了最小值。
参考文献
| [1] | Zubimendi J.The Influence of Operating Conditions on the Morphology of Tin Electrodeposits and Tinplate Quality[A].London,ITRI,1996:85-94. |
| [2] | Yoshida M;Morita J;Higashi M et al.Influence of Plating Conditions of the Lightly Tin Plated Steel Sheet on the Alloying Behavior[J].Transactions of the Iron and Steel Institute of Japan,1986,26(02):66. |
| [3] | Ogata M;Kikuchi T;Mortito N.Morphological Iinvestigation of a Tin- plated Surface with an Atomic Force Microscope[A].London,ITRI,1992:316-327. |
| [4] | George A;Federman L.A Comparative Study of the Effects of Metallic Impurities on MSA- & PSA-based Tin Electrolyres[A].London,ITRI,1992:88. |
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