用正硅酸惡酯、硝酸铝、硝酸钙、硝酸镁经化恘反愓，添加燃烧剂烧结后悁磨制成了超细玻璃粉原料；用水合三氯化钌高温脱水法制备了悦化钌粉原料；采用低温共烧(LTCC)制成了混有这两种原料的钌厚膜电阻。采用差热分析惖、激光粒度惖和扫描电子显微镜进行了分析表征。结果表明，制备的电阻浆料与 LTCC 生瓷烧结性能相匹配，稳定性好，温度系数在±200×10-6/℃惣内，制备的电阻器平均方阻为88.5?/□。
The fine glass powders were prepared by chemical reaction of tetraethoxysilane, aluminum nitrate, calcium nitrate, and magnesium nitrate, followed by sintering with combustion agents and grinding to give a fine particle size suitable for making thick film resistor paste. Conductive powders RuO2 was prepared by dehydration of RuCl3·nH2O at high temperature. The glass powders, RuO2, were mixed to prepare thick film resistor under typical low temperature co-fired ceramic technology procedure. The DTA and size distribution of glass powders, the morphology and electrical properties of the resistor have been studied. The paste shows well sintering compatibility with LTCC green tape, the formed resistor exhibits good stability and its temperature coefficient of resistance is within the range of ±200 ppm/℃, andthe prepared resistors have an average sheet resistance of 88.5 ?/□.
参考文献
| [1] | Torsten Thelemann;Heiko Thust;Michael Hintz .Using LTCC for microsystems[J].Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe,2002(3):19-23. |
| [2] | Rusu C;Persson K;Ottosson B;Billger D .LTCC interconnects in microsystems[J].Journal of Micromechanics and Microengineering,2006(6):S13-S18. |
| [3] | Jaakko Lenkkeri;Tuomo Jaakola;Kari Kautio;Markku Lahti .Prospects and Limits of LTCC Technology[J].Advancing microelectronics,2005(3):9-12. |
| [4] | A. Alessandrini;G. Valdre;B. Morten;M. Prudenziati .Electric force microscopy investigation of the microstructure of thick film resistors[J].Journal of Applied Physics,2002(8):4705-4711. |
| [5] | Kirkpatrick S .Percolation and conduction[J].Reviews of Modern physics,1973,45(01):574-588. |
| [6] | Yonezawa F;Cohen M H .Granular effective medium approximation[J].Journal of Applied Physics,1983,54:2895-2899. |
| [7] | Birol H;Maeder T;Jacq C et al.Investigation of interaction between co-fired LTCC components[J].Journal of the European Ceramic Society,2005,25:2065-2069. |
| [8] | Martin Rauscher;Andreas Roosen .Influence of Low-Temperature Co-Fired Ceramics Green Tape Characteristics on Shrinkage Behavior[J].International journal of applied ceramic technology,2007(5):387-397. |
| [9] | Barnwell P;Zhang W;Lebowitch J.An investigation of the properties of LTCC materials and compatible conductors for their use in wireless applications[A].IMAPS,Boston,USA,2000:659-664. |
| [10] | Marko Hrovat;Darko Belavic;Jaroslaw Kita .Thick-film PTC thermistors and LTCC structures: The dependence of the electrical and microstructural characteristics on the firing temperature[J].Journal of the European Ceramic Society,2007(5):2237-2243. |
| [11] | Vest R W .Materials science of thick film technology[J].Ceramic Bulletin,1986,65(04):631-636. |
| [12] | Inokuma T;Taketa Y .Control of electrical properties of RuO2 thick film resistors[J].Active and Passive Electronic Components,1987,12(03):155-166. |
| [13] | Abe O;Taketa Y;Haradome J .The effect of various factors on the resistivity and TCR of RuO2 thick film resistors-relation between the electrical properties and particle size of constituents,the physical properties of glass and firing temperature[J].Active and Passive Electronic Components,1988,13(02):76-83. |
| [14] | Crosbie GM.;Trela W.;Johnson F. .Processing factor dependence of resistivity parameters of ruthenate-based thick film resistors with low temperature coefficients[J].Journal of Applied Physics,1998(5):2913-2919. |
| [15] | Morten B;Masoero A;Prudenziati M et al.Evolution of ruthenate-based thick film cermet resistors[J].Journal of Applied Physics,1994,27(10):2227-2235. |
| [16] | Pierce J W;Kuty D W;Larry J R .The chemistry and stability of ruthenium based resistors[J].SOLID STATE TECHNOLOGY,1982,25(10):85-93. |
| [17] | Hrovat M;Samardˇzija Z;Holc J .Microstructural and electrical characteristics of some "verfired” thick-film resistors[J].Journal of Materials Science Letters,2001,20(04):347-351. |
| [18] | Rodrigues M A;Yang P;Kotula P et al.Microstructure and phase development of buried resistors in low temperature co-fired ceramics[J].Journal of Electronic Ceramics,2000,5(03):217-223. |
| [19] | Dziedzic A;Golonka L J;Kita J et al.Electrical and stability properties and ultrasonic microscope charac-terization of low temperature co-fired ceramics resistors[J].Microelectronic Journal,2001,41(05):669-676. |
| [20] | Hsi CS.;Chen DF.;Shieh FM.;Fu SL. .Processing of LTCC with embedded RuO2-based resistors[J].Materials Chemistry and Physics,2003(1):67-72. |
| [21] | Jihua Zhong;Haim H. Bau .Thick-Film Thermistors PRINTED ON LTCC TAPES[J].American Ceramic Society bulletin,2001(10):39-42. |
| [22] | H. Birol;T. Maeder;C. Jacq .Investigation of interactions between co-fired LTCC components[J].Journal of the European Ceramic Society,2005(12):2065-2069. |
| [23] | Gulmurza A;Gulbahor S;Lutfullo X et al.Interaction of RuO2 and lead-silicate glass in thick-film resistors[J].Condensed Matter Physics,2011,1(01):1-5. |
| [24] | Markku Lahti;Antti Vimpari;Kari Kautio .Printable resistors in LTCC systems[J].Journal of the European Ceramic Society,2007(8/9):2953-2956. |
| [25] | Ting C J;Hsi C S;Lu H J .Interactions between ruthenium based resistors and cordierite-glass substrates in low temperature co-fired ceramics[J].AMERICAN CERAMIC SOCIETY BULLETIN,2000,83(03):2945-2953. |
| [26] | Jantunen H;Kangasvieri T;Vahakangas J et al.Design aspects of microwave components with LTCC technique[J].Journal of the European Ceramic Society,2003,23(01):2541-2548. |
| [27] | 赵玲,田相亮,熊庆丰,黄富春,樊明娜.银电子浆料用无铅玻璃的研制[J].贵金属,2012(01):1-4,9. |
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