以氧化铜(CuO)和氧化镧(La2O3)为掺杂剂,采用高能球磨工艺制备纳米SnO2粉体,再将粉体与银粉(Ag)通过球磨混粉制成银氧化锡复合粉体,分别采用模压工艺和热挤压工艺制成银的质量分数为82％的纳米掺杂Ag/SnO2触头材料.利用扫描电子显微镜、电导率测试仪、显微硬度仪和热重分析仪对制备的粉体和触头材料进行显微组织观察及性能测试,并分析热挤压工艺对触头材料显微组织和性能的影响.结果表明:经球磨混粉制备的复合粉体中氧化物在银基体中分布均匀;热挤压工艺制备的Ag/SnO2触头材料的密度、硬度和电导率分别比模压工艺提高6.25％、55.19％和10.75％,热失重百分率减少了1.55％.
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