采用双氰胺(DICY)、间苯二胺(m-PDA)、长链柔性二胺(DAMI)固化双酚A型环氧树脂(E-51),制备了三种环氧胶粘剂,分别考察了三种固化剂对挠性覆铜板剥离强度的影响.根据差示扫描量热仪(DSC)曲线,通过T-β外推法得到了各固化剂固化环氧胶粘荆的固化工艺.采用扫描电子显微镜(SEM)考察其不同的破坏形式.结果表明,采用双氰胺固化的环氧胶粘剂粘接的挠性覆铜板,剥离后聚酰亚胺薄膜、铜箔表面都留有大量的胶粘剂,此破坏形式属于内聚破坏.同时双氰胺固化的环氧胶粘剂剥离强度最高,粘接强度迭到0.74 N/mm,符合日本JPAC行业标准.
The effect of dicyandiamide(DICY), M-phenylenediamine(m-PDA), long-chain flexible diamine (DAMI)curing gents on E-51 epoxy resin system for the peel strength of flexible circuit copper laminate(FCCL)was investigated respectively in this paper. Based on differential scanning caiorimetry(DSC)curves, the curing flow of different system was obtained by extrapolation of T-β figure. The scanning electron microscope(SEM)was used to observe fracture structure. The result shows that use of DICY curing of the epoxy adhesive bonding FCCL, after stripping of polyimide film, polyimide film and copper foil surface have left many adhesive, this form of damage belongs to intrinsic failure. The highest peel strength of FCCL was obtained by the use of DICY curing agents on E-51 epoxy resin system. Adhesive strength is, approximately, 0.74 N/mm which has meet Japan JPAC industry standards.
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