基于自制多场耦合装置,研究了Sn-3.0Ag-0.5Cu/Cu钎焊接头在多场耦合时效过程中界面金属间化合物(IMC)的显微组织变化和生长行为.结果表明,在相同的时效时间内,时效温度越高,界面IMC生长越快.当钎焊接头在85、125和150℃多场耦合时效时,IMC的形貌由扇贝状转变为较平整的层状.在多场耦合时效过程中,在Cu6 Sn5层中发现了白色的Ag3 Sn颗粒,而且普遍出现在Cu6Sn5凹陷处.界面IMC的生长厚度与时效时间的平方根成线性关系,其生长受扩散机制影响.多场耦合时效降低了界面IMC的激活能,整个IMC层的激活能为49 kJ/mol.
参考文献
[1] | 李晓延,严永长,史耀武.金属间化合物对SnAgCu/Cu界面破坏行为的影响[J].机械强度,2005(05):666-671. |
[2] | 于大全,段莉蕾,赵杰,王来,C.M.L.Wu.Sn-3.5Ag/Cu界面金属间化合物的生长行为研究[J].材料科学与工艺,2005(05):532-536. |
[3] | 王要利,张柯柯,李臣阳,衡中皓.RE对SnAgCu钎料合金及焊点性能的影响[J].材料热处理学报,2011(12):34-37. |
[4] | XIAOYAN LI;FENGHUI LI;FU GUO;YAOWU SHI .Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints[J].Journal of Electronic Materials,2011(1):51-61. |
[5] | 齐丽华,黄继华,张建纲,王烨.热-剪切循环条件下Sn-3.5Ag-0.5Cu/Cu(Ni)界面化合物生长行为研究[J].稀有金属材料与工程,2007(02):241-244. |
[6] | 赵杰,朱凤,尹德国,王来.强磁场下Sn-3Ag-0.5Cu/Cu界面金属间化合物生长行为[J].大连理工大学学报,2006(02):202-206. |
[7] | 常红,李明雨.SnAgCu焊点电迁移诱发IMC阴极异常堆积[J].电子元件与材料,2011(04):50-52,58. |
[8] | 王要利,张柯柯,刘帅,赵国际.微连接用Sn-2.5Ag-0.7Cu(0.1RE)钎料焊点界面Cu_6Sn_5的长大行为[J].稀有金属材料与工程,2010(01):117-121. |
[9] | 王要利,张柯柯,韩丽娟,温洪洪.Sn-2.5Ag-0.7Cu(0.1RE)/Cu焊点界面区微观组织与Cu6Sn5的生长动力学[J].中国有色金属学报,2009(04):708-713. |
[10] | LEE Tae-kyu;MA Hong-tao;LIU Kuo-chuan .Impact of isothermal aging on long-term reliability of fine-pitch ball grid array packages with Sn-Ag-Cu solder interconnects[J].Journal of Electronic Materials,2010,39(12):2565-2569. |
[11] | Zhang, Q.K.;Zhang, Z.F..In-situ observations on fracture behaviors of Cu-Sn IMC layers induced by deformation of Cu substrates[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2011:452-461. |
[12] | 李凤辉,李晓延,严永长.SnAgCu/Cu界面热循环及时效条件下化合物的生长行为[J].失效分析与预防,2008(01):23-27. |
[13] | 孟工戈,杨拓宇,陈雷达.Sn-2.5Ag-0.7Cu-XGe钎料显微组织与熔化特性[J].焊接学报,2007(10):65-68. |
[14] | KANG S K;SHI D Y .Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition[J].Journal of Electronic Materials,2006,35(06):480-484. |
[15] | Kim Y M;Roh H R;Kim S .Kinetics of intermetallic compound formation at the interface between Sn-3.0Ag-0.5 Cu solder and Cu-Zn alloy substrates[J].Journal of Electronic Materials,2010,39(01):2511. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%