综述了ONO(氧化物-氮化物-氧化物)反熔丝、非晶硅(a-Si)反熔丝和栅氧化层反熔丝的制作工艺、性能参数及其优缺点,介绍了反熔丝器件包括反熔丝可编程只读存储器(PROM)和反熔丝现场可编程门阵列(FPGA)在器件应用、存储容量、可用门数、工作电压和抗辐射性能等方面的研究进展,指出了反熔丝以及反熔丝器件的4个主要发展趋势,即工艺兼容、高密度、有机/柔性和新材料.
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