针对高功率脉冲磁控溅射(HPPMS)的缺点,结合沉积技术(PBII&D)技术,提出了一种新的处理方法——高功率脉冲磁控放电等离子体离子注入与沉积技术(HPPMS-PIID).本实验采用该技术在不锈钢基体上制备了CrN薄膜,分别采用3种偏压模式:无偏压、-100 V直流偏压和-15 kV脉冲偏压,对比研究了CrN薄膜形貌、结构、成分及性能发生的变化.结果表明:该方法制备的薄膜表面平整、晶粒排列致密,呈不连续的柱状晶生长.相结构单一,主要是CrN (200)相.由于负高压脉冲将大部分进入鞘层的离子都吸引到工件沉积,薄膜沉积速率得到较大提高.另外强烈的高能离子的注入与轰击,使得薄膜的结合力高达57.7N.
参考文献
| [1] | Kouznetsov V;Maca'k K;Schneider J M et al.[J].Surface and Coatings Technology,1999,122(2-3):290. |
| [2] | Bohlmark J.;Gudmundsson J.T.;Alami J.;Latteman M.;Helmersson U. .Spatial electron density distribution in a high-power pulsed magnetron discharge[J].IEEE Transactions on Plasma Science,2005(2):346-347. |
| [3] | Konstantinidis S;Dauchot JP;Hecq A .Titanium oxide thin films deposited by high-power impulse magnetron sputtering[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2006(3):1182-1186. |
| [4] | Anders A;Andersson J;Ehiasarian A et al.[J].dournal of Applied Physics,2007,102(11):113303. |
| [5] | Christie D J .[J].Czechoslovak Journal of Physics,2006,56:B93. |
| [6] | 王飞,徐可为.基片负偏压对Cu膜纳米压入硬度及微观结构的影响[J].稀有金属材料与工程,2004(05):531-533. |
| [7] | 谈淑咏,张旭海,李纪宏,吴湘君,蒋建清.基底负偏压对直流磁控溅射CrN薄膜择优取向及表面形貌的影响[J].功能材料,2010(06):1015-1018. |
| [8] | Greczynski, G.;Jensen, J.;B?hlmark, J.;Hultman, L. .Microstructure control of CrN_x films during high power impulse magnetron sputtering[J].Surface & Coatings Technology,2010(1):118-130. |
| [9] | Lattemann M;Ehiasarian AP;Bohmark J;Persson PAO;Helmersson U .Investigation of high power impulse magnetron sputtering pretreated interfaces for adhesion enhancement of hard coatings on steel[J].Surface & Coatings Technology,2006(22/23):6495-6499. |
| [10] | Boo JH;Jung MJ;Park HK;Nam KH;Han JG .High-rate deposition of copper thin films using newly designed high-power magnetron sputtering source[J].Surface & Coatings Technology,2004(0):721-727. |
| [11] | 田修波;吴忠振;巩春志 et al.[P].Chinese Patent:CN101838795A,2010-06-30. |
| [12] | Wu Z Z;Tian X B;Shi J W et al.[J].Review of Scientific Instruments,2011,82:033511. |
| [13] | 江东亮 .[J].无机材料学报,1989,4(02):97. |
| [14] | 田林海,陈坚,唐宾,何家文,陈华.IBAD界面反应及其对结合强度的影响[J].稀有金属材料与工程,2005(01):77-81. |
| [15] | Lattemann M;Abendroth B;Moafi A et al.[J].Diamond and Related Materials,2011,20(02):68. |
| [16] | Sharkeev Y P;Gritsenko B P;Fortuna S V et al.[J].Vacuum,1999,52(03):247. |
| [17] | 田民波.薄膜技术与薄膜材料[M].北京:清华大学出版社,2006:445. |
| [18] | Alami J;Sarakinos K;Uslu F et al.[J].Journal of Physics D:Applied Physics,2009,42:015304. |
| [19] | Conde A;Navas C;Cristobal AB;Housden J;de Damborenea J .Characterisation of corrosion and wear behaviour of nanoscaled e-beam PVD CrN coatings[J].Surface & Coatings Technology,2006(6):2690-2695. |
| [20] | Vyas A;Shen Y G;Zhou Z F et al.[J].Composites Science and Technology,2008,68(14):2922. |
| [21] | 周庆刚,白新德,陈小文,凌云汉,彭德全.氮化铬梯度膜的制备和电化学性能研究[J].稀有金属材料与工程,2004(06):666-669. |
| [22] | Shi Y;Long S;Liang F et al.[J].Applied Surface Science,2008,254(18):5861. |
| [23] | 李明升,冯长杰,王福会.电弧离子镀氮化铬涂层的高温氧化[J].稀有金属材料与工程,2007(z2):699-702. |
| [24] | Wilson GM;Saied SO;Field SK .Mechanical and physical properties of C and C-Cr sputter coatings measured at the nano-scale[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2007(20/21):7820-7828. |
| [25] | Ehiasarian A P;Wen J G;Petrov I .[J].Journal of Applied Physics,2007,101(05):054301. |
| [26] | Ehiasarian AP.;Munz WD.;Hultman L.;Helmersson U.;Petrov I. .High power pulsed magnetron sputtered CrNx films[J].Surface & Coatings Technology,2003(0):267-272. |
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