通过600℃/2 h真空退火,使复合电沉积的Ni-14.1 mass%Al膜(平均粒径为1 μm)合金化,获得一种新型细晶Ni3Al涂层.对比研究了该涂层与粗晶Ni3Al合金900℃下50 h恒温氧化过程.结果表明,细晶涂层可快速生长连续Al2O3膜,导致NiO的生长受到明显抑制.与粗晶合金相比,该氧化膜粘附性更强.其原因可能在于氧化时细晶结构可抑制源自氧化膜的阳离子空位及Ni3Al中因Al、Ni的互扩散所致的"Kirkendall"空位在氧化膜/基体界面沉积形成孔洞,提高了二者的结合强度.
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