用电化学测量法研究不同组装时间、不同组装浓度和不同pH情况下谷氨酸自组装单分子膜（SAMs）对铜在0.5 mol/L HCl中的缓蚀作用，考察碘离子和谷氨酸单分子膜的协同作用，并通过量子化学计算探讨谷氨酸在铜表面的吸附机理。结果表明，谷氨酸自组装膜的缓蚀效率随组装时间和组装浓度的增加递增，最佳组装条件是在10 mmol/L组装溶液中组装12 h；在 pH=10下形成的自组装单分子膜的缓蚀作用要优于其他pH下形成的自组装膜，碘离子的加入可进一步提高谷氨酸自组装膜对铜的保护效果。
Self-assembled monolayers (SAMs) of glutamic acid (Glu) were formed on copper surface. The influence of assembling time, Glu concentration and pH values on the protection of the Glu SAMs were examined by electrochemical impedance spectroscopy (EIS). It shows that the protective efficiency (PE) increased with an increase of self-assembling time and self-assembling concentration. The film assembled at 10 mmol/L concentration for 12 h possess the best protective effect. The optimal self-assembling pH is 10. The synergistic effect between iodide ion and Glu was studied by EIS and electrochemical polarization measurement. When iodide ion was added to the Glu-containing solution, the protection effect of the mixed SAMs improved significantly. The adsorption mechanism of the Glu on copper surface was discussed by AM1 quantum chemical calculations.
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