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采用磁控溅射共沉积法制备Al-Pb复合薄膜,运用TEM、SEM、EDX和电阻-温度仪对薄膜微观结构和电性能进行研究.结果表明,Al-Pb薄膜具有温度敏感性,电阻温度系数(TCR)可达8.4×10-3℃-1.薄膜微观结构含富Al基体相和富Pb第二相,呈两相组织.随着厚度的增大,第二相粒子及基体相晶粒粒度增大,界面密度降低,界面电子散射效应减弱,电阻率下降,TCR值增大.与Al膜和移去Al基体形成的Pb膜的电性能对比研究显示,Al-Pb薄膜存在并联导电机制,电阻率受两相电阻率和体积分数的影响.

参考文献

[1] Johnson E.;Dahmen U.;Chen S.;Fujii T.;Johansen A. .Shapes and sizes of nanoscale Pb inclusions in Al[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2001(0):187-193.
[2] Lapper K;James M;Chashechkina J et al.Sliding behavior of selected alloys[J].Wear,1997,203-204:46.
[3] Zhao JZ.;Feuerbacher B.;Ratke L. .Microstructure evolution of immiscible alloys during cooling through the miscibility gap[J].Modelling and simulation in materials science and engineering,1998(2):123-139.
[4] Cole Jerome F;Coodwin Frank E.The development and potential application of Pb-Al alloy[J].JOM,1990(06):41.
[5] Inoue A;Yano N;Matsuzaki K et al.Microstructure and superconduction properties of melt-quenched insoluble Al-Pb and Al-Pb-Si alloys[J].Journal of Materials Science,1987,22:123.
[6] Koroschetz F;Gartner W .轴承新材料及其制造方法[J].国外内燃机,1995,27(02):29.
[7] 王闸,孙勇.Al-Mx金属多层膜的红外特性研究[J].材料导报,2004(z1):239-241.
[8] Gladkikh N T;Bogatyrenko S I;Kryshtal A P et al.Melting point lowering of thin metal films (Me=In,Sn,Bi,Pb)in Al/Me/Al film system[J].Applied Surface Science,2003,219:338.
[9] Stankevic V.;Simkevicius C. .Application of aluminum films as temperature sensors for the compensation of output thermal shift of silicon piezoresistive pressure sensors[J].Sensors and Actuators, A. Physical,1998(3):161-166.
[10] 李义兵,王小军,周继承.磁控共溅射Ni3 Al合金薄膜的微观结构及电阻特性[J].功能材料,2006(01):40-42.
[11] Wang Hong;Zaluzec M J;Rigsbee J M .Microstructure and mechanical properties of sputter-deposited Cu1-x Tax alloys[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,1997,28(03):917.
[12] Cantor B;Cahn R W .Metastable alloy phases by co-sputtering[J].Acta Metallurgica,1976,24:845.
[13] Saunders N;Miodownik A P .Phase formation in co-deposited metallic alloy thin films[J].Journal of Materials Science,1987,22:629.
[14] Bangert H et al.Deposition and structural properties of two-component metal coatings for tribological applications[J].Surface and Coatings Technology,1996,80:162.
[15] Banerjee R et al.Microstructure and magnetic,transport,and optical properties of ordered and disordered Ni-25Al alloy thin films[J].Thin Solid Films,2003,441(1-2):255.
[16] 王力衡;黄运添;郑海涛.薄膜技术[M].北京:清华大学出版社,1991:70.
[17] Mayadas A F;Shatzkes M .Electrical-resistivity model for polycrystalline films:The case of arbitrary reflection at external surfaces[J].Phys Rev B1,1970,1(04):1382.
[18] Qiu Hong et al.Effect of deposition rate on structural and electrical properties of Al films deposited on glass by electron beam evaporation[J].Thin Solid Films,2002,414:150.
[19] Murakami M .Thermal strain in lead thin films Ⅱ:Strain relaxation mechanisms[J].Thin Solid Films,1978,55(01):101.
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