采用界面聚合法制备了以石蜡为芯材、聚甲基丙烯酸甲酯为壳层的纳米胶囊相变材料.胶囊的直径为100～400nm,相变焓可达29J/g,封装比率约为35%.采用差示热扫描量热仪(DSC)对PMMA@PCM经40℃、60℃及100℃热处理后相变特性的变化进行了探讨.结果显示,随着热处理时间的延长,相变温度均有所升高.凝固温度的升高是由于胶囊表面形成了一定量的相变晶种,而熔化温度的升高则是由于纳米胶囊体积的增加而引起的热传导率降低.这一研究结果将有助于分析纳米胶囊相变过程的微结构变化理论.
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