研究了Sn-3Ag-0.5Cu-xBi(x=0, 1, 3)/Cu钎焊接头在140和195℃时效过程中的剪切强度变化. 结果表明: 随着时效时间的增加, 界面金属间化合物(IMC)层的厚度逐渐增加; 140℃时效时, Sn-3Ag-0.5Cu接头的剪切强度随时效时间延长变化不大, Bi元素的添加提高了钎焊接头的剪切强度;195℃时效时, 钎焊接头剪切强度均随时效时间延长而下降, Bi元素的添加对接头剪切强度的影响不明显. 剪切断口分析表明: 随着界面化合物层厚度的增加,断裂机制逐渐由韧性断裂变为脆性断裂, 较高剪切强度对应于钎料基体的韧性断裂, 而低剪切强度对应于钎料与界面化合物层之间的脆性断裂.
The effect of Bi on the shear strength for Sn-3Ag-0.5Cu-xBi(x=0,1,3)/Cu solders joints has been studied after being aged at 140℃ and 195℃. The results indicate that fracture type changes from ductile fracture to brittle fracture with the increasing of IMC. Shear strength for Sn3Ag0.5Cu solder joints changes slightly when aged at lower temperature, but increases with the prolonging of the aging time and sharply drop at final by adding of Bi. When aged at higher temperature, shear strength for each kind solder joint decreases with the prolonging of aging time. Although the shear strength is relatively higher by adding Bi, the difference is small. It is seems that Bi can improve the shear strength by strengthening solder and decreasing the growth of IMC.
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