使用硫酸镍作为化学镀镍磷镀液的主盐，直接在AZ91D镁合金基体上化学镀镍.使用扫描电镜和X射线衍射技术分析镀层的表面形貌和组织.化学镀镍磷镀层是致密的，无明显缺陷，其磷含量约为372 mass%.化学镀镍磷镀层的显微硬度值约为660 VHN，化学镀镍的沉积速度为23 μm/h.前处理过程中的酸洗步骤使镁合金基体产生粗糙的表面，从而使镀层和基体之间起到了互锁的作用，增加了镀层的结合力.
Direct electroless Ni-P plating on the AZ91D magnesium alloy from a plating bath containing sulfate nickel was investigated.The morphology and microstructure of the electroless Ni-P coating was studied by using SEM and XRD.The electroless Ni-P coating was compact and no obvious defects.The hardness values of the Ni-P coatings were about 660 VHN and the phosphorus content of this coating was about 3.72 mass%.The deposition rate of the electroless Ni-P alloy was about 23 μm/h.The acid pickle pretreatment on the AZ91D magnesium alloy substrate provides surface pits to act as sites for mechanical interlocki ng to improve adhesion of the coating and the substrate.
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