采用光学显微镜(OM)、扫描电子显微镜(SEM)和能谱仪(EDS)分析了镀层加热过程中的组织变化及镀层的高温氧化性能,并对铝硅镀层的氧化机理进行了分析.结果表明,引起热浸镀铝(铝硅)镀层失效的主要原因是镀层中小孔的形成和生长,小孔形成于与基体接触的最内层合金层之间,随着加热时间的增长,小孔慢慢聚集成孔群,进而形成大的孔洞;镀层高温氧化失效的直接原因是孔洞导致合金层产生微裂纹,氧气通过微裂纹贯穿合金层,使镀层丧失保护作用从而失效;在850℃下,随着硅含量增高,合金层厚度变薄,更容易在合金层中产生微裂纹,抗高温氧化能力减弱.
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