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用环氧树脂低聚物作界面增容剂,熔融挤出法制备了PA66/TLCP共混物.通过拉伸、弯曲等力学性能测试并结合热失重(TG)分析,结果表明:环氧树脂低聚物增容后的共混物力学性能、热稳定性均有显著提高.共混物断面SEM扫描结果表明,由于环氧树脂低聚物界面增容作用,分散相TLCP在基体PA66中的分散性提高并且相畴尺寸减小.加工流变学测试和红外光谱显示,环氧树脂低聚物与基体树脂PA66和分散相TLCP分子在熔融加工过程中原位发生化学反应,环氧树脂低聚物在共混物界面起到"桥"的作用.

参考文献

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