欢迎登录材料期刊网

材料期刊网

高级检索

在Sn-0.7Cu-0.2Ni钎料中添加微量的Ag元素,测试了钎料的熔化温度、热膨胀性能、抗腐蚀性能及其润湿性.结果表明,添加微量的Ag元素降低了Sn-0.7Cu-0.2Ni的熔点,但增加了钎料的熔程.当Ag含量为0.3%(质量分数)时,钎料熔点为224.07℃,熔程为6.1℃.钎料的热膨胀系数随Ag含量的增加而升高.当Ag含量为0.3%(质量分数)时,钎料的热膨胀系数(20~100℃)为1.84×10-5/℃.另外添加Ag元素提高了钎料在HC1溶液中的抗腐蚀性能,同时也提高了钎料在Cu基板上的铺展面积.

参考文献

[1] 沈骏,高后秀,刘永长,韦晨,杨渝钦.冷却速度对Sn-Ag无铅焊料微观组织和机械性能的影响[J].功能材料,2005(01):47-49.
[2] A.A. El-Daly;Farid El-Tantawy;A.E. Hammad .Structural and elastic properties of eutectic Sn-Cu lead-free solder alloy containing small amount of Ag and In[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2011(26):7238-7246.
[3] Rizvi M J;Bailey C;Chan Y C et al.Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder Part Ⅱ.Growth of intermetallic layer with Cu during wetting and aging[J].Journal of Alloys and Compounds,2007,438(1-2):122-128.
[4] A.A. El-Daly;A.E. Hammad .Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and In[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2011(34):8554-8560.
[5] T. H. Chuang;M. W. Wu;S. Y. Chang;S. F. Ping;L. C. Tsao .Strengthening mechanism of nano-Al_(2)O_(3) particles reinforced Sn3.5Ag0.5Cu lead-free solder[J].Journal of Materials Science. Materials in Electronics,2011(8):1021-1027.
[6] 刘思栋,薛烽,周健.P、Ag对Sn—0.5Cu无铅钎料抗氧化性能的影响[C].第七届中国功能材料及其应用学术会议论文集,2010:163-166.
[7] 李广东,史耀武,徐广臣,夏志东,雷永平.P对Sn-Cu无铅钎料性能的影响[J].电子元件与材料,2008(11):50-53.
[8] Yoon J W;Lee Y H;Kim D G et al.J Intermetallic compound layer growth at the interface between Sn-Cu-Ni solder and Cu substrate[J].Journal of Alloys and Compounds,2004,381(1-2):151-157.
[9] Gourlay CM;Nogita K;McDonald SD;Nishimura T;Sweatman K;Dahle AK .A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu[J].Scripta materialia,2006(9):1557-1562.
[10] Guang Zeng;Songbai Xue;Liang Zhang;Lili Gao;Zhongmin Lai;Jiadong Luo .Properties and microstructure of Sn-0.7Cu-0.05Ni solder bearing rare earth element Pr[J].Journal of Materials Science. Materials in Electronics,2011(8):1101-1108.
[11] Jian-Xin Wang;Song-Bai Xue;Zong-Jie Han .Effects of rare earth Ce on microstructures, solderability of Sn-Ag-Cu and Sn-Cu-Ni solders as well as mechanical properties of soldered joints[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2009(1/2):219-226.
[12] Zeng Guang;Xue Songbai;Gao Lili et al.Interfacial microstructure and properties of Sn-0.7Cu-0.05Ni/Cu solder joint with rare earth Nd additionwith[J].Journal of Alloys and Compounds,2011,509(25):7152-7161.
[13] 许天旱,赵麦群,刘新华.Sn-Ag-Cu系无铅焊锡成分的优化研究[J].电子元件与材料,2004(08):14-16,21.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%