针对聚合物多层微流控芯片键合,采用热辅助超声波键合方法实现了4层微流控芯片的键合,搭建了多界面温度测试装置,采用埋置热电偶的方法测试了三个被封接界面的温度场,研究了单独超声波作用和热辅助超声波键合法中各界面的温度并进行了比对.温度测试实验结果表明,在顶层热辅助温度70℃、6μm振幅、30kHz频率、100N超声波焊接压力和25s超声波作用时间下,基于热辅助的多层超声波键合方法可以使各键合界面的温度基本一致,从而实现多层微流控器件的多个界面键合质量一致.本文的研究为聚合物微流控器件的超声波多层键合机理研究提供了有益借鉴.
Using thermal assisted ultrasonic bonding method,four-layer microfluidic chip was bonded.Multi-interface temperaturemeasurement system was established,thermal couples were embedded at the three bonding interface to get the temperature information.Ultrasonic heat and thermal assisted ultrasonic heating experiments were carried out and the results were compared to each other.The experimental results show that when the thermal assisted temperature of the top layer was controlled at 70℃,under the ultrasonic parameters of：6μm of amplitude,30kHz of ultrasonic frequency,100N of ultrasonic bonding force and 25s of ultrasonic time,multi-layer microfluidic chip was successfully bonded.The work is useful to study the mechanism of multi-layer ultrasonic bonding for polymer microfluidic devices.
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