利用化学镀的方法,采用氯化亚锡为敏化剂,以甲醛为还原剂,在石墨粉表面化学镀银,合成C/Ag电接触材料.用X射线衍射、扫描电镜表征了复合粒子的形貌和晶型,研究了敏化剂氯化亚锡、硝酸银浓度、反应时间、反应温度对C/Ag电接触材料形貌和晶型的影响,以及不同还原剂对复合粒子质量的影响.结果表明:采用甲醛为还原剂,经过敏化处理后,当硝酸银浓度为0.4 mol/L时,在65℃反应60 min,合成的C/Ag电接触材料有较好的形貌.
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