The effect of trace Sn on the pitting morphology of high voltage anode aluminum foils was investigated. The distributions of microelement Sn, Fe, Si, Cu and Mg in the surface layer of aluminum foils with different Sn content were determined by using a secondary ion mass spectrometer. It was found that the micro-alloyed Sn is enriched at the external surface. The mechanism of pitting behavior of trace Sn on aluminum surface is similar with that of lead. Enrichment of Sn in the surface layer provides large numbers of sites for initiation of pitting corrosion, while pitting sites appeared relatively inhomogenously in the foils without Sn. Sn, as an eco-friendly microelement, can be applied to replace Pb in improving the homogenous pitting behaviors of high voltage aluminum foils, in which the volume fraction of cube texture is not reduced.
参考文献
| [1] | K.Arai;T.Suzuki .[J].Light Metals,1981,31:675. |
| [2] | R.Bakish;E.Z.Border;R.J.Kornhass .[J].Journal of the Electrochemical Society,1962,109:791. |
| [3] | R.Bakish .[J].Electrochemical Technology,1968,6:192. |
| [4] | Z.Q.Zheng;W.B.Zhang .[J].Journal of Central South Institute of Mining and Metallurgy,1983,1:111. |
| [5] | J.Jeong;C.H.Choi;D.Y.Lee .[J].Journal of Materials Science,1996,31:5811. |
| [6] | Weimin MAO;Lei CHEN;Liman SA;Yongning YU Yunfeng LI .[J].The Chinese Journal of Nonferrous Metals,2004,14:1. |
| [7] | R.B.Diegle .[J].Journal of the Electrochemical Society,1974,121:583. |
| [8] | X.Wu;P.Asoka-Kumar;K.G.Lynn;K.R.Hebert .[J].Journal of the Electrochemical Society,1994,141:3361. |
| [9] | K.Arai;T.Suzuki;T.Atsumi .[J].Journal of the Electrochemical Society,1985,132:1667. |
| [10] | R.B.Diegle .[J].Journal of the Electrochemical Society,1974,121:583. |
| [11] | X.Wu;K.Herbert .[J].Journal of the Electrochemical Society,1996,143:83. |
| [12] | Z.Ashitaka;G.E.Thompson;P.Skeldon;H.Habazaki K.Shimizu .[J].Journal of Materials Science,2001,36:2237. |
| [13] | O.Iwao;A.Mizuno;K.Yamaguchi;M.Mehata .[P].JP 561249,1987. |
| [14] | T.Natori;M.Hosoda;Y.Ishi .[J].IEEE Transactions on Consumer Electronics,1997,47:48. |
| [15] | Jingbo SONG;Weimin MAO;Hong YANG;Huiping FENG .[J].Transactions of Materials and Heat Treatment,2007,32(07):1. |
| [16] | Ping YANG;Zuqing SUN;Weimin MAO .[J].Chinese Journal of Stereology and Image Analysis,2001,6:50. |
| [17] | Zheng WANG;Yongming CAO;Yuesheng LI;Peiyuan FANG .[J].Shanghai Computational Measurement,2003,30:42. |
| [18] | Z. Ashitaka;G. E. Thompson;P. Skeldon;G. C. Wood;K. Shimizu .The behavior of copper and lead during heat-treatment and surface treatment of aluminium capacitor foils[J].Journal of the Electrochemical Society,1999(4):1380-1385. |
| [19] | K.Tada;K.Awaya .[J].Japanese Journal of Institute of Light Metals,2000,50(11):590. |
| [20] | Y.Minamino;T.Yasuda;H.Araki .[J].Defect and Diffusion Forum,1989,66-69:1251. |
| [21] | J.P.Hirsh;J.Lothe.Theory of Dislocations[M].John Wiley and Sons,Inc,1982:838. |
| [22] | J.Scherer;O.M.Magnussen;T.Ebel;R.J.Behm .[J].Corrosion Science,1999,41:51. |
| [23] | W.Lin;G.C.Tu;C.F.Lin;Y.M.Peng .[J].Corrosion Science,1996,38:902. |
| [24] | W.Lin;G.C.Tu;C.F.Lin;Y.M.Peng .[J].Corrosion Science,1997,39:1540. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%