制备了与1Cr17不锈钢热膨胀相匹配的Ca-Al-Si系微晶玻璃,利用流延法将该微晶玻璃制成生瓷带.生瓷带在1Cr17不锈钢板表面热压烧结后形成金属/微晶玻璃复合基板.电气性能测试发现,介质层厚度为72.5μm时,击穿电压为1.26kV,泄漏电流小于0.04mA,满足国标中相关性能的要求.综合考虑到基板轻量化和降低生产成本的需要,本文以5层生瓷带在1Cr17不锈钢板上制备而成的复合基板作为最佳选择.
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