欢迎登录材料期刊网

材料期刊网

高级检索

用座滴法研究了Ag/W在真空,Ar,H_2及3H_2+N_2气氛下的润湿角及其与温度的关系,并进行了表面及界面分析。结果表明,气氛中的氧分压是影响Ag/W润湿角的主要因素。微量的Ni,Cu,Ce元素可以显著提高Ag/W润湿性,使熔点附近的润湿角从69°降低至10°—20°。

The contact angle of liquid Ag with solid W and its temperature dependance were examined by sessile drop method under various atmospheres, e.g.vacuum, Ar, H_2 and cracked NH_3. The O_2 partial pressure in the atmosphere is found to be the major factor. An obvious improvement on the wettability may be made by a trace amount of Ni, Cu or Ce added to liquid Ag. The contact angle near M.P. is then narrowed from 69 to about 10--20 deg.

参考文献

[1]
[2]
[3]
[4]
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%