综述了近年来国内外微电子领域用聚酰亚胺涂层胶的研究进展情况,对非光敏型与光敏型聚酰亚胺涂层胶的化学合成方法及其结构与性能进行了分析和总结,并提出了其今后的发展方向。
The recent development of polyimide coating adhesive for microelectronics at home and abroad was reviewed. The synthetic methods and the relationship between structure and properties of non-photo sensitive and photo sensitive polyimide coating adhesive were analyzed and summarized, and the future development direction was proposed.
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