用电沉积法在低碳钢基体上制备了具有不同调制波长(一个调制波长等于单层Cu膜与单层Ni膜厚度之和)的Cu / Ni金属多层膜,研究了多层膜硬度与其中单层膜厚度之间的关系.结果表明,当膜厚在亚微米范围内时,Cu / Ni多层膜的屈服强度(为硬度值的1/3)与单层膜厚之间符合基于位错塞积模型的Hall-Petch(H-P)关系式;而当单层膜厚小于100 nm时,屈服强度与膜厚的关系偏离了H-P线性关系.基于程开甲等人位错稳定性理论首次对金属多层膜变形行为偏离Hall-Petch关系的现象作了定量解释.
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