为研究非导电胶膜封装的液晶显示屏可靠性,用有限元法分析玻璃覆晶模块的温度及应力场.建立玻璃覆晶模块的三维模型,应用热-力耦合分析的顺序耦合法求解热压健合、卸载冷却过程中的模块翘曲和热应力分布.结果表明,热压键合是近稳态的热过程,凸点附近的玻璃基板和芯片温度一致,非导电胶膜在固化过程中吸收热应力、松弛热应变,玻璃覆晶模块的内部温差小、翘曲量小;卸载冷却是非稳态的热过程,模块中各点的温度相差较大,但随时间而逐渐下降并趋于一致,玻璃覆晶模块的内部温差大、热应力大、翘曲量大.减小热压键合过程中的机械载荷和卸载冷却过程中模块的温差,有利于降低液晶显示屏内部的残余热应力及翘曲.
参考文献
[1] | Un-Byoung Kang;Young-Ho Kim .A New COG Technique Using Low Temperature Solder Bumps for LCD Driver IC Packaging Applications[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2004(2):253-258. |
[2] | Lay Kuan Teh;Chee Cheong Wong;Subodh Mhaisalkar;Kristine Ong;Poi Siong Teo;EE Hua Wong .Characterization of Nonconductive Adhesives for Flip-Chip Interconnection[J].Journal of Electronic Materials,2004(4):271-276. |
[3] | Teh LK;Anto E;Wong CC;Mhaisalkar SG;Wong EH;Teo PS;Chen Z .Development and reliability of non-conductive adhesive flip-chip packages[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2004(0):446-453. |
[4] | H. Yu;S.G. Mhaisalkar;E.H. Wong;G.Y. Khoo .Time-temperature transformation (TTT) cure diagram of a fast cure non-conductive adhesive[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2006(1/2):331-335. |
[5] | Xiaowu Zhang;E. H. Wong;Ranjan Rajoo;Mahadevan K. Iyer;J. F. J. M. Caers;X. J. Zhao .Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives[J].Microelectronics and reliability,2005(7/8):1215-1221. |
[6] | M.J. Rizvi;H. Lu;C. Bailey;Y.C. Chan;M.Y. Lee;C.H. Pang .Role of bonding time and temperature on the physical properties of coupled anisotropic conductive-nonconductive adhesive film for flip chip on glass technology[J].Microelectronic engineering,2008(1):238-244. |
[7] | Kyung-Woon Jang;Woon-Seong Kwon;Myung-Jin Yim;Kyung-Wook Paik .Effects of Silica Filler and Diluent on Material Properties and Reliability of Nonconductive Pastes (NCPs) for Flip-Chip Applications[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2004(3):608-615. |
[8] | Myung Jin Yim;Jinsang Hwang;Kyung Wook Paik .Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications[J].International Journal of Adhesion & Adhesives,2007(1):77-84. |
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