综述了有机溶剂和熔融盐电镀铝的各种镀液配方和施镀情况及相关参数.对这两大体系电镀铝的方法作了比较,探讨了各自的反应机理和特点.还介绍了当前电镀铝的应用及发展前景.
参考文献
| [1] | Couch D E;Brenner A .[J].Journal of the Electrochemical Society,1952,99(06):234. |
| [2] | Dotzer D R.American Electroplator's Society 8th Annual Technical Conference I-2[C]. |
| [3] | Daenen T;Berg J V D;Dijk G V .[J].Transactions of The Institute of Metal Finishing,1984,63:104. |
| [4] | Menzies I A;Salt D B .[J].Transactions of The Institute of Metal Finishing,1965,43:186. |
| [5] | Capuano G A;Davenport W G .[J].Journal of the Electrochemical Society,1971,118(10):1688. |
| [6] | Capuano G A;Davenport W G .[J].Plating,1973,60:251. |
| [7] | Capuano G A;Lafortune R .[J].Plating and Surface Finishing,1977,64:49. |
| [8] | Nayak B;Misra M M .[J].Journal of Applied Electrochemistry,1977,7:45. |
| [9] | 小浦延幸;丸冈恭一 .[J].金属表面技术(日本),1987,38(10):471. |
| [10] | 陈建华 .[J].表面技术,1994,23(04):159. |
| [11] | Safranek W H;Schickner W C;Fraust C L .[J].Journal of the Electrochemical Society,1952,99:53. |
| [12] | Hurley F H;Wier T P .[J].Journal of the Electrochemical Society,1951,98:207. |
| [13] | Osteryoung R A;Robinson J .[J].Journal of the American Chemical Society,1979,101:323. |
| [14] | 高桥节子;秋元菊子;佐伯功 .[J].表面技术,1989,40(04):548. |
| [15] | Wilkes J S;Hussey C L .The Frank J Seiler Research Laboratory Technical Report,January[R].,1982. |
| [16] | Carlin R T;Crawford W;Bersch M .[J].Journal of the Electrochemical Society,1992,139:2720. |
| [17] | Jones S D;Blomgren G E .[J].Journal of the Electrochemical Society,1989,136:424. |
| [18] | Zhao Yuguang;VanderNoot T J .[J].Electrochimica Acta,1997,42(11):1639. |
| [19] | 刘伯生 .[J].表面技术,1991,20(01):1. |
| [20] | 李青.熔融盐电沉积金属及合金[J].电镀与精饰,1998(02):26. |
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