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在150℃下,先用50g/L的氢氧化钠溶液使铜基镀锡材料退镀,再用体积分数为10%的盐酸二次退镀,将两次退镀液分别定容到100 mL,稀释5倍后,用电感耦合等离子体质谱测定退镀液中的铅含量.此方法检出限为1 mg/kg,实际样品分析的相对标准偏差为2.7%,平均回收率为99.9%.该方法能满足欧盟RoHS指令以及食品接触材料中铅含量检测的要求.

Tin deposit on copper substrate was stripped through etching in 50 g/L sodium hydroxide at 150 ℃, then in 10% (volume fraction) hydrochloric acid for secondary stripping. After bringing the two stripping solutions to 100 mL and diluting them by 5 times, lead contents in the solutions were determined by ICP-MS. The method features detection limit of 1 mg/kg, relative standard of 2.7% and average recovery of 99.9%, which meets the requirements of EU RoHS directive and is suitable for the determination of lead in food contact materials.

参考文献

[1] 朱东晖.铜及不锈钢基材上锡/锡-铅合金电镀层的退除[J].电镀与精饰,2004(03):30-32.
[2] 胡光军.常用退镀方法[J].电镀与精饰,1996(01):37.
[3] 黄冬根,章新泉,刘晶磊,姜玉梅,易永,童迎东.ICP-MS测定二氧化钛中杂质元素[C].第十届全国稀土元素分析化学学术报告会论文集,2003:130-134.
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