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通过对P型太阳能发电用单晶硅进行伏安特性测试,检测其在直流脉冲电压下的通电电流,从进电方式和极性选择方面研究了其特殊的电特性,建立了试验的二极管电阻(DR)电路模型,测试发现P型单晶硅具有单向导通性.随后对电阻率2.1 Ω·cm的P型太阳能发电用单晶硅进行了放电切割,分别抓取了单脉冲放电电压、电流波形,进一步研究了电特性极其复杂的P型单晶硅在硅片实际切割过程中展现出来的特殊放电切割特性,发现P型单晶硅的切割电流波形呈"斜坡"式,切割后的硅片表面形貌呈"贝壳" 状.结果表明,进电有效接触面积越大,P型单晶硅材料的极间电阻就越小,切割电流也就越高,同时对于P型单晶硅放电切割宜采用正极性加工.

Researched the special electrical characteristics of P-type mono-crystalline solar silicon under conduction mode and polarity selection through the volt-ampere property test of it which detected the conduction current of it under D.C. pulse voltage, and the circuit model with diode and resistance was created. The test discovered that P-type mono-crystalline silicon had unidirection continuity. Subsequently, P-type mono-crystalline solar silicon with resistivity of 2.1 Ω·cm was cutting and single pulse voltage and current wave was grabbed respectively, which further researched the special discharge cutting properties of P-type mono-crystalline silicon with extremely complicated electrical characteristics in the actual cutting, and found that current wave of P-type mono-crystalline silicon showed "ramped" and silicon wafer after cutting morphology showed "conchoidal". The results show that the interelectrode resistance of P-type mono-crystalline silicon will decrease as the available area of the electricity interface growing, but the current of cutting will increase, and positive polarity machining is suitable for discharge cutting P-type mono-crystalline silicon.

参考文献

[1] 魏奎先,戴永年,马文会,杨斌,于站良.太阳能电池硅转换材料现状及发展趋势[J].轻金属,2006(02):52-56.
[2] 郭浩,丁丽,刘向阳.太阳能电池的研究现状及发展趋势[J].许昌学院学报,2006(02):38-41.
[3] Peter O. Hahn .The 300 mm silicon wafer -- a cost and technology challenge[J].Microelectronic engineering,2001(1/2):3-13.
[4] 邱明波,黄因慧,刘志东,田宗军,汪炜.太阳能硅片制造方法研究现状[J].机械科学与技术,2008(08):1017-1020.
[5] 刘志东,汪炜,田宗军,邱明波,黄因慧.太阳能硅片电火花电解高效切割研究[J].中国机械工程,2008(14):1673-1677.
[6] 刘晋春;陆纪培.特种加工[M].北京:机械工业出版社,1987
[7] X. Song;D. Reynaerts;W. Meeusen;H. Van Brussel .A study on the elimination of micro-cracks in a sparked silicon surface[J].Sensors and Actuators, A. Physical,2001(1/3):286-291.
[8] Hideo Takino;Toshimitsu Ichinohe;Katsunori Tanimoto;Kazushi Nomura;Masanori Kunieda .Contouring of polished single-crystal silicon plates by wire electrical discharge machining[J].Precision Engineering,2007(4):358-363.
[9] Hideo Takino;Toshimitsu Ichinohe;Katsunori Tanimoto;Syuichi Yamaguchi;Kazushi Nomura;Masanori Kunieda .Cutting of polished single-crystal silicon by wire electrical discharge machining[J].Precision Engineering,2004(3):314-319.
[10] W. Y. Peng;Y. S. Liao .Study of electrical discharge machining technology for slicing silicon ingots[J].Journal of Materials Processing Technology,2003(1/3):274-279.
[11] 汪炜,刘志东,田宗军,黄因慧,刘正埙.低电阻率单晶硅电火花/电解复合切割加工表面完整性研究[J].电加工与模具,2007(06):6-10.
[12] 高长水,刘正埙.单晶硅材料电火花加工试验研究[J].电加工与模具,2003(05):46-48.
[13] 邱明波,黄因慧,刘志东,田宗军,汪炜.进电方式对太阳能级硅体电阻影响的基础研究[J].电加工与模具,2008(04):24-28.
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