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以等离子喷涂Al2 O3-13%TiO2陶瓷层为封孔对象,采用溶胶-凝胶法(以TEOS为SiO2的前驱体)制备了一种新型KH-570/SiO2杂化封孔剂,研究了封孔剂中KH-570含量对涂层封孔效果的影响.结果表明:KH-570成功接枝到SiO2表面,形成了KH-570/SiO2有机-无机杂化材料;当TEOS与KH-570的体积比为4:5时,杂化封孔剂的性能优良,其固含量为36.66%,可以获得均匀、无裂纹的膜层,此时涂层中的孔隙率最低,为4.88×10-3%.

参考文献

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