采用循环迭代法研究了以四羟丙基乙二胺(THPED)为配位剂的化学镀铜溶液中Cu(Ⅱ)的主要存在形式.通过循环伏安法,研究了Cu(Ⅱ)的阴极还原反应.研究表明:THPED(以T表示)与Cu(Ⅱ)形成的配合物主要是CuT(OH)_2和CuT_2(OH)_2其浓度分别占总Cu(Ⅱ)浓度的56%和42%.CuT(OH)_2和CuT_2(OH)_2分别在电位-0.7V和-1.2 V左右(均相对于饱和甘汞电极)发生如下不可逆的电化学还原:CuT(OH)_2+2~e-→Cu+T+20H~-和CuT_2(OH)_2+2e~-→Cu+2T+2OH~-.
The main existing form of Cu(Ⅱ) in an electroless copper plating bath with N, N, N', N'-tetrakis (2-hydroxypropyl)ethylenediamine (THPED) as complexing agent and the cathodic reduction reaction of Cu(Ⅱ) were studied by cyclic iterative method and cyclic voltammetry, respectively. The results showed that the main complexes in the bath are CuT(OH)_2 and CuT_2(OH)_2, and their concentrations are 56% and 42% respectively of the total Cu(Ⅱ) amount. The irreversible electrochemical reduction of CuT(OH)_2 and CuT_2(OH)_2 occurring respectively at -0.7 V and -1.2 V (versus saturated calomel electrode) can be expressed as follows: CuT(OH)_2 + 2e~-→ Cu +T+ 2OH~- and CuT_2(OH)_2+ 2e~-→Cu + 2T + 20H~-.
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