{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"通过裂解色谱-质谱、X射线荧光分析分析了<span style=\"color:red\">废</span><span style=\"color:red\">印刷电路板</span><span style=\"color:red\">非金属粉末</span>（简称<span style=\"color:red\">废</span>PCB粉）的基本性质,并研究了<span style=\"color:red\">废</span>PCB粉对<span style=\"color:red\">废</span>聚乙烯基木塑复合材料的增强改性效果。结果表明,<span style=\"color:red\">废</span>PCB粉中含有约33.99%的溴化环氧树脂、约61.26%的短玻璃纤维以及约1.29%的铜。适量的<span style=\"color:red\">废</span>PCB粉对聚乙烯基木塑复合材料的改性效果十分突出,当用20%的PCB粉取代木粉时,可明显改善木塑复合材料的热稳定性、加工性能及力学性能,在拉伸强度、弯曲性能基本保持不变的前提下,复合材料的冲击强度提高了31.5%。","authors":[{"authorName":"王丰","id":"edda31cb-c6ed-4ac5-b6f3-20ffa230a731","originalAuthorName":"王丰"},{"authorName":"何慧","id":"5fb66d21-e47a-45c0-8daa-6d815c088f60","originalAuthorName":"何慧"},{"authorName":"陈继尊","id":"c7e8bcc0-a578-4957-8bc5-33b3c5e6264c","originalAuthorName":"陈继尊"},{"authorName":"贾志欣","id":"1dc116c7-3c7c-4bf5-8c78-0d75b1df4cf8","originalAuthorName":"贾志欣"},{"authorName":"罗远芳","id":"3c22eb98-4e6d-423b-98e4-0bb1728dac14","originalAuthorName":"罗远芳"},{"authorName":"贾德民","id":"fe321a8b-ad9d-49c3-bac4-91fef57a5559","originalAuthorName":"贾德民"}],"doi":"","fpage":"174","id":"ac974ad1-ee1c-4ae7-97a0-d51a44e2a893","issue":"8","journal":{"abbrevTitle":"GFZCLKXYGC","coverImgSrc":"journal/img/cover/GFZCLKXYGC.jpg","id":"31","issnPpub":"1000-7555","publisherId":"GFZCLKXYGC","title":"高分子材料科学与工程"},"keywords":[{"id":"f784fa9c-3775-42df-9593-13783c3a0cf2","keyword":"<span style=\"color:red\">废</span>聚乙烯","originalKeyword":"废聚乙烯"},{"id":"caf99570-b161-423f-a7be-3d1527f816c5","keyword":"<span style=\"color:red\">废</span><span style=\"color:red\">印刷电路板</span><span style=\"color:red\">非金属粉末</span>","originalKeyword":"废印刷电路板非金属粉末"},{"id":"1ca0b49a-9bd8-4aa7-b002-d0174000ea4c","keyword":"木粉","originalKeyword":"木粉"},{"id":"341d5b1f-1237-4a29-9ddc-9283df01a62c","keyword":"木塑复合材料","originalKeyword":"木塑复合材料"}],"language":"zh","publisherId":"gfzclkxygc201208044","title":"<span style=\"color:red\">废</span>PCB粉增强改性聚乙烯基木塑复合材料","volume":"28","year":"2012"},{"abstractinfo":"采用熔融共混方法制备了<span style=\"color:red\">废</span><span style=\"color:red\">印刷电路板</span><span style=\"color:red\">非金属</span>粉/聚丙烯复合材料,并通过<span style=\"color:red\">非金属</span>粉润湿性能和缺口冲击断面形貌观察,分析研究了<span style=\"color:red\">非金属</span>粉添加对聚丙烯复合材料力学性能的影响.结果表明,<span style=\"color:red\">非金属</span>粉可以同时改善<span style=\"color:red\">非金属</span>粉/聚丙烯复合材料的拉伸、弯曲、低温冲击性能,但室温冲击性能降低;其中拉伸强度、拉伸模量、弯曲强度、弯曲模量、低温冲击强度最大增幅分别为16.3%、41.5%、63.5%、100%、45.7%;<span style=\"color:red\">废</span><span style=\"color:red\">印刷电路板</span><span style=\"color:red\">非金属</span>粉可作为聚丙烯的增强增韧填料.","authors":[{"authorName":"郑艳红","id":"21d46613-748f-4fb6-9907-7467461b5c0e","originalAuthorName":"郑艳红"},{"authorName":"沈志刚","id":"674319fa-fe95-4f61-b889-b11215847bbe","originalAuthorName":"沈志刚"},{"authorName":"蔡楚江","id":"49e3b3d0-8716-472c-b4e9-6f014df59677","originalAuthorName":"蔡楚江"},{"authorName":"麻树林","id":"c005bf44-8e49-477d-a8d6-57cb3e940dc4","originalAuthorName":"麻树林"},{"authorName":"邢玉山","id":"c3f0772b-e89e-47fa-b069-414d3425ea5f","originalAuthorName":"邢玉山"},{"authorName":"张越","id":"fca24b75-ec2f-4bf9-a966-9dba6d0ed47e","originalAuthorName":"张越"},{"authorName":"吴晓","id":"e66da7b0-202d-432d-ae07-3639cd4785b8","originalAuthorName":"吴晓"}],"doi":"","fpage":"154","id":"e12aaf0d-5e41-4ad5-a984-407cddda106d","issue":"9","journal":{"abbrevTitle":"GFZCLKXYGC","coverImgSrc":"journal/img/cover/GFZCLKXYGC.jpg","id":"31","issnPpub":"1000-7555","publisherId":"GFZCLKXYGC","title":"高分子材料科学与工程"},"keywords":[{"id":"0ca1a0da-dfc9-491b-9f07-2f17ff2a45df","keyword":"<span style=\"color:red\">废</span><span style=\"color:red\">印刷电路板</span>","originalKeyword":"废印刷电路板"},{"id":"d1530339-7b57-48af-a4e1-2a0f9f2ee104","keyword":"<span style=\"color:red\">非金属</span>粉","originalKeyword":"非金属粉"},{"id":"eab7d903-0eda-44e8-a6ef-c26a91b70c8b","keyword":"填料","originalKeyword":"填料"},{"id":"7e6ddf8f-856c-4491-8afd-aedd329a4ee4","keyword":"复合材料","originalKeyword":"复合材料"},{"id":"bc4b48c5-a36a-4710-aec0-dc57e491b512","keyword":"力学性能","originalKeyword":"力学性能"}],"language":"zh","publisherId":"gfzclkxygc200909042","title":"<span style=\"color:red\">废</span><span style=\"color:red\">印刷电路板</span><span style=\"color:red\">非金属</span>粉填充聚丙烯的实验","volume":"25","year":"2009"},{"abstractinfo":"分别用<span style=\"color:red\">废</span><span style=\"color:red\">印刷电路板</span>(PCB)<span style=\"color:red\">非金属</span>粉、磨碎玻璃纤维作为增强材料.采用熔融共混方法制备了聚丙烯(PP)基复合材料,并通过其力学性能试验和缺口冲击断面、<span style=\"color:red\">废</span>PCB<span style=\"color:red\">非金属</span>粉、磨碎玻璃纤维的形貌观察,分析研究了两种增强材料及表面改性对复合材料力学性能的影响.实验结果表明:<span style=\"color:red\">废</span>PCB<span style=\"color:red\">非金属</span>粉/PP复合材料力学性能得到了明显提高,其中拉伸强度、拉伸模量、弯曲强度和弯曲模量最大增幅分别为28%、41%、86%和133%;<span style=\"color:red\">废</span>PCB<span style=\"color:red\">非金属</span>粉与磨碎玻璃纤维都能作为PP增强填料.但其韧性降低;表面改性对<span style=\"color:red\">废</span>PCB<span style=\"color:red\">非金属</span>粉/PP复合材料力学性能的影响不大,但是对磨碎玻璃纤维/PP复合材料力学性能的影响大;<span style=\"color:red\">废</span>PCB<span style=\"color:red\">非金属</span>粉/PP复合材料综合力学性能高于磨碎玻璃纤维/PP复合材料,可代替磨碎玻璃纤维作为PP基复合材料的增强填料,不仅可以减少环境污染,实现资源再利用,而且大大降低复合材料成本.","authors":[{"authorName":"郑艳红","id":"903506e9-7f0a-4126-b25f-14d686b60ae7","originalAuthorName":"郑艳红"},{"authorName":"沈志刚","id":"80230a5f-e1a1-41c0-815f-c98574906b8d","originalAuthorName":"沈志刚"},{"authorName":"蔡楚江","id":"709919e2-60fe-4c06-af5f-aceb79f18100","originalAuthorName":"蔡楚江"},{"authorName":"麻树林","id":"8323d854-ccea-44c4-b080-80e48f0d8a3c","originalAuthorName":"麻树林"},{"authorName":"邢玉山","id":"c2051f71-1bf0-4e4b-9a88-40726fee282f","originalAuthorName":"邢玉山"}],"doi":"","fpage":"59","id":"bd6ba61b-a1e0-4dca-af54-a1aab2e8d2ac","issue":"2","journal":{"abbrevTitle":"FHCLXB","coverImgSrc":"journal/img/cover/FHCLXB.jpg","id":"26","issnPpub":"1000-3851","publisherId":"FHCLXB","title":"复合材料学报"},"keywords":[{"id":"859cca72-2a19-48f4-ac35-76a1b4fb4b6e","keyword":"<span style=\"color:red\">废</span><span style=\"color:red\">印刷电路板</span>","originalKeyword":"废印刷电路板"},{"id":"e0b3cbc7-82fd-4fb8-85f9-2d8f4f2e62bf","keyword":"<span style=\"color:red\">非金属</span>粉","originalKeyword":"非金属粉"},{"id":"f509b5fa-0e98-4a35-8c0e-568958221b79","keyword":"磨碎玻璃纤维","originalKeyword":"磨碎玻璃纤维"},{"id":"ad23cc41-1365-4400-b77b-3d811fe95022","keyword":"增强","originalKeyword":"增强"},{"id":"15d5a989-7509-4546-9f87-562e0e7ef1eb","keyword":"聚丙烯","originalKeyword":"聚丙烯"}],"language":"zh","publisherId":"fhclxb200902011","title":"<span style=\"color:red\">废</span><span style=\"color:red\">印刷电路板</span><span style=\"color:red\">非金属</span>粉增强及磨碎玻璃纤维增强聚丙烯力学性能","volume":"26","year":"2009"},{"abstractinfo":"目前对<span style=\"color:red\">废</span><span style=\"color:red\">印刷电路板</span>(WPCBs)的资源化利用主要集中在<span style=\"color:red\">金属</span>部分,而对于占整体约60%但处理困难且经济效益相对较低的<span style=\"color:red\">非金属</span>材料部分的资源化和安全处置的研究则相对较少.然而WPCBs中<span style=\"color:red\">非金属</span>材料具有较 高的回收利用价值,完全可以作为再生资源回收.如何处理好当前存在的二次污染及回收利用率低等问题以及寻找高效、简便和绿色的回收利用方法已是<span style=\"color:red\">非金属</span>材料资源化所面临的当务之急.在<span style=\"color:red\">非金属</span>材料的资源化方法中,物理回收法以处理工艺简单、成本低、资源利用率相对较高等优点而具有较大的发展优势,是最符合国内实情的一种资源化方法.","authors":[{"authorName":"蒋英","id":"44abe257-bfb2-464d-9e2a-66dd35e930e2","originalAuthorName":"蒋英"},{"authorName":"郭杰","id":"c3c36c85-0a56-4e98-a71b-7f77650b5a2d","originalAuthorName":"郭杰"},{"authorName":"许振明","id":"fcaa4285-7868-42b3-b0e1-17318e4a47aa","originalAuthorName":"许振明"}],"doi":"","fpage":"133","id":"5c47d48c-820b-4046-9839-496989b9b418","issue":"11","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"15dc823f-1db7-453a-baf7-b5dc2854ebed","keyword":"<span style=\"color:red\">废</span><span style=\"color:red\">印刷电路板</span>","originalKeyword":"废印刷电路板"},{"id":"c2646e8f-516b-4719-8418-b1566ee9a961","keyword":"<span style=\"color:red\">非金属</span>材料","originalKeyword":"非金属材料"},{"id":"8511754d-2138-4091-910e-1b27980001df","keyword":"资源化","originalKeyword":"资源化"},{"id":"9b99315a-ddcd-4329-833a-077417dd80b1","keyword":"物理回收法","originalKeyword":"物理回收法"}],"language":"zh","publisherId":"cldb201111028","title":"废旧<span style=\"color:red\">印刷电路板</span>中<span style=\"color:red\">非金属</span>材料资源化的新进展","volume":"25","year":"2011"},{"abstractinfo":"根据<span style=\"color:red\">印刷电路板</span>上导线的故障因素,采用通电模拟试验和电化学阻抗谱方法,研究了<span style=\"color:red\">印刷电路板</span>上导线在NaCl介质下的腐蚀行为,比较了三种不同涂层的<span style=\"color:red\">电路板</span>上导线的耐腐蚀性能.结果表明:三种<span style=\"color:red\">电路板</span>的耐腐蚀性能虽有差异,但导线的腐蚀行为基本一致;随通电时间延长,高电压导线出现锈点,低电压导线上涂层起泡且导线颜色变暗;高电压导线的腐蚀初期,<span style=\"color:red\">电路板</span>涂层的阻抗值下降.","authors":[{"authorName":"马云","id":"ccfb8087-655e-4862-8a56-0d15ac61ecdb","originalAuthorName":"马云"},{"authorName":"宋玉苏","id":"c0bdf6b4-8f6c-4f70-af49-805ddcd4992e","originalAuthorName":"宋玉苏"}],"doi":"10.3969/j.issn.1000-3738.2008.06.009","fpage":"25","id":"109c2cab-8c8b-49a1-a252-86e559059615","issue":"6","journal":{"abbrevTitle":"JXGCCL","coverImgSrc":"journal/img/cover/JXGCCL.jpg","id":"45","issnPpub":"1000-3738","publisherId":"JXGCCL","title":"机械工程材料"},"keywords":[{"id":"33475df0-341f-4562-bddc-3b93418eb4d7","keyword":"<span style=\"color:red\">印刷电路板</span>","originalKeyword":"印刷电路板"},{"id":"19dd2f01-5657-48e6-9662-4a8847b68d40","keyword":"通电模拟试验","originalKeyword":"通电模拟试验"},{"id":"92a0b62d-d369-4521-bdb4-ad644f183137","keyword":"电化学阻抗谱","originalKeyword":"电化学阻抗谱"},{"id":"f00cf6a3-c5d0-4776-9280-97b33c3ab6bd","keyword":"点蚀","originalKeyword":"点蚀"},{"id":"853a6716-5357-4eab-8da6-7c8bef984ecb","keyword":"起泡","originalKeyword":"起泡"}],"language":"zh","publisherId":"jxgccl200806009","title":"<span style=\"color:red\">印刷电路板</span>上导线的腐蚀行为","volume":"32","year":"2008"},{"abstractinfo":"采用模拟<span style=\"color:red\">印刷电路板</span>缝隙腐蚀装置,发展阵列电极方法测试缝隙内<span style=\"color:red\">电路板</span>表面铜在NaCl溶液中的腐蚀电位,研究了多种因素对其缝隙腐蚀行为的影响.结果表明,缝隙宽度为20～30μm时,<span style=\"color:red\">印刷电路板</span>容易发生缝隙腐蚀;在浸泡初期,缝隙内铜的腐蚀电位随浸泡时间延长负移,但浸泡48 h后,变化趋势较小;溶液中NaCl浓度达到1 mol/L时,对促进<span style=\"color:red\">电路板</span>的缝隙腐蚀作用较为明显;酸性范围内,缝隙内<span style=\"color:red\">电路板</span>腐蚀电位随缝隙大小、浸泡时间、NaCl溶液浓度、溶液的pH值降低而负移;温度低于45℃后,缝隙内铜的腐蚀电位随温度的升高而降低.","authors":[{"authorName":"曲文娟","id":"50736a1b-cac4-4965-bfc8-881afaac0b02","originalAuthorName":"曲文娟"},{"authorName":"杜荣归","id":"d890906a-e8aa-46ba-b5df-e80b399c326d","originalAuthorName":"杜荣归"},{"authorName":"卓向东","id":"9cb33be3-b862-4e65-b60f-4196c14668fa","originalAuthorName":"卓向东"},{"authorName":"林昌健","id":"7cdfa52b-3508-4fdc-bf3f-18402f7f519d","originalAuthorName":"林昌健"}],"doi":"","fpage":"4","id":"8306186d-e30e-4e86-b0a6-a2d49cdd72cf","issue":"2","journal":{"abbrevTitle":"CLBH","coverImgSrc":"journal/img/cover/CLBH.jpg","id":"7","issnPpub":"1001-1560","publisherId":"CLBH","title":"材料保护"},"keywords":[{"id":"56b61ced-3c06-4844-a1b7-bffaebc8245b","keyword":"<span style=\"color:red\">印刷电路板</span>","originalKeyword":"印刷电路板"},{"id":"52035433-aad6-4aed-9490-eba3dca7540b","keyword":"铜","originalKeyword":"铜"},{"id":"c3608204-e01f-4502-a687-c68591eb0d9e","keyword":"缝隙腐蚀","originalKeyword":"缝隙腐蚀"},{"id":"b2b34dd3-9693-4e44-86b0-f1b2b6b91c66","keyword":"阵列电极","originalKeyword":"阵列电极"}],"language":"zh","publisherId":"clbh200802002","title":"<span style=\"color:red\">印刷电路板</span>缝隙腐蚀行为研究","volume":"41","year":"2008"},{"abstractinfo":"为了延长<span style=\"color:red\">印刷电路板</span>的使用寿命，节约资金，充分发掘铑的优异性能，研究了<span style=\"color:red\">印刷电路板</span>镀铑的新工艺。阐述了<span style=\"color:red\">印刷电路板</span>镀铑新工艺的试验结果与应用情况，介绍了该工艺的特点、镀铑影响因素、铑盐的制作方法和镀铑的操作要点及经验，对镀铑工艺应用有较好的实用价值。用本工艺镀覆的产品，镀层具有外观白亮，反光率高，接触电阻小，硬度高、耐磨，耐蚀等优点，满足了生产需求。","authors":[{"authorName":"吴祖昌","id":"6eecd8b4-2bc1-4e65-a260-e49af79264ef","originalAuthorName":"吴祖昌"},{"authorName":"李静波","id":"fee0e067-30a1-45b6-a187-0b75f61cb3ee","originalAuthorName":"李静波"},{"authorName":"朱庚惠","id":"5edf8751-ffbd-4fd9-abd0-ff82035f9f41","originalAuthorName":"朱庚惠"}],"doi":"10.3969/j.issn.1001-1560.2001.05.010","fpage":"24","id":"562de8de-077b-4de5-ae95-afa18ec34a09","issue":"5","journal":{"abbrevTitle":"CLBH","coverImgSrc":"journal/img/cover/CLBH.jpg","id":"7","issnPpub":"1001-1560","publisherId":"CLBH","title":"材料保护"},"keywords":[{"id":"14fab75a-8321-4812-982d-963b47ec9cc4","keyword":"<span style=\"color:red\">印刷电路板</span>","originalKeyword":"印刷电路板"},{"id":"dbc8f1a3-e14c-49ba-b85a-bb84834f64a3","keyword":"镀铑","originalKeyword":"镀铑"},{"id":"b90b078e-af4a-4e97-97b6-07d83213cbf6","keyword":"镀层应力","originalKeyword":"镀层应力"}],"language":"zh","publisherId":"clbh200105010","title":"<span style=\"color:red\">印刷电路板</span>镀铑新工艺的研究与应用","volume":"34","year":"2001"},{"abstractinfo":"镀铑层由于具有各项优异的性能，常用作电子、光学领域的功能及装饰性镀层。通过正交试验优选出一种用于<span style=\"color:red\">印刷电路板</span>的镀铑新工艺。对镀液和镀层的性能进行了测试，并研究了镀液中各成分及操作条件对镀液、镀层性能的影响。此外，还介绍了镀液的配制及维护。","authors":[{"authorName":"吴祖昌","id":"e0339488-a078-4259-9e04-684bc0f157c8","originalAuthorName":"吴祖昌"},{"authorName":"李静波","id":"eccf5778-e500-4871-bdba-3b8414f19cb9","originalAuthorName":"李静波"},{"authorName":"朱庚惠","id":"247b8086-71a2-44cd-8863-6f21db41d444","originalAuthorName":"朱庚惠"}],"doi":"10.3969/j.issn.1004-227X.2001.01.002","fpage":"7","id":"7fa5cade-08e5-4708-b6e2-31c1f9788bcf","issue":"1","journal":{"abbrevTitle":"DDYTS","coverImgSrc":"journal/img/cover/DDYTS.jpg","id":"21","issnPpub":"1004-227X","publisherId":"DDYTS","title":"电镀与涂饰   "},"keywords":[{"id":"f8f1df3b-38d7-4560-baad-df4486021dca","keyword":"镀铑","originalKeyword":"镀铑"},{"id":"19fa93d0-3cc0-4f41-8c52-18835449b5ef","keyword":"<span style=\"color:red\">印刷电路板</span>","originalKeyword":"印刷电路板"}],"language":"zh","publisherId":"ddyts200101002","title":"<span style=\"color:red\">印刷电路板</span>镀铑新工艺的研究","volume":"20","year":"2001"},{"abstractinfo":"结合<span style=\"color:red\">印刷电路板</span>生产流程,介绍化学镀铜自动生产线的工艺特点、工艺流程和工艺技术管理方法;强调在生产过程中遵守工艺制作指示,定期对镀液进行分析、调整及维护,做好生产记录和化验记录的重要性.分析了在生产过程中出现故障的现象和原因,以及影响产品质量的因素.","authors":[{"authorName":"陈世荣","id":"ffe9fc7b-4cd3-4bd5-9e07-cd97fbbea5ef","originalAuthorName":"陈世荣"}],"doi":"10.3969/j.issn.1001-3849.2003.02.004","fpage":"11","id":"9dc7b656-d929-4da6-9afc-cf70f7048e2c","issue":"2","journal":{"abbrevTitle":"DDYJS","coverImgSrc":"journal/img/cover/DDYJS.jpg","id":"20","issnPpub":"1001-3849","publisherId":"DDYJS","title":"电镀与精饰   "},"keywords":[{"id":"b8b7493a-cf7c-42ee-9932-cebbc236c5c4","keyword":"<span style=\"color:red\">印刷电路板</span>","originalKeyword":"印刷电路板"},{"id":"6a18c679-d446-4d75-93f1-0670ec046646","keyword":"化学镀铜","originalKeyword":"化学镀铜"},{"id":"8e5428f0-fc13-47f0-9a73-2b07b6a17293","keyword":"工艺管理","originalKeyword":"工艺管理"}],"language":"zh","publisherId":"ddjs200302004","title":"<span style=\"color:red\">印刷电路板</span>化学镀铜自动线的工艺管理","volume":"25","year":"2003"},{"abstractinfo":"<span style=\"color:red\">印刷电路板</span>换热器是超高温气冷堆等高温能量利用与回收领域中极具潜力的备选强化传热技术之一,本文通过数值模拟方法对典型Z字形<span style=\"color:red\">印刷电路板</span>(PCHE)传热通道的传热和阻力特性开展了相关研究.计算结果表明:层流模型可以较好地获得Z字形PCHE通道的阻力和传热性能,Z字形PCHE通道的阻力系数大于半圆管直通道的阻力系数;当热侧和冷侧通道流体入口温度均不发生改变时,增加两侧流体的质量流量,通道内的阻力系数随之减小,传热效率也稍微减小;当两侧流量及冷侧入口温度均不发生改变时,提高热侧通道入口温度,通道内阻力系数成线性增大,传热效率也随之提高.","authors":[{"authorName":"李磊","id":"a3f91b93-2a64-4024-93d3-930291f9130f","originalAuthorName":"李磊"},{"authorName":"杨剑","id":"f14f7dc0-6754-4c47-b1c6-c5e6a6c4f2ff","originalAuthorName":"杨剑"},{"authorName":"马挺","id":"c500ae2d-5c56-4886-a3ab-7d926f87504c","originalAuthorName":"马挺"},{"authorName":"徐向阳","id":"bc26e796-33f6-4ea2-bffe-8b7b40c93c88","originalAuthorName":"徐向阳"},{"authorName":"曾敏","id":"bced29e3-ded5-4cfd-bff1-4a09a1e08d5a","originalAuthorName":"曾敏"},{"authorName":"王秋旺","id":"654e9132-13fa-489c-a572-9076a034d856","originalAuthorName":"王秋旺"}],"doi":"","fpage":"931","id":"f989c815-cf17-4f4b-9ad5-752156e828ba","issue":"5","journal":{"abbrevTitle":"GCRWLXB","coverImgSrc":"journal/img/cover/GCRWLXB.jpg","id":"32","issnPpub":"0253-231X","publisherId":"GCRWLXB","title":"工程热物理学报   "},"keywords":[{"id":"57cbe970-1a86-4921-af8e-de9ea07d2412","keyword":"<span style=\"color:red\">印刷电路板</span>换热器","originalKeyword":"印刷电路板换热器"},{"id":"6769bd48-c8ab-441e-8a26-aad100286f02","keyword":"传热","originalKeyword":"传热"},{"id":"e8709890-8a6f-4754-8e7a-31547f9a1639","keyword":"阻力","originalKeyword":"阻力"},{"id":"8f984a8a-33e1-4c18-b600-e6a829c6bc17","keyword":"换热效率","originalKeyword":"换热效率"}],"language":"zh","publisherId":"gcrwlxb201405024","title":"<span style=\"color:red\">印刷电路板</span>通道的高温传热和阻力特性研究","volume":"35","year":"2014"}],"totalpage":3340,"totalrecord":33391}