{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"采用<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>法制备了体积分数为30％的SiCp/2024Al复合材料,研究了该复合材料的显微组织结构及力学性能.结果表明,复合材料组织致密,颗粒与基体界面结合状况较好,SiC颗粒在铝基体中基本上分布均匀.经490℃、2h固溶处理和170℃、8h人工时效后,SiCp/2024Al复合材料的抗拉强度、屈服强度和伸长率分别为409 MPa、325 MPa和4.9％,基体中存在大量的纳米析出相为S'(Al2CuMg).随SiC颗粒加入,复合材料力学性能提高,其断裂方式为基体开裂和界面处撕裂.","authors":[{"authorName":"谢敬佩","id":"6ba81641-a8f8-487c-972d-27c9c0e68fb6","originalAuthorName":"谢敬佩"},{"authorName":"王行","id":"04147e98-75a5-4872-9bdd-1e7dbf5671b8","originalAuthorName":"王行"},{"authorName":"王爱琴","id":"2dfb16b7-9df8-4ae0-ad1c-aa53951eccb2","originalAuthorName":"王爱琴"},{"authorName":"郝世明","id":"052b5e0c-f7ba-47de-8e1c-ebccd0c2eadc","originalAuthorName":"郝世明"},{"authorName":"刘舒","id":"361196d4-f584-48c8-b285-0314d02fc703","originalAuthorName":"刘舒"}],"doi":"","fpage":"22","id":"211cd93c-454b-4669-98d0-037c0ff17991","issue":"1","journal":{"abbrevTitle":"CLRCLXB","coverImgSrc":"journal/img/cover/CLRCLXB.jpg","id":"15","issnPpub":"1009-6264","publisherId":"CLRCLXB","title":"材料热处理学报"},"keywords":[{"id":"56f63d93-e747-4438-9415-7ad2252c3bfe","keyword":"铝基复合材料","originalKeyword":"铝基复合材料"},{"id":"e39a9687-07f5-4036-9a33-1bb3184cc9df","keyword":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>","originalKeyword":"真空热压"},{"id":"4bbeb01c-9c35-41cd-b48c-8fc04b6b592c","keyword":"力学性能","originalKeyword":"力学性能"},{"id":"bd82f0de-409f-41e8-86ae-a2e1341c839b","keyword":"显微结构","originalKeyword":"显微结构"},{"id":"c1ea1251-edb5-485a-9a1f-f9e5175d06da","keyword":"断裂机理","originalKeyword":"断裂机理"}],"language":"zh","publisherId":"jsrclxb201501005","title":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>SiCp/2024Al复合材料力学性能与显微结构","volume":"36","year":"2015"},{"abstractinfo":"采用<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>原位合成法制备Al3Ti增强Mg-Al基复合材料。研究了烧结工艺对复合材料显微结构的影响。探讨了Al3Ti的原位合成机制,提出了Ti和Al的微观反应模型。采用XRD、SEM等方法分析了复合材料的相组成及微观结构。结果表明,Mg-Al基复合材料组织致密,原位合成增强相Al3Ti颗粒在基体中均匀分布,尺寸为0.5～2.0μm,与基体界面紧密结合,同时存在少量残余的Ti和中间相Al-Ti。","authors":[{"authorName":"黎慧开","id":"0d13a891-8ea5-49c7-b533-c9b68c1116df","originalAuthorName":"黎慧开"},{"authorName":"刘越","id":"d5ade21c-6208-494c-9763-dc584c483388","originalAuthorName":"刘越"},{"authorName":"王保勇","id":"6f48c497-9e99-44fb-91c8-b3835ffb61e6","originalAuthorName":"王保勇"},{"authorName":"张雅静","id":"76dbf065-6458-4fce-902a-869f11409e83","originalAuthorName":"张雅静"}],"doi":"","fpage":"132","id":"e502b975-55ef-42fb-8b6a-a6d84efcdc6c","issue":"4","journal":{"abbrevTitle":"FHCLXB","coverImgSrc":"journal/img/cover/FHCLXB.jpg","id":"26","issnPpub":"1000-3851","publisherId":"FHCLXB","title":"复合材料学报"},"keywords":[{"id":"78a986be-3e11-43d9-ac37-bfbe29aaee9f","keyword":"Mg-Al基复合材料","originalKeyword":"Mg-Al基复合材料"},{"id":"bc311b9e-efec-4249-af92-d0fe7b1c33f9","keyword":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>","originalKeyword":"真空热压"},{"id":"cee29f36-6766-4c12-a4ca-942bf11aa0ba","keyword":"原位合成","originalKeyword":"原位合成"},{"id":"d2ea733c-1993-460d-9fd8-c033756170be","keyword":"Al3Ti颗粒","originalKeyword":"Al3Ti颗粒"},{"id":"94656026-aa3c-48eb-a45c-54f83fd5b2ab","keyword":"机制","originalKeyword":"机制"}],"language":"zh","publisherId":"fhclxb201204022","title":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>原位Al_3Ti增强Mg-Al基复合材料合成机制","volume":"29","year":"2012"},{"abstractinfo":"采用机械合金化(MA)活化CuCr50粉末,然后对MA粉进行<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>制备出CuCr50触头材料.结果表明,CuCr50 MA粉为亚稳态过饱和固溶体,这种过饱和固溶体在随后的<span style=\"color:red\">热压</span>过程中发生脱溶现象.随脱溶程度的不同,CuCr50块体材料的组织与性能也发生相应的变化.由于MA活化作用,使得CuCr50 MA粉在较低的温度保压较短的时间内便获得了致密度高的块体材料,并且第二相Cr分布均匀,尺寸细小,其综合性能优于其它工艺方法获得的CuCr50触头材料.","authors":[{"authorName":"鲁世强","id":"f9a22c91-f450-4425-a71d-6c2082614485","originalAuthorName":"鲁世强"},{"authorName":"胡春文","id":"6f9c0207-20a1-4127-becc-5f9a4fe51d2d","originalAuthorName":"胡春文"},{"authorName":"李鑫","id":"4fef47cb-0c76-4aac-9134-baee5fc6c600","originalAuthorName":"李鑫"},{"authorName":"王克鲁","id":"8327570d-b0fe-4847-9d88-d8516ec216c3","originalAuthorName":"王克鲁"},{"authorName":"董显娟","id":"74a7e578-f715-480b-8c20-ccfe525e7372","originalAuthorName":"董显娟"},{"authorName":"贺跃辉","id":"a8e95789-e9c9-4ec4-a4c2-9e9b45e496d3","originalAuthorName":"贺跃辉"}],"doi":"","fpage":"1041","id":"5de25c99-f7a4-4819-9e31-68a8323fcde8","issue":"6","journal":{"abbrevTitle":"XYJSCLYGC","coverImgSrc":"journal/img/cover/XYJSCLYGC.jpg","id":"69","issnPpub":"1002-185X","publisherId":"XYJSCLYGC","title":"稀有金属材料与工程"},"keywords":[{"id":"0c745b63-4b97-42b3-bfab-8c36b920bc49","keyword":"机械合金化","originalKeyword":"机械合金化"},{"id":"01f64735-eb71-458e-ac2e-ef540ed5e886","keyword":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>","originalKeyword":"真空热压"},{"id":"24e53b37-cd08-4f6a-afff-661cfe8cf7b9","keyword":"触头材料","originalKeyword":"触头材料"},{"id":"58840872-b436-4c3f-9509-b0f30edd4d33","keyword":"组织与性能","originalKeyword":"组织与性能"}],"language":"zh","publisherId":"xyjsclygc200706024","title":"机械活化<span style=\"color:red\">热压</span>制备CuCr50触头材料的组织与性能","volume":"36","year":"2007"},{"abstractinfo":"采用<span style=\"color:red\">真空</span>单轴<span style=\"color:red\">热压</span>( HUP)方法制备了 Bi2Te3基热电材料.结果表明, HUP试样的密度在原始区熔材料的 97%以上.所有 HUP试样的剪切强度都在 21MPa以上,与区熔 Bi2Te3基材料 (001)解理面的强度相比,提高 4倍左右.电学性能测试发现, HUP试样的电学性能低于区熔试样,其原因被认为主要是由于在材料粉碎和<span style=\"color:red\">热压</span>过程中,有效载流子浓度发生了变化.实验发现,相对于区熔试样, p型 HUP试样的最佳工作温度向低温方向偏移,而 n型 HUP试样的最佳工作温度向高温方向移动. ","authors":[{"authorName":"卢波辉","id":"28007449-97dd-40a5-a40e-3f2f55589030","originalAuthorName":"卢波辉"},{"authorName":"赵新兵","id":"c51eecef-da14-434d-ad39-14ceded2b846","originalAuthorName":"赵新兵"},{"authorName":"倪华良","id":"749b440b-6473-4c36-bab3-841fd017a315","originalAuthorName":"倪华良"},{"authorName":"吉晓华","id":"1d399a3b-dc09-4587-a303-2858af22fcdb","originalAuthorName":"吉晓华"}],"doi":"10.3969/j.issn.1004-244X.2004.03.004","fpage":"13","id":"6a76492d-927d-445a-a142-a6fa8e48abdc","issue":"3","journal":{"abbrevTitle":"BQCLKXYGC","coverImgSrc":"journal/img/cover/BQCLKXYGC.jpg","id":"4","issnPpub":"1004-244X","publisherId":"BQCLKXYGC","title":"兵器材料科学与工程   "},"keywords":[{"id":"f2020d92-48dd-49cb-837a-1f8ec7e9748f","keyword":"半导体材料","originalKeyword":"半导体材料"},{"id":"88129ad2-d99b-4d1d-873a-d27948a68bb4","keyword":"热电材料","originalKeyword":"热电材料"},{"id":"69d8a2bc-c861-4e92-befb-4cbed4c897f9","keyword":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>","originalKeyword":"真空热压"},{"id":"abb822c2-f030-46d1-92b1-66ee904d4f3a","keyword":"Bi2Te3","originalKeyword":"Bi2Te3"},{"id":"e2939137-0c47-41ea-928c-37231a1ff797","keyword":"强度","originalKeyword":"强度"}],"language":"zh","publisherId":"bqclkxygc200403004","title":"<span style=\"color:red\">热压</span>法制备Bi2Te3基热电材料的组织与性能","volume":"27","year":"2004"},{"abstractinfo":"本文在540-640℃温度范闱内,研究了<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>温度对15%(体积分数)SiCp/2009Al复合材料的微观组织和力学性能的影响.复合材料的致密度随<span style=\"color:red\">热压</span>温度升高而增加,在580℃达到最大值,高于580℃时下降.TEM界面观察发现:<span style=\"color:red\">热压</span>温度为540和560℃时复合材料界面结合较弱,界面出现开裂现象;当<span style=\"color:red\">热压</span>温度为580和600℃时界面清洁,结合较好;当温度高于620℃时,复合材料界面有MgAl2O4和Al4C3形成.复合材料的强度和塑性均在580℃取得最佳值.拉伸断口观察发现:<span style=\"color:red\">热压</span>温度低于560℃时,复合材料的断裂以界面脱黏为主;<span style=\"color:red\">热压</span>温度在580-600℃之间时,复合材料以基体的韧性断裂和颗粒的断裂为主;<span style=\"color:red\">热压</span>温度高于620℃时,复合材料界面处MgAl2O4和A14Ca脆性相的形成使界面开裂,复合材料的断裂为基体韧性断裂、界面开裂以及SiC颗粒断裂.","authors":[{"authorName":"金鹏","id":"2e8ae125-f627-4166-a43b-87e7d0a2690e","originalAuthorName":"金鹏"},{"authorName":"肖伯律","id":"7c2e5919-00a4-48e7-937d-cd88a3531825","originalAuthorName":"肖伯律"},{"authorName":"王全兆","id":"e1494045-f5e1-4222-aa18-13eb3bebb583","originalAuthorName":"王全兆"},{"authorName":"马宗义","id":"17a7e102-34ae-43e3-80ff-eae263c24e18","originalAuthorName":"马宗义"},{"authorName":"刘越","id":"17d98b0e-f052-43ed-a41d-cdcd65381f2a","originalAuthorName":"刘越"},{"authorName":"李曙","id":"aa87522a-38bd-4373-a35b-4e69114e367a","originalAuthorName":"李曙"}],"doi":"10.3724/SP.J.1037.2010.00413","fpage":"298","id":"dc4876a2-d391-408c-8652-4acbaee2c160","issue":"3","journal":{"abbrevTitle":"JSXB","coverImgSrc":"journal/img/cover/JSXB.jpg","id":"48","issnPpub":"0412-1961","publisherId":"JSXB","title":"金属学报"},"keywords":[{"id":"d2c90c95-28af-40d4-8e20-c12bd719c0e6","keyword":"铝基复合材料","originalKeyword":"铝基复合材料"},{"id":"1be90525-b160-4e92-a9ce-d942830917ad","keyword":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>","originalKeyword":"真空热压"},{"id":"4d5ae1eb-6d22-45fb-b752-fac1b267ffaa","keyword":"界面","originalKeyword":"界面"},{"id":"4e1fb5af-b75a-44d4-9ce9-b5bda9a7d035","keyword":"力学性能","originalKeyword":"力学性能"}],"language":"zh","publisherId":"jsxb201103007","title":"<span style=\"color:red\">热压</span>烧结温度对SiC颗粒增强铝基复合材料微观组织及力学性能的影响","volume":"47","year":"2011"},{"abstractinfo":"将Cu、Cr、Nb元素粉经25 h机械合金化活化处理后,在1000 ℃保温1 h的工艺下通过<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>来制备新型Cu/Cr2Nb触头材料,研究了不同成分Cu/Cr2Nb触头材料的组织和性能.结果表明,在机械合金化过程中未能合成出Cr2Nb,但在<span style=\"color:red\">热压</span>过程中得到了充分合成和析出,所制备的Cu/Cr2Nb触头材料的组织均匀细小,Cr2Nb相尺寸在几个微米.当Cr2Nb含量(质量分数)为25%～35%时,Cu/Cr2Nb触头材料的致密度与熔渗法和<span style=\"color:red\">热压</span>法制备的常规CuCr50触头材料相当,但前者的硬度和电导率却明显高于后者.","authors":[{"authorName":"鲁世强","id":"2e571942-b72b-4a19-9ac4-2687f2e6755a","originalAuthorName":"鲁世强"},{"authorName":"胡春文","id":"5cb0f30b-a5ed-4abf-b0b9-f5d2c0edb865","originalAuthorName":"胡春文"},{"authorName":"王克鲁","id":"7a35a181-1060-4a71-acc1-2423a589a6da","originalAuthorName":"王克鲁"},{"authorName":"李鑫","id":"13c544f0-8b44-4831-99dc-d0287c4910ed","originalAuthorName":"李鑫"},{"authorName":"肖璇","id":"593858b8-d839-4511-8ee7-1fd023f92054","originalAuthorName":"肖璇"},{"authorName":"贺跃辉","id":"e37ed1ef-885b-4fbd-82b1-07f36a33edc5","originalAuthorName":"贺跃辉"}],"doi":"","fpage":"842","id":"1de38f6b-45cf-47e4-8bdd-ac18cbb53d13","issue":"5","journal":{"abbrevTitle":"XYJSCLYGC","coverImgSrc":"journal/img/cover/XYJSCLYGC.jpg","id":"69","issnPpub":"1002-185X","publisherId":"XYJSCLYGC","title":"稀有金属材料与工程"},"keywords":[{"id":"7581b30f-4abc-4d02-ae65-830d28c20ba0","keyword":"Cu/Cr2Nb触头材料","originalKeyword":"Cu/Cr2Nb触头材料"},{"id":"1d2d659d-2fd4-48fc-bb0c-c801b88c42cd","keyword":"机械合金化","originalKeyword":"机械合金化"},{"id":"662745f3-e52a-4c2c-bc8b-03b1fdbf1867","keyword":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>","originalKeyword":"真空热压"},{"id":"395e50eb-cfc1-44ed-b8ed-596e6c60aab4","keyword":"组织与性能","originalKeyword":"组织与性能"}],"language":"zh","publisherId":"xyjsclygc200905021","title":"机械活化<span style=\"color:red\">热压</span>制备新型Cu/Cr2Nb触头材料的组织与性能","volume":"38","year":"2009"},{"abstractinfo":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>烧结法是最经济、高效地制备ZnS多晶的方法之一.ZnS多晶的红外透过率是衡量材料品质的重要参数.本文运用TEM、XRD和化学分析方法,研究了原料粉末特性和<span style=\"color:red\">热压</span>工艺参数对<span style=\"color:red\">热压</span>ZnS多晶红外透过率的影响,并确定了合理的<span style=\"color:red\">热压</span>工艺参数.运用该方法制备的ZnS多晶6mm厚的试样,8～12μm波段平均红外透过率为66.7%.","authors":[{"authorName":"李玉斌","id":"a97dad3b-d7f4-4d90-8ea6-edfe724df80c","originalAuthorName":"李玉斌"},{"authorName":"徐运生","id":"7acd6340-5faa-4519-8d73-a3db8755419c","originalAuthorName":"徐运生"}],"doi":"10.3969/j.issn.1000-985X.2003.05.021","fpage":"508","id":"3285b82b-f2b8-42f6-8cdb-595ca8356689","issue":"5","journal":{"abbrevTitle":"RGJTXB","coverImgSrc":"journal/img/cover/RGJTXB.jpg","id":"57","issnPpub":"1000-985X","publisherId":"RGJTXB","title":"人工晶体学报"},"keywords":[{"id":"e559a71f-41af-48b8-8145-fdb89f338765","keyword":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>","originalKeyword":"真空热压"},{"id":"57732968-e85e-4614-9c4d-7202d9329fd4","keyword":"红外透过率","originalKeyword":"红外透过率"},{"id":"0f0b00f2-c743-493e-aba9-ee7c0c8338f1","keyword":"ZnS多晶体","originalKeyword":"ZnS多晶体"},{"id":"18b698da-ba38-4d02-8e4b-f1d22b324942","keyword":"8～12μm长波","originalKeyword":"8～12μm长波"}],"language":"zh","publisherId":"rgjtxb98200305021","title":"8～12μm长波红外材料ZnS多晶的制备","volume":"32","year":"2003"},{"abstractinfo":"为了研究<span style=\"color:red\">热压</span>温度和AIN含量对AIN-堇青石玻璃复合材料烧结和介电性能的影响,采用<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>方法在900～1000℃低温烧结制备AIN-堇青石玻璃复合材料,利用X射线衍射、扫描电镜和阻抗分析仪对复合材料的微结构和介电性能进行了研究,结果表明,随着<span style=\"color:red\">热压</span>温度的提高,复合材料的相对密度增加,复合材料的介电常数和介电损耗减少;在一定的<span style=\"color:red\">热压</span>温度下,复合材料的介电常数和介电损耗随着AIN引入量的增加而增加,从复合材料的相组成和结构角度对以上结果予以解释,提高<span style=\"color:red\">热压</span>温度和增加α-堇青石数量均有利于降低复合材料的介电常数和介电损耗,.制备的复合材料具有低的介电常数(5.6～6.5)和低的介电损耗(≤10-3),有望用于微电子封装领域.","authors":[{"authorName":"陈国华","id":"e93c1734-597b-4797-a2de-a1ffe0a78819","originalAuthorName":"陈国华"},{"authorName":"刘心宇","id":"00312800-7e4d-4956-9100-047456797105","originalAuthorName":"刘心宇"}],"doi":"","fpage":"221","id":"11600adf-ff63-4997-aca8-052d01f6673c","issue":"2","journal":{"abbrevTitle":"CLKXYGY","coverImgSrc":"journal/img/cover/CLKXYGY.jpg","id":"14","issnPpub":"1005-0299","publisherId":"CLKXYGY","title":"材料科学与工艺"},"keywords":[{"id":"a277b6ae-103e-40ef-a494-08e08acb9eb7","keyword":"AIN","originalKeyword":"AIN"},{"id":"53e3da5d-6abd-41f4-82f8-fc75ccf7d681","keyword":"堇青石玻璃","originalKeyword":"堇青石玻璃"},{"id":"688be877-2b7e-4588-add0-b4aa1703402e","keyword":"复合材料","originalKeyword":"复合材料"},{"id":"0d5dc970-22f4-4fcb-87b0-449283764f58","keyword":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>","originalKeyword":"真空热压"},{"id":"8935ffa9-5a88-4657-aced-ed50b97a95bb","keyword":"介电性能","originalKeyword":"介电性能"}],"language":"zh","publisherId":"clkxygy200902018","title":"AIN-堇青石玻璃复合材料的介电性能","volume":"17","year":"2009"},{"abstractinfo":"WTi合金具有低的电阻系数、良好的热稳定性能和抗氧化性能,已被成功地应用于半导体器件的扩散阻挡层.迄今为止,中国大量半导体行业用靶材仍从国外进口.因此,通过研究靶材制备工艺及性能的关系,制备出高密度、高纯度、富钛相β1(Ti,W)少的 WTi合金靶材,不仅能够把握相关领域发展方向,并且具有十分可观的市场前景.本文用行星球磨的方式对Ti、W粉末进行预处理及混合,得到不同粒度组成的混合粉末,用<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>法对粉末进行成型,制备得到的 WTi10合金.利用X射线衍射仪(XRD)、金相和扫描电子显微镜(SEM)分析混合粉末的粒度组成,并对合金的结构和形貌进行分析,采用排水法及ICP测试仪,分析合金的密度及杂质含量.结果表明,在温度1200℃,压力30 MPa的<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>条件下,制备得到的4个样品均已形成体心立方β相的WTi固溶体.且混粉球磨时间对 WTi固溶体的峰位及峰强没有影响.但粉末混合球磨时间对<span style=\"color:red\">热压</span>后合金的微观组织形貌影响较大,随着混粉时间的延长,富钛相β1呈先减少后增加的趋势,混粉3 h的<span style=\"color:red\">热压</span>得到的样品黑色富 Ti固溶体相区域最少,性能最优,合金的密度均达到理论密度的99．48％,纯度＞99．97％.采用该方法制备得到的WTi10合金可用于磁控溅射制备 WTi扩散阻挡层.以上研究为<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>法制备半导体行业用钨钛靶材的研究提供一定的基础研究数据.","authors":[{"authorName":"张俊敏","id":"4038a0c5-c84b-4b61-9a3a-e34584c13f60","originalAuthorName":"张俊敏"},{"authorName":"闻明","id":"815b691a-f17c-4017-af8e-29dd16779979","originalAuthorName":"闻明"},{"authorName":"谭志龙","id":"4e1b9e25-47de-41f3-93ee-1f0a50b90039","originalAuthorName":"谭志龙"},{"authorName":"王传军","id":"8867b872-f4d4-4453-ad74-c4b588199a18","originalAuthorName":"王传军"},{"authorName":"沈月","id":"43265f56-a22f-4ba8-889b-b6a806ab39ed","originalAuthorName":"沈月"},{"authorName":"易伟","id":"1aa666c6-41aa-45da-887a-501c4f3cacde","originalAuthorName":"易伟"},{"authorName":"管伟明","id":"b4af7ca3-858c-412f-8ae2-ec820922f073","originalAuthorName":"管伟明"},{"authorName":"李艳琼","id":"a2941693-2bf8-4687-a452-dc190c07cf3e","originalAuthorName":"李艳琼"}],"doi":"10.3969/j.issn.1001-9731.2016.增刊(Ⅱ).025","fpage":"125","id":"a2044ac4-ebce-4991-81a5-7ecd2a56de7d","issue":"z2","journal":{"abbrevTitle":"GNCL","coverImgSrc":"journal/img/cover/GNCL.jpg","id":"33","issnPpub":"1001-9731","publisherId":"GNCL","title":"功能材料"},"keywords":[{"id":"50a1ebd2-05ac-44bf-8daf-6bfa473ef253","keyword":"扩散阻挡层","originalKeyword":"扩散阻挡层"},{"id":"f2098a72-2ba4-46aa-9e95-939b3b1b68da","keyword":"WTi","originalKeyword":"WTi"},{"id":"aec51dd7-9dc7-4595-81ba-e07cf59f4868","keyword":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>","originalKeyword":"真空热压"},{"id":"db2c45af-1672-429d-95be-bce33735a001","keyword":"相组成","originalKeyword":"相组成"},{"id":"58c50c93-3c57-49bb-a6ba-677bf96967ce","keyword":"微观结构","originalKeyword":"微观结构"}],"language":"zh","publisherId":"gncl2016z2025","title":"扩散阻挡层用WT i合金的制备及其表征?","volume":"47","year":"2016"},{"abstractinfo":"以Ti粉、Al粉和CuO粉为原料,通过<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>烧结工艺合成了Al2O3-Al6.1Cu1.2Ti2.7/TiAl复合材料,采用XRD、SEM及力学性能万能实验机分析研究了材料的相组成、微观结构及力学性能.结果表明:经过1000 ℃下<span style=\"color:red\">热压</span>2 h所得样品反应完全,复合材料基体主要由Al6.1Cu1.2Ti2.7与TiAl双相组成,Al2O3颗粒弥散分布于基体晶粒间.当原料配比中CuO含量为10wt%时材料弯曲强度达到最大值273.1 MPa;当CuO含量在14wt%时复合材料断裂韧性达到最大值6.7 MPa·m1/2.由于CuO的掺杂量增加,<span style=\"color:red\">热压</span>所得复合材料基体相组织呈现从块体到层状结构变化,自生Al2O3相呈现出由弥散分布到局部团聚现象变化.","authors":[{"authorName":"杨志波","id":"c876cb47-a8f8-4921-833b-8c8fa56ee473","originalAuthorName":"杨志波"},{"authorName":"王芬","id":"024a4e90-b02b-481c-a87f-6b2dd7bc0224","originalAuthorName":"王芬"},{"authorName":"朱建锋","id":"4eb5fbbe-e7f5-425c-b2d4-6e322a4b4517","originalAuthorName":"朱建锋"},{"authorName":"刘波波","id":"3e3f7526-f7ca-4bc1-b5fb-508399ce5dac","originalAuthorName":"刘波波"}],"doi":"","fpage":"399","id":"8dbefbcd-dc3d-41e8-894d-62a6a3dca427","issue":"2","journal":{"abbrevTitle":"GSYTB","coverImgSrc":"journal/img/cover/GSYTB.jpg","id":"36","issnPpub":"1001-1625","publisherId":"GSYTB","title":"硅酸盐通报   "},"keywords":[{"id":"5448c534-356d-49cf-9e3b-cbaef8f2d8cf","keyword":"TiAl基复合材料","originalKeyword":"TiAl基复合材料"},{"id":"bed696f6-3086-4b60-b16d-24597063bd57","keyword":"氧化铜","originalKeyword":"氧化铜"},{"id":"a29a75f2-a1cb-44b7-b01e-4b19105dbef0","keyword":"<span style=\"color:red\">真空</span><span style=\"color:red\">热压</span>","originalKeyword":"真空热压"},{"id":"412eb3a4-893c-40ad-8cb2-886fcbe284b3","keyword":"力学性能","originalKeyword":"力学性能"},{"id":"fb5dd037-db6e-4a64-844d-7415f52d7f04","keyword":"微结构","originalKeyword":"微结构"}],"language":"zh","publisherId":"gsytb201002028","title":"Ti-Al-CuO系原位反应合成TiAl基复合材料的研究","volume":"29","year":"2010"}],"totalpage":681,"totalrecord":6807}