{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":1,"startPagecode":1},"records":[{"abstractinfo":"以非离子型表面活性剂 Brij-35为稳定剂,以水为溶剂,在常温、常压条件下利用抗坏血酸还原 K2PtCl4制备了 Pt 纳米催化剂,采用透射电子显微镜、能量弥散 X 射线谱、X 射线粉末衍射、热重及循环伏安扫描对催化剂进行了表征.结果表明,所制 Pt 纳米催化剂为尺寸均一的球形分枝结构,平均粒径为36.9 nm,其中每一个 Pt 分枝的直径为2~4 nm,长度为4~6 nm.为去除表面活性剂 Brij-35和副产物,开发了一种简单的多次水洗法以纯化所制 Pt 纳米催化剂.表征结果证明,该法可有效去除表面活性剂和副产物,所得催化剂纯度与商业 Pt 黑(99.9%)相当,且电化学活性比表面积更高,在氧还原反应和甲醇氧化反应中表现出更高的电催化活性.","authors":[{"authorName":"司维峰","id":"507a4ce4-d1a3-44aa-a191-4c7315be018b","originalAuthorName":"司维峰"},{"authorName":"李焕巧","id":"4c7eaf59-83ea-4aef-8de8-3e5f5f33bc05","originalAuthorName":"李焕巧"},{"authorName":"尹杰","id":"c51a97b5-6c08-4827-b891-d4774a3e2372","originalAuthorName":"尹杰"},{"authorName":"李书双","id":"616abd95-100c-480e-aa1a-bf41cc84016f","originalAuthorName":"李书双"},{"authorName":"谢妍","id":"60533e91-9a08-44ab-afe9-a5878c5c017f","originalAuthorName":"谢妍"},{"authorName":"李佳","id":"80457978-a0da-4b87-bc7b-d47aca5d9f35","originalAuthorName":"李佳"},{"authorName":"吕洋","id":"56904e39-ad73-4062-8d2a-db3d294387ba","originalAuthorName":"吕洋"},{"authorName":"刘元","id":"f17db971-d892-469e-b8fa-e3080cca2006","originalAuthorName":"刘元"},{"authorName":"邢永恒","id":"b83583be-0e3a-41d1-ba59-182cca7fdfdc","originalAuthorName":"邢永恒"},{"authorName":"<span style=\"color:red\">徐缓</span>","id":"322a59a4-0aef-4b46-8411-b19c713bb4e9","originalAuthorName":"徐缓"},{"authorName":"宋玉江","id":"0e4aeb9e-12b6-458f-9c12-ac76c0eb0df9","originalAuthorName":"宋玉江"}],"doi":"10.3724/SP.J.1088.2012.20431","fpage":"1601","id":"c919a0fa-43da-4ded-bd5d-381acbf17f1e","issue":"9","journal":{"abbrevTitle":"CHXB","coverImgSrc":"journal/img/cover/CHXB.jpg","id":"18","issnPpub":"0253-9837","publisherId":"CHXB","title":"催化学报   "},"keywords":[{"id":"51ecf5b9-1019-4be5-bcaa-addb957c1c25","keyword":"球形分枝结构","originalKeyword":"球形分枝结构"},{"id":"9e1de042-2188-4a90-8c74-f49e203bdb29","keyword":"电催化活性","originalKeyword":"电催化活性"},{"id":"df256440-9f06-4803-a98f-aeb96fafc8f7","keyword":"表面活性剂","originalKeyword":"表面活性剂"},{"id":"c5d8c1d8-3ddd-4a17-bc74-2d517dbc36d5","keyword":"铂纳米催化剂","originalKeyword":"铂纳米催化剂"},{"id":"5950961f-68f4-4b1e-be84-e6b51feaba15","keyword":"氧还原","originalKeyword":"氧还原"},{"id":"a7c47fa6-ff54-43ad-8c44-62d8f59fd2af","keyword":"甲醇氧化","originalKeyword":"甲醇氧化"}],"language":"zh","publisherId":"cuihuaxb201209025","title":"球形分枝结构Pt纳米催化剂的合成、纯化及电催化性能","volume":"","year":"2012"},{"abstractinfo":"在印制电路板上应用孔线共镀法制作了板δ为1.5mm、d为200 μm的导通孔及线宽、线距均为50 μm的精细线路.研究了图形转移、电镀过程控制对导通孔及精细线路制作质量的影响;对比分析了孔线共镀工艺与减成法工艺在孔线制作上的优劣.结果表明,图形转移中LDI系统图形对位精度高、干膜与覆铜板的结合效果好;控制CuSO4、H2SO4质量浓度分别为70 g/L及190g/L,Jκ为1.5 A/dm2,t为80min及适当溶液搅拌条件下电镀,导通孔深镀能力达60％以上,精细线路与基板结合力强;孔线共镀法较减成法制作效率更高,线路侧蚀量较小.","authors":[{"authorName":"何杰","id":"725bdf41-589e-4b5d-ace4-2e4777896162","originalAuthorName":"何杰"},{"authorName":"何为","id":"074f0553-f796-471d-853d-2aa53ab35af4","originalAuthorName":"何为"},{"authorName":"陈苑明","id":"e93ff94d-47a5-48ef-8e20-4275c7d6b336","originalAuthorName":"陈苑明"},{"authorName":"冯立","id":"fa49f8b1-a62b-4a87-a8a3-41f8541d34a5","originalAuthorName":"冯立"},{"authorName":"<span style=\"color:red\">徐缓</span>","id":"47b8291a-567e-46de-8e79-e007ef9568e3","originalAuthorName":"徐缓"},{"authorName":"周华","id":"c48eb542-24ec-46a1-ac73-37f793188b7f","originalAuthorName":"周华"},{"authorName":"郭茂桂","id":"4b921197-5b5e-4dfc-a645-76c4465c88c5","originalAuthorName":"郭茂桂"},{"authorName":"李志丹","id":"b7cbd035-15fa-41a8-b728-696bc7b9df35","originalAuthorName":"李志丹"}],"doi":"10.3969/j.issn.1001-3849.2013.12.007","fpage":"27","id":"e1c905e3-65ac-4ef4-93cf-03e0310fe527","issue":"12","journal":{"abbrevTitle":"DDYJS","coverImgSrc":"journal/img/cover/DDYJS.jpg","id":"20","issnPpub":"1001-3849","publisherId":"DDYJS","title":"电镀与精饰   "},"keywords":[{"id":"29b52a40-b803-4734-87d4-4c29b3dfbe9a","keyword":"孔线共镀","originalKeyword":"孔线共镀"},{"id":"ef7bc5ec-8db8-46ee-8aa0-cd3c7cec880b","keyword":"导通孔","originalKeyword":"导通孔"},{"id":"16df56e2-a508-4480-9ef6-4e8726f53aee","keyword":"精细线路","originalKeyword":"精细线路"},{"id":"513a02d4-d2d2-47d5-87ea-7e219eeeec96","keyword":"孔金属化","originalKeyword":"孔金属化"},{"id":"c8fc2b68-2f32-4946-a16f-b503413e1188","keyword":"镀铜","originalKeyword":"镀铜"}],"language":"zh","publisherId":"ddjs201312007","title":"印制电路板孔线共镀铜工艺研究","volume":"35","year":"2013"},{"abstractinfo":"研究了一种制备纳米膨胀石墨的新方法,即在经典可膨胀石墨的层间插入爆炸性插层剂,利用微波诱导爆炸性插层剂瞬间释放能量,达到“爆轰”可膨胀石墨的效应,用于制备尺寸更细小的膨胀石墨薄片.利用X-射线能量散射光谱(EDS)分析石墨层间化合物组成,扫描电镜(SEM)、透射电镜(TEM)、原子力显微镜(AFM)和X-射线光电子能谱(XPS)表征纳米膨胀石墨形貌、尺寸和元素组成.结果表明:硝酸铵和高氯酸铵是较良好的爆炸性插层剂,用新方法制备的膨胀石墨薄片,其化学组成、性质、形貌与经典膨胀石墨薄片相似,其大小(长边约3μm,宽边约2μm)显著小于经典膨胀石墨薄片(长边约6μm,宽边为4μm),其厚度(约50nm)与经典膨胀石墨薄片相当.上述结果表明新方法是一种制备更细小膨胀石墨薄片的简便、有效方法.","authors":[{"authorName":"郭菊仙","id":"ac18d819-e07d-4209-9f90-c755f0f2c44a","originalAuthorName":"郭菊仙"},{"authorName":"刘又畅","id":"b4406439-b430-4c34-8bb7-88e4a01a1e7f","originalAuthorName":"刘又畅"},{"authorName":"苏新虹","id":"0a8f618a-1f05-4bd8-8938-e43ad5f701a5","originalAuthorName":"苏新虹"},{"authorName":"<span style=\"color:red\">徐缓</span>","id":"a955a78c-33a4-46ca-bb6a-5924332d38d9","originalAuthorName":"徐缓"},{"authorName":"张翠","id":"653fc657-a604-4c0a-86ed-f0f97df516fd","originalAuthorName":"张翠"},{"authorName":"刘璇","id":"ecd57a9e-ff03-4e0f-b8e8-ff41c2e65244","originalAuthorName":"刘璇"},{"authorName":"陈际达","id":"1793882f-9eec-4d21-ade0-6c0f0b254537","originalAuthorName":"陈际达"}],"doi":"","fpage":"840","id":"34a92ef1-0fab-4d52-83f6-b8d3248b5e74","issue":"6","journal":{"abbrevTitle":"CLKXYGCXB","coverImgSrc":"journal/img/cover/CLKXYGCXB.jpg","id":"13","issnPpub":"1673-2812","publisherId":"CLKXYGCXB","title":"材料科学与工程学报"},"keywords":[{"id":"dcc97336-eb6f-4d9f-b774-68df56456910","keyword":"石墨层间化合物","originalKeyword":"石墨层间化合物"},{"id":"6361e404-c6bc-46fc-8d33-4901bb51ccb1","keyword":"纳米石墨薄片","originalKeyword":"纳米石墨薄片"},{"id":"a01ea705-d76d-431c-9ccc-f38b65be8bad","keyword":"微粒尺寸","originalKeyword":"微粒尺寸"},{"id":"e3543eb1-72d7-4c6b-a525-a61fb671b9ee","keyword":"膨胀石墨","originalKeyword":"膨胀石墨"}],"language":"zh","publisherId":"clkxygc201306014","title":"插层剂对纳米膨胀石墨片尺寸的影响","volume":"31","year":"2013"},{"abstractinfo":"讲述了印制线路板电镀填盲孔带闪镀和不闪镀的工艺流程及其对设备的要求,讨论了影响电镀填盲孔效果的因素,包括设备设计、电镀参数、板材、孔型、镀液组成等.","authors":[{"authorName":"陈世金","id":"4b367574-a3b8-4a6f-94b2-de53fdbc16dd","originalAuthorName":"陈世金"},{"authorName":"<span style=\"color:red\">徐缓</span>","id":"0101f640-2bcc-4e23-9ca4-d6a5ab6a360f","originalAuthorName":"徐缓"},{"authorName":"罗旭","id":"7510722c-a4e0-4187-bdcd-df6efa177afb","originalAuthorName":"罗旭"},{"authorName":"覃新","id":"94941095-9013-47c8-a533-fa0a51edd513","originalAuthorName":"覃新"},{"authorName":"韩志伟","id":"217b6298-cba6-4df6-8e3b-6dcd7c89a13e","originalAuthorName":"韩志伟"}],"doi":"","fpage":"33","id":"12832d6e-8425-4d10-92d4-febf7b6b82bb","issue":"12","journal":{"abbrevTitle":"DDYTS","coverImgSrc":"journal/img/cover/DDYTS.jpg","id":"21","issnPpub":"1004-227X","publisherId":"DDYTS","title":"电镀与涂饰   "},"keywords":[{"id":"d03ffb52-3777-4f5a-b4d0-a43cdd0d5fd5","keyword":"印制线路板","originalKeyword":"印制线路板"},{"id":"ebc86edb-3b34-4830-9f63-ff81fd617d66","keyword":"盲孔","originalKeyword":"盲孔"},{"id":"b0827c02-d311-4167-b1a4-451e4b75d16c","keyword":"填孔","originalKeyword":"填孔"},{"id":"fddda02c-d6aa-4c1b-8094-f8500951f387","keyword":"电镀","originalKeyword":"电镀"},{"id":"65cbaf3a-bea0-485f-8e95-dda960672b67","keyword":"设备","originalKeyword":"设备"},{"id":"d8b4857d-5ec5-47db-8f87-150f6743d989","keyword":"工艺条件","originalKeyword":"工艺条件"}],"language":"zh","publisherId":"ddyts201212010","title":"影响印制线路板电镀填盲孔效果的因素","volume":"31","year":"2012"},{"abstractinfo":"在印制电路板化学镀镍/金过程中，镍、金原子固有的结构特征使镍镀层极易被氧化腐蚀，从而影响镀层的可焊性。从化学镀Ni-P基多元合金，引入纳米粒子和稀土材料，以及化学镀Ni-B合金三方面，介绍了改善印制电路板化学镀镍层耐蚀性的研究现状。对印制电路板化学镀镍耐蚀性的改善方法提出了建议。","authors":[{"authorName":"冯立","id":"c204fe31-b8e5-4ac0-b855-f6bfa19c5af9","originalAuthorName":"冯立"},{"authorName":"何为","id":"b45985f9-f6ce-4804-89ac-b8c0f9dcb13c","originalAuthorName":"何为"},{"authorName":"黄雨新","id":"23766cbb-5c77-422e-98df-6f30026d24f3","originalAuthorName":"黄雨新"},{"authorName":"何杰","id":"0965624e-031b-4494-93b8-2e24387e4581","originalAuthorName":"何杰"},{"authorName":"<span style=\"color:red\">徐缓</span>","id":"a29176c5-0e64-4cc1-b3a9-ccfefa09851c","originalAuthorName":"徐缓"}],"doi":"","fpage":"39","id":"c9065498-cea9-4c5a-8030-3474f6c95b20","issue":"9","journal":{"abbrevTitle":"DDYTS","coverImgSrc":"journal/img/cover/DDYTS.jpg","id":"21","issnPpub":"1004-227X","publisherId":"DDYTS","title":"电镀与涂饰   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