{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"通过<span style=\"color:red\">霉菌</span>实验,研究<span style=\"color:red\">霉菌</span>侵蚀对醇酸树脂涂层外观和性能的影响规律以及百菌清(TPN)的加入对霉变的抑制作用.采用体式显微镜观察涂层长霉情况.扫描电子显微镜、原子力显微镜观察去除<span style=\"color:red\">霉菌</span>后涂层微观形貌.电化学交流阻抗谱法(EIS)研究<span style=\"color:red\">霉菌</span>实验后涂层耐蚀性变化.测试结果显示随<span style=\"color:red\">霉菌</span>实验时间增加,涂层微观表面粗糙度、起伏度增大,<span style=\"color:red\">霉菌</span>生长厚重区域有坑蚀产生,涂层耐蚀性下降.","authors":[{"authorName":"张译轩","id":"35ce7ac6-970a-46c9-9e4b-2e79a04bb44c","originalAuthorName":"张译轩"},{"authorName":"李松梅","id":"cf626c6c-169e-4a81-b9e9-402072871b70","originalAuthorName":"李松梅"},{"authorName":"刘建华","id":"22c5051a-dc8c-44a9-9c66-59f2a8e47167","originalAuthorName":"刘建华"},{"authorName":"于美","id":"4b6281fc-908a-43bf-8e77-f674d639725f","originalAuthorName":"于美"}],"doi":"10.3969/j.issn.1001-9731.2013.10.002","fpage":"1375","id":"ee80cc10-47b1-4571-bc94-09c5c4c9cf37","issue":"10","journal":{"abbrevTitle":"GNCL","coverImgSrc":"journal/img/cover/GNCL.jpg","id":"33","issnPpub":"1001-9731","publisherId":"GNCL","title":"功能材料"},"keywords":[{"id":"d681fb01-7caa-4871-8491-69d272fa2296","keyword":"<span style=\"color:red\">霉菌</span>","originalKeyword":"霉菌"},{"id":"2bc0d5c9-ab2c-4ed6-b3b0-cfb8ca29cc69","keyword":"百菌清","originalKeyword":"百菌清"},{"id":"485d7a10-35f7-461a-99b2-f545dc29cefd","keyword":"醇酸磁漆","originalKeyword":"醇酸磁漆"},{"id":"b56f4558-183e-4025-815b-4b2791bc2356","keyword":"耐蚀性","originalKeyword":"耐蚀性"},{"id":"2e4e8671-4b41-417e-b120-5a52529c944b","keyword":"微观形貌","originalKeyword":"微观形貌"}],"language":"zh","publisherId":"gncl201310002","title":"<span style=\"color:red\">霉菌</span>对醇酸树脂的侵蚀及百菌清的防霉作用研究","volume":"44","year":"2013"},{"abstractinfo":"采用扫描Kelvin探针测试技术研究喷锡处理(Hot air solder level,HASL)印制电路板(Printed circuit board, PCB)在<span style=\"color:red\">霉菌</span>环境下的腐蚀行为;采用通过体视学显微镜、扫描电镜和能谱分析对印制电路板的<span style=\"color:red\">霉菌</span>生长和腐蚀情况进行观察和分析.扫描电镜和能谱结果表明,在湿热环境下,绳状青霉在喷锡处理 PCB 表面具有优先生长特性,表现为簇状菌丝体交织覆盖.PCB表面腐蚀产物脱落,出现漏铜现象.扫描Kelvin探针结果分析表明,喷锡处理PCB表面<span style=\"color:red\">霉菌</span>菌落区域作为腐蚀电池的阴极受到保护,而菌落边缘区域作为阳极发生腐蚀;扫描Kelvin探针测试技术可以用来表征<span style=\"color:red\">霉菌</span>环境下的印制电路板腐蚀行为,表征微区电极反应类型和腐蚀进程.","authors":[{"authorName":"邹士文","id":"1ca908ad-8097-457c-9135-57a3b937f577","originalAuthorName":"邹士文"},{"authorName":"肖葵","id":"1b7380af-df69-433a-9df9-29f772dbb456","originalAuthorName":"肖葵"},{"authorName":"董超芳","id":"467c22c1-a0c2-4c09-b7ea-01d3efc6ae69","originalAuthorName":"董超芳"},{"authorName":"李慧艳","id":"b2f5f5af-66cf-4039-8a2b-673681810369","originalAuthorName":"李慧艳"},{"authorName":"李晓刚","id":"1588d1cd-dc44-442d-ae18-ef3e8b6d2ba7","originalAuthorName":"李晓刚"}],"doi":"","fpage":"809","id":"b7bbc6c8-0f7b-46d5-9996-4dcd00001aa3","issue":"3","journal":{"abbrevTitle":"ZGYSJSXB","coverImgSrc":"journal/img/cover/ZGYSJSXB.jpg","id":"88","issnPpub":"1004-0609","publisherId":"ZGYSJSXB","title":"中国有色金属学报"},"keywords":[{"id":"bbb8de2f-ea2e-40a7-b182-2519381c1151","keyword":"印制电路板","originalKeyword":"印制电路板"},{"id":"08efd65c-4995-472b-add4-db285931a4df","keyword":"<span style=\"color:red\">霉菌</span>","originalKeyword":"霉菌"},{"id":"bc3b6cc6-ff42-4482-963a-85916967c997","keyword":"腐蚀行为","originalKeyword":"腐蚀行为"},{"id":"4e3ec3d4-029d-422d-9553-a27fd794eb58","keyword":"扫描Kelvin探针","originalKeyword":"扫描Kelvin探针"},{"id":"68ea4c6e-2ca2-4df6-89e0-424520897305","keyword":"喷锡处理","originalKeyword":"喷锡处理"}],"language":"zh","publisherId":"zgysjsxb201303030","title":"<span style=\"color:red\">霉菌</span>环境下喷锡处理印制电路板的腐蚀行为","volume":"","year":"2013"},{"abstractinfo":"通过采用<span style=\"color:red\">霉菌</span>实验、扫描电子显微镜(SEM)、原子力显微镜(AFM)、电化学阻抗谱(EIS)等方法与手段研究了<span style=\"color:red\">霉菌</span>侵蚀对A04-60氨基漆表面微观形貌、防护性能等的影响,鉴定了侵蚀菌种.结果表明,导致A04-60氨基漆变质的主要因素是黑曲霉,<span style=\"color:red\">霉菌</span>生长提高了涂层表面粗糙度,表面缺陷不断扩大和深入,使得涂层的阻抗值和防护性能下降.","authors":[{"authorName":"陈丹明","id":"cb3a6416-f646-4399-a170-663896d46127","originalAuthorName":"陈丹明"},{"authorName":"李明","id":"27811d7a-6c79-4123-a42b-d708e58717bf","originalAuthorName":"李明"},{"authorName":"郑兴明","id":"74998274-8f97-49c7-bcca-07e0634d998a","originalAuthorName":"郑兴明"}],"doi":"","fpage":"19","id":"9b2a1651-4dc1-4369-a30a-f55cf63a0640","issue":"1","journal":{"abbrevTitle":"FSXB","coverImgSrc":"journal/img/cover/腐蚀学报封面.jpg","id":"24","issnPpub":"2667-2669","publisherId":"FSXB","title":"腐蚀学报（英文）"},"keywords":[{"id":"f565f4e8-ddbc-48a4-9336-6983a3d210f5","keyword":"<span style=\"color:red\">霉菌</span>","originalKeyword":"霉菌"},{"id":"d7c0bd70-9543-4f00-9aa3-80bfd4cdbe64","keyword":"氨基漆","originalKeyword":"氨基漆"},{"id":"917c0c8d-90e9-49e3-92fd-50e943c8c475","keyword":"侵蚀","originalKeyword":"侵蚀"},{"id":"7d237a6d-428e-4f96-a9ad-ddbaf52a1e34","keyword":"黑曲霉","originalKeyword":"黑曲霉"}],"language":"zh","publisherId":"fskxyfhjs201401004","title":"<span style=\"color:red\">霉菌</span>对A04-60氨基烘干磁漆的侵蚀作用研究","volume":"26","year":"2014"},{"abstractinfo":"采用扫描Kelvin探针测试技术研究了裸铜印制电路板(PCB--Cu)和无电镀镍金处理印制电路板(PCB-ENIG)在<span style=\"color:red\">霉菌</span>作用下的腐蚀行为, 通过体视学显微镜、扫描电镜和能谱分析对PCB的腐蚀和<span style=\"color:red\">霉菌</span>生长情况进行了观察和分析. 结果表明, 在湿热环境下<span style=\"color:red\">霉菌</span>在2种材料表面均能良好生长并且数量逐渐增加, 28 d完成一个生长代谢周期且分生孢子活性良好; 84 d后试样表面都出现了腐蚀产物, PCB--ENIG腐蚀更为严重. <span style=\"color:red\">霉菌</span>的生长代谢作用在一定程度上能抑制PCB--Cu表面<span style=\"color:red\">霉菌</span>生长区域的腐蚀, 但是对PCB--ENIG的微孔腐蚀起促进作用.","authors":[{"authorName":"邹士文","id":"29c5aa1f-755f-48b9-8bdb-975725f498d8","originalAuthorName":"邹士文"},{"authorName":"李晓刚","id":"bc20a31a-fa81-4870-8c26-e735368cf59f","originalAuthorName":"李晓刚"},{"authorName":"董超芳","id":"47e55f4f-a0ea-4f0e-8f4e-44f2f61722d7","originalAuthorName":"董超芳"},{"authorName":"李慧艳","id":"d478e60e-9e42-404c-aaa1-d70e5afc3a5a","originalAuthorName":"李慧艳"},{"authorName":"肖葵","id":"6c796a76-a31b-440d-90c6-46c6fce42259","originalAuthorName":"肖葵"}],"categoryName":"|","doi":"10.3724/SP.J.1037.2012.00033","fpage":"687","id":"197cc367-421d-428c-9e80-e3652629b59d","issue":"6","journal":{"abbrevTitle":"JSXB","coverImgSrc":"journal/img/cover/JSXB.jpg","id":"48","issnPpub":"0412-1961","publisherId":"JSXB","title":"金属学报"},"keywords":[{"id":"c40c8b65-d3e4-4902-b1ea-764e63176b3e","keyword":"<span style=\"color:red\">霉菌</span>","originalKeyword":"霉菌"},{"id":"05d458cb-cba7-4ea2-bc99-b3dd99315c04","keyword":"printed circuit board","originalKeyword":"printed circuit board"},{"id":"54d35e3a-65a8-41d3-88b1-854bbf97b469","keyword":"scanning Kelvin probe","originalKeyword":"scanning Kelvin probe"},{"id":"a7ea149c-4a29-4cf4-a7ab-54e3024a6f44","keyword":"copper","originalKeyword":"copper"}],"language":"zh","publisherId":"0412-1961_2012_6_7","title":"<span style=\"color:red\">霉菌</span>对裸铜和镀金处理的印制电路板腐蚀行为的影响","volume":"48","year":"2012"},{"abstractinfo":"采用扫描Kelvin探针测试技术研究了裸铜印制电路板(PCB-Cu)和无电镀镍金处理印制电路板(PCB-ENIG)在<span style=\"color:red\">霉菌</span>作用下的腐蚀行为,通过体视学显微镜、扫描电镜和能谱分析对PCB的腐蚀和<span style=\"color:red\">霉菌</span>生长情况进行了观察和分析.结果表明,在湿热环境下<span style=\"color:red\">霉菌</span>在2种材料表面均能良好生长并且数量逐渐增加,28d完成一个生长代谢周期且分生孢子活性良好；84d后试样表面都出现了腐蚀产物,PCB-ENIG腐蚀更为严重.<span style=\"color:red\">霉菌</span>的生长代谢作用在一定程度上能抑制PCB-Cu表面<span style=\"color:red\">霉菌</span>生长区域的腐蚀,但是对PCB-ENIG的微孔腐蚀起促进作用.","authors":[{"authorName":"邹士文","id":"fc7d2345-fd4d-4928-bcf3-482d99933fc4","originalAuthorName":"邹士文"},{"authorName":"李晓刚","id":"b97cd612-560a-4264-beb5-56b1ed4a1d76","originalAuthorName":"李晓刚"},{"authorName":"董超芳","id":"2ac3204d-3d5b-452d-ab44-f6aa790ae05e","originalAuthorName":"董超芳"},{"authorName":"李慧艳","id":"39dcbb24-47b5-42cb-91c3-fd7ca4a49373","originalAuthorName":"李慧艳"},{"authorName":"肖葵","id":"62fe5b74-ef4b-4510-8af6-4e45b7ef7f7c","originalAuthorName":"肖葵"}],"doi":"10.3724/SP.J.1037.2012.00033","fpage":"687","id":"2b5a6cd1-e533-4b31-9baf-5386f04a716a","issue":"6","journal":{"abbrevTitle":"JSXB","coverImgSrc":"journal/img/cover/JSXB.jpg","id":"48","issnPpub":"0412-1961","publisherId":"JSXB","title":"金属学报"},"keywords":[{"id":"3d267668-d0cd-47fd-ab25-3ca42b41c3e0","keyword":"<span style=\"color:red\">霉菌</span>","originalKeyword":"霉菌"},{"id":"8bd67350-5e59-46d2-88ab-45e820d9a56e","keyword":"印制电路板","originalKeyword":"印制电路板"},{"id":"c7f1430e-88a8-48c7-bd41-e0577690232b","keyword":"扫描Kelvin探针","originalKeyword":"扫描Kelvin探针"},{"id":"9bd5ead4-39c8-4b55-9c35-5395cd6f7c80","keyword":"Cu","originalKeyword":"Cu"},{"id":"0724c54b-3d1d-4f72-930b-82c563c52d89","keyword":"镀金处理","originalKeyword":"镀金处理"}],"language":"zh","publisherId":"jsxb201206007","title":"<span style=\"color:red\">霉菌</span>对裸铜和镀金处理的印制电路板腐蚀行为的影响","volume":"48","year":"2012"},{"abstractinfo":"描述了<span style=\"color:red\">霉菌</span>对塑料制品的危害,详细介绍了国内外塑料防霉试验标准,对防霉标准中的试验参数如培养方式、测试菌种、接种量、培养温湿度与时间、等级评价等进行了比较分析.","authors":[{"authorName":"王瑞萍","id":"2448db56-86ea-44c1-aae0-d2e6ec1d7cfd","originalAuthorName":"王瑞萍"},{"authorName":"覃红阳","id":"75b4fa23-5ff3-40db-9ef8-ea6239de011c","originalAuthorName":"覃红阳"},{"authorName":"谢宇芳","id":"a59c3dda-a62e-4068-ac6c-f6025a54bf63","originalAuthorName":"谢宇芳"}],"doi":"","fpage":"98","id":"8da15fb3-86ba-4657-8662-0a85935a808c","issue":"3","journal":{"abbrevTitle":"HCCLLHYYY","coverImgSrc":"journal/img/cover/HCCLLHYYY.jpg","id":"42","issnPpub":"1671-5381","publisherId":"HCCLLHYYY","title":"合成材料老化与应用"},"keywords":[{"id":"cf5b8ccc-921a-4e72-b830-966884d7eea2","keyword":"塑料","originalKeyword":"塑料"},{"id":"8a695b9b-b7e6-421d-af30-3c72f2e8fbd1","keyword":"<span style=\"color:red\">霉菌</span>","originalKeyword":"霉菌"},{"id":"d297c0b5-6b30-4d06-b8fa-f075ca8505b5","keyword":"防霉试验标准","originalKeyword":"防霉试验标准"}],"language":"zh","publisherId":"hccllhyyy201503025","title":"塑料防霉性能试验标准比较分析","volume":"44","year":"2015"},{"abstractinfo":"通过检测用培养基和制备漆膜方法的探讨，提高了漆膜耐<span style=\"color:red\">霉菌</span>测定法的真实性、准确性及检测效率。","authors":[{"authorName":"李雄","id":"7348ccc7-779c-4661-af84-64c10e789467","originalAuthorName":"李雄"},{"authorName":"黎晓晖","id":"4e6419ab-bcfc-45bf-9176-0aa387693871","originalAuthorName":"黎晓晖"},{"authorName":"孔慧清","id":"5737f79a-b352-4851-a158-255cf94d9cc0","originalAuthorName":"孔慧清"},{"authorName":"陈锡来","id":"4aa239be-8051-4c24-8d6c-4631ef163627","originalAuthorName":"陈锡来"},{"authorName":"黄俊欢","id":"11eb464c-e300-42c8-8eda-a1409f6d8d8b","originalAuthorName":"黄俊欢"}],"doi":"10.3969/j.issn.0253-4312.2001.04.016","fpage":"41","id":"0fb3f227-ac7f-4de6-a366-d5e0aafa6fb3","issue":"4","journal":{"abbrevTitle":"TLGY","coverImgSrc":"journal/img/cover/TLGY.jpg","id":"61","issnPpub":"0253-4312","publisherId":"TLGY","title":"涂料工业   "},"keywords":[{"id":"5899a0f4-d4a4-464b-a7ce-d6ca6b64ebaf","keyword":"PDA培养基","originalKeyword":"PDA培养基"},{"id":"897962cd-deec-41c8-8107-1c89ded161e1","keyword":"防霉剂","originalKeyword":"防霉剂"},{"id":"80008160-85a9-4caa-ac3e-220996189ed1","keyword":"测定","originalKeyword":"测定"}],"language":"zh","publisherId":"tlgy200104016","title":"漆膜耐<span style=\"color:red\">霉菌</span>测定法","volume":"31","year":"2001"},{"abstractinfo":"采用开路电位测试、电化学交流阻抗和扫描电镜研究了枝孢<span style=\"color:red\">霉菌</span>对A3钢腐蚀的影响.电化学测试的结果表明,枝孢<span style=\"color:red\">霉菌</span>的存在影响了 A3钢的电化学行为.在浸泡的0至7天内无菌体系和枝孢<span style=\"color:red\">霉菌</span>体系的开路电位均先正移后负移,浸泡的第2天和7天时A3钢在有菌体系中的开路电位与相同浸泡天数的无菌体系相比较负,金属表面表现出比无菌体系较高的电化学活性,15天时无菌体系的开路电位基本趋于稳定而枝孢<span style=\"color:red\">霉菌</span>体系中的开路电位则正移25mV左右.交流阻抗测试结果在浸泡的第2,7天与开路电位结果相符,A3钢在枝孢<span style=\"color:red\">霉菌</span>体系中15天时的阻抗值明显小于无菌体系.扫描电镜观察结果表明,15天浸泡试验结束后,无菌体系中A3钢表面发生了龟裂,枝孢<span style=\"color:red\">霉菌</span>体系中试片表面发生了严重的点蚀坑,枝孢<span style=\"color:red\">霉菌</span>的存在改变了A3钢的腐蚀形貌,加剧了A3钢的腐蚀.","authors":[{"authorName":"李松梅","id":"47e5deb8-0799-4fda-af41-6ac0f460e61b","originalAuthorName":"李松梅"},{"authorName":"王彦卿","id":"fdad000d-090f-4d7b-a441-ef75ff98450a","originalAuthorName":"王彦卿"},{"authorName":"刘建华","id":"987418d3-62ad-4030-8851-d36133be4a2c","originalAuthorName":"刘建华"},{"authorName":"梁馨","id":"510c93c1-0817-43d3-a9de-9cdbac9d6cbe","originalAuthorName":"梁馨"}],"doi":"10.3969/j.issn.1001-4381.2008.07.014","fpage":"55","id":"3a176d4e-627d-4807-9456-d57bb018ee28","issue":"7","journal":{"abbrevTitle":"CLGC","coverImgSrc":"journal/img/cover/CLGC.jpg","id":"9","issnPpub":"1001-4381","publisherId":"CLGC","title":"材料工程"},"keywords":[{"id":"c85bef44-631c-4d4c-807f-17fc7290cc15","keyword":"微生物腐蚀","originalKeyword":"微生物腐蚀"},{"id":"6d445552-c2d0-4bd6-b89e-7f7f3ee7bcca","keyword":"枝孢<span style=\"color:red\">霉菌</span>","originalKeyword":"枝孢霉菌"},{"id":"8b757ec8-9dcb-41c0-8c8f-712824b94381","keyword":"交流阻抗","originalKeyword":"交流阻抗"}],"language":"zh","publisherId":"clgc200807014","title":"枝孢<span style=\"color:red\">霉菌</span>对A3钢腐蚀的影响","volume":"","year":"2008"},{"abstractinfo":"利用室内菌落生长速度测定与对峙试验的方法研究了铈对拮抗菌黄绿木<span style=\"color:red\">霉菌</span>(Trichodermaaureoviride)拮抗大豆菌核病菌能力的影响,同时测定了添加铈后黄绿木<span style=\"color:red\">霉菌</span>发酵液抑菌能力的变化.实验结果表明:对黄绿木<span style=\"color:red\">霉菌</span>敏感的硝酸铈含量为240μg/mL,高于1200μg/mL的硝酸铈含量可完全抑制黄绿木<span style=\"color:red\">霉菌</span>的生长,低于390μg/mL的硝酸铈浓度可刺激黄绿木<span style=\"color:red\">霉菌</span>的生长;而大豆核盘菌对硝酸铈的敏感浓度高于黄绿木<span style=\"color:red\">霉菌</span>,为420μg/mL,在1200μg/mL的浓度下还未完全抑菌.硝酸铈的添加对黄绿木<span style=\"color:red\">霉菌</span>拮抗大豆菌核病菌(Sclerotinia sclerotiorum)无影响,对峙培养抑菌率可达100%;不同硝酸铈浓度的发酵液抑制菌核菌的中浓度不同,低浓度下可促进抑菌作用的发挥.","authors":[{"authorName":"孙冬梅","id":"ac5bb3bf-4ebf-4027-af4d-90a50299b1b3","originalAuthorName":"孙冬梅"},{"authorName":"杨谦","id":"5b333e93-9bfe-49e2-af6d-d1dc512db75d","originalAuthorName":"杨谦"},{"authorName":"宋金柱","id":"82cb8173-ad98-40a5-a376-f20ebeb5babe","originalAuthorName":"宋金柱"}],"doi":"10.3969/j.issn.1004-0277.2005.06.017","fpage":"65","id":"9296660c-4b15-45b9-aafe-117c19301e28","issue":"6","journal":{"abbrevTitle":"XT","coverImgSrc":"journal/img/cover/XT.jpg","id":"65","issnPpub":"1004-0277","publisherId":"XT","title":"稀土"},"keywords":[{"id":"0c0608b1-76fe-47a7-a408-b94eb308c152","keyword":"铈","originalKeyword":"铈"},{"id":"1f53c633-1b0f-409c-b2f8-7d523cb79478","keyword":"黄绿木<span style=\"color:red\">霉菌</span>","originalKeyword":"黄绿木霉菌"},{"id":"c917a914-5410-4ee7-b315-cd7aa6bd775e","keyword":"大豆菌核病菌","originalKeyword":"大豆菌核病菌"},{"id":"14c3db79-1c6c-45bd-8b40-fc870270731f","keyword":"拮抗","originalKeyword":"拮抗"}],"language":"zh","publisherId":"xitu200506017","title":"铈对黄绿木<span style=\"color:red\">霉菌</span>拮抗大豆菌核病菌能力的影响","volume":"26","year":"2005"},{"abstractinfo":"考察不同剂量重离子束对北里链<span style=\"color:red\">霉菌</span>的致死及诱变效应,可确定最有利于筛选高产菌株的重离子束辐照剂量.利用不同剂量的重离子束辐照北里链<span style=\"color:red\">霉菌</span>孢子,统计了存活率、致死率、正负突变率.结果发现,在5 Gy重离子辐照时北里链<span style=\"color:red\">霉菌</span>出现较高致死率,其后随剂量升高,致死率变化较平缓.各辐照剂量下正负突变率相比较,40 Gy时正突变率最高,负突变率相对较低,存活率为0.92%.因此确定40 Gy是对北里链<span style=\"color:red\">霉菌</span>高产菌株筛选最有利的辐照剂量.","authors":[{"authorName":"刘敬","id":"cf2c8701-ecc7-436a-af12-af54430dda97","originalAuthorName":"刘敬"},{"authorName":"陈积红","id":"61d49d46-6fdb-457a-a232-49b787f1fb3a","originalAuthorName":"陈积红"},{"authorName":"胡伟","id":"01177876-1ef1-491a-bc77-472452f610b0","originalAuthorName":"胡伟"},{"authorName":"王曙阳","id":"ff14707f-38e7-4aaa-8711-8845f8ef2d96","originalAuthorName":"王曙阳"},{"authorName":"李文建","id":"9d4d2e92-a91d-48c1-abe6-5540b5eca669","originalAuthorName":"李文建"}],"doi":"","fpage":"215","id":"85110290-2c98-409b-8cc6-f931ac781c36","issue":"2","journal":{"abbrevTitle":"YZHWLPL","coverImgSrc":"journal/img/cover/YZHWLPL.jpg","id":"78","issnPpub":"1007-4627","publisherId":"YZHWLPL","title":"原子核物理评论   "},"keywords":[{"id":"672bf150-e9ad-4fec-9639-b85753cf89fb","keyword":"重离子","originalKeyword":"重离子"},{"id":"d6c1f650-a61e-4eee-8c62-e5eab608fa09","keyword":"剂量","originalKeyword":"剂量"},{"id":"be098191-774a-4be3-8bd8-fb1f1ac1e5bc","keyword":"诱变","originalKeyword":"诱变"},{"id":"04c45d23-3cc4-4869-85ff-635f2d18586c","keyword":"北里链<span style=\"color:red\">霉菌</span>","originalKeyword":"北里链霉菌"}],"language":"zh","publisherId":"yzhwlpl201102014","title":"重离子束对北里链<span style=\"color:red\">霉菌</span>的诱变效应","volume":"28","year":"2011"}],"totalpage":7,"totalrecord":64}