{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"利用直流电弧等离子体法成功制备了分散性较好的纳米链状<span style=\"color:red\">Ag-Cu-In-Sn</span>合金粉末.用X射线衍射(XRD)、透射电镜(TEM)和差示扫描量热分析(DSC)等手段对粉末的结构、粒度和热性能进行了表征.研究结果表明:通过优化工艺可制备粒度分布均匀,产率较高,平均粒度在45.03 nm的<span style=\"color:red\">Ag-Cu-In-Sn</span>合金粉末.该粉末具有独特的热性能,与微米合金粉末的熔点相比,其熔点下降了近160℃.","authors":[{"authorName":"颜秀文","id":"cb6924fc-ab3f-44bb-a328-454c5c1b00cc","originalAuthorName":"颜秀文"},{"authorName":"丘泰","id":"d3e49129-192d-4b66-b10f-828cac4c14bb","originalAuthorName":"丘泰"},{"authorName":"李良峰","id":"da7adc99-6d73-4631-8425-0331e1e8cc25","originalAuthorName":"李良峰"},{"authorName":"张振忠","id":"43b62b43-2f03-4264-90f9-d117e95a104a","originalAuthorName":"张振忠"}],"doi":"","fpage":"330","id":"4f5079f0-7107-4f30-a122-647d20be8643","issue":"2","journal":{"abbrevTitle":"XYJSCLYGC","coverImgSrc":"journal/img/cover/XYJSCLYGC.jpg","id":"69","issnPpub":"1002-185X","publisherId":"XYJSCLYGC","title":"稀有金属材料与工程"},"keywords":[{"id":"0d32c4b9-3a07-478f-99d2-6f76ab3cca36","keyword":"<span style=\"color:red\">Ag-Cu-In-Sn</span>","originalKeyword":"Ag-Cu-In-Sn"},{"id":"9d8992a6-9656-4cc5-8e09-11faab9a47f6","keyword":"热分析","originalKeyword":"热分析"},{"id":"e9d362f0-801f-4ab4-bddb-c79dc3f62834","keyword":"直流电弧等离子体","originalKeyword":"直流电弧等离子体"}],"language":"zh","publisherId":"xyjsclygc200802032","title":"纳米<span style=\"color:red\">Ag-Cu-In-Sn</span>合金粉末的制备及其热分析","volume":"37","year":"2008"},{"abstractinfo":"<span style=\"color:red\">Ag-Cu-In-Sn</span>系合金钎料,熔化温度在557～693℃之间,适合于电真空、半导体及微电子器件在真空或保护气氛中无钎剂中温钎焊.对In+<span style=\"color:red\">Sn</span>含量为20%的<span style=\"color:red\">Ag-Cu-In-Sn</span>合金,采用强制大变形热挤压开坯的方式,得到了0.1 mm以下的薄带钎料.通过金相观察、SEM、XRD及拉伸力学试验对钎料的金相组织、相结构、熔化温度及力学性能进行了分析测试.结果表明:对In+<span style=\"color:red\">Sn</span>含量为20%的<span style=\"color:red\">Ag-Cu-In-Sn</span>合金钎料,采用强制大变形热挤压开坯,可得到0.1 mm以下的薄带钎料,成材率达到60%以上;<span style=\"color:red\">Ag-Cu-In-Sn</span>合金主要由具有面心立方结构的富<span style=\"color:red\">Ag</span>的α相和具有复杂结构富<span style=\"color:red\">Cu</span>的β相,及少量的<span style=\"color:red\">Cu41Sn</span>11、<span style=\"color:red\">Ag</span>3 In、CuSn等中间相化合物组成;材料的抗拉强度高达495 MPa;材料的断裂机制为微孔聚集型断裂,微观组织中有明显的韧窝存在.","authors":[{"authorName":"甘卫平","id":"30d55cba-2410-47d4-9134-c11be2ac4d21","originalAuthorName":"甘卫平"},{"authorName":"陈慧","id":"4a1d9eb7-4e72-46d4-b0ce-1efacd362f59","originalAuthorName":"陈慧"},{"authorName":"杨伏良","id":"fd202acf-b279-4540-ac84-f0633b44e8e8","originalAuthorName":"杨伏良"}],"doi":"","fpage":"156","id":"a6beb878-804f-4e56-8b64-e624fb2e858b","issue":"3","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"220e7f85-fe07-4579-8ceb-8876384e00ed","keyword":"中温钎料","originalKeyword":"中温钎料"},{"id":"2fa69ac8-d3b9-4c05-95d3-f7063615d7bd","keyword":"挤压","originalKeyword":"挤压"},{"id":"213a0e9c-960a-4c5f-92ad-0100d4c9ca5b","keyword":"微观组织","originalKeyword":"微观组织"},{"id":"ed7c3ba1-83dc-46b9-8767-ef8f2be3acc1","keyword":"力学性能","originalKeyword":"力学性能"}],"language":"zh","publisherId":"cldb200703043","title":"<span style=\"color:red\">Ag-Cu-In-Sn</span>钎料加工工艺的研究","volume":"21","year":"2007"},{"abstractinfo":"A Series of experiments have been designed to investigate the effect of different space positions between liquid <span style=\"color:red\">Ag-Cu-Sn</span> alloy drop and iron substrates on the liquid/solid interfacial morphologies by a sessile drop method. The results show that <span style=\"color:red\">Ag-Cu-Sn</span> alloy diffuses into the solid iron substrate, and the amounts are greater and the distances are longer when it diffuses into the lower substrate than that into the upper one. Moreover, there are many primary alpha-Fe dendrites in the liquid <span style=\"color:red\">Ag-Cu-Sn</span> alloy close to the upper substrate of liquid bridge or the surface of metal drop. That is due to the effect of gravity.","authors":[],"categoryName":"|","doi":"","fpage":"1463","id":"d3c3f38d-c519-40aa-aed9-bbdbe06eb5ae","issue":"16","journal":{"abbrevTitle":"CSB","id":"93e93b22-e268-4660-889e-9c13ce861f8e","issnPpub":"1001-6538","publisherId":"CSB","title":"Chinese Science Bulletin"},"keywords":[{"id":"d4caf1d1-7146-4261-88ef-87eb2138adc3","keyword":"liquid/solid interface;diffusion;alpha-Fe dendrite;wettability","originalKeyword":"liquid/solid interface;diffusion;alpha-Fe dendrite;wettability"}],"language":"en","publisherId":"1001-6538_1999_16_1","title":"Interfacial morphologies between iron and <span style=\"color:red\">Ag-Cu-Sn</span> alloy","volume":"44","year":"1999"},{"abstractinfo":"研究了热-剪切循环条件下<span style=\"color:red\">Sn-3.5Ag-0.5Cu</span>钎料/<span style=\"color:red\">Cu</span>界面的显微结构,分析了界面金属间化合物的生长行为,并与恒温时效后的<span style=\"color:red\">Sn-3.5Ag-0.5Cu</span>/<span style=\"color:red\">Cu</span>界面进行了对比.结果表明:恒温时效至100 h,<span style=\"color:red\">Sn-3.5Ag-0.5Cu</span>/<span style=\"color:red\">Cu</span>界面上已形成<span style=\"color:red\">Cu6Sn</span>5和<span style=\"color:red\">Cu3Sn</span>两层金属间化合物;而热-剪切循环至720周<span style=\"color:red\">Sn-3.5Ag-0.5Cu</span>/<span style=\"color:red\">Cu</span>界面上只存在<span style=\"color:red\">Cu6Sn</span>5金属间化合物层,无<span style=\"color:red\">Cu3Sn</span>层生成,在界面近域的钎料内,颗粒状的<span style=\"color:red\">Ag3Sn</span>聚集长大成块状;在热-剪切循环和恒温时效过程中,界面金属间化合物的形态初始都为扇贝状,随着时效时间的延长逐渐趋于平缓,最终以层状形式生长.","authors":[{"authorName":"王烨","id":"c0cf369a-0818-4aea-9eeb-1d152d20df9b","originalAuthorName":"王烨"},{"authorName":"黄继华","id":"e1dd1ea4-078d-4f99-9e4d-bd42cf7d794e","originalAuthorName":"黄继华"},{"authorName":"张建纲","id":"cb3b419c-8d4f-405c-a90d-1611a89049e4","originalAuthorName":"张建纲"},{"authorName":"齐丽华","id":"c1506cd5-547d-41ee-a829-2d327a8c8513","originalAuthorName":"齐丽华"}],"doi":"","fpage":"495","id":"92101fa4-1d32-45a2-904f-e1c7664ce454","issue":"3","journal":{"abbrevTitle":"ZGYSJSXB","coverImgSrc":"journal/img/cover/ZGYSJSXB.jpg","id":"88","issnPpub":"1004-0609","publisherId":"ZGYSJSXB","title":"中国有色金属学报"},"keywords":[{"id":"d4e85fe6-84df-47b9-8e37-86c421a17f77","keyword":"热-剪切循环","originalKeyword":"热-剪切循环"},{"id":"99f61ef8-8840-4b97-9821-e9b871544208","keyword":"恒温时效","originalKeyword":"恒温时效"},{"id":"e2df0df1-3073-4b44-93d6-82c3cb9f9757","keyword":"<span style=\"color:red\">Sn-3.5Ag-0.5Cu</span>/<span style=\"color:red\">Cu</span>界面","originalKeyword":"Sn-3.5Ag-0.5Cu/Cu界面"},{"id":"d09936aa-5186-44d6-8797-4abcea33abec","keyword":"金属间化合物","originalKeyword":"金属间化合物"}],"language":"zh","publisherId":"zgysjsxb200603019","title":"<span style=\"color:red\">Sn-3.5Ag-0.5Cu</span>/<span style=\"color:red\">Cu</span>界面的显微结构","volume":"16","year":"2006"},{"abstractinfo":"In the current study, the interfacial microstructures of <span style=\"color:red\">Sn-Ag</span>/<span style=\"color:red\">Cu</span>-X alloy (X = <span style=\"color:red\">Ag</span>, <span style=\"color:red\">Sn</span> or Zn) couples were investigated. The experimental results confirm that addition of <span style=\"color:red\">Ag</span> or Zn can effectively suppress the growth of the <span style=\"color:red\">Cu</span>(3)<span style=\"color:red\">Sn</span> layer, while addition of <span style=\"color:red\">Sn</span> accelerates the growth of the <span style=\"color:red\">Cu</span>(3)<span style=\"color:red\">Sn</span> layer. Meanwhile, the formation of voids is effectively suppressed by alloying the <span style=\"color:red\">Cu</span> substrate. The disappearance of voids and the absence of the <span style=\"color:red\">Cu</span>(3)<span style=\"color:red\">Sn</span> layer were well explained in terms of the phase diagram and the diffusion flux: the <span style=\"color:red\">Cu</span>(3)<span style=\"color:red\">Sn</span> phase is a nonequilibrium phase based on the <span style=\"color:red\">Sn-Cu</span>-Zn ternary phase diagram, since a high-Zn region is formed at the <span style=\"color:red\">Cu</span>(6)<span style=\"color:red\">Sn</span>(5)/<span style=\"color:red\">Cu</span>-Zn alloy interface; in addition, the high <span style=\"color:red\">Sn</span> diffusion flux in the <span style=\"color:red\">Cu</span>(6)<span style=\"color:red\">Sn</span>(5) can suppress the growth of <span style=\"color:red\">Cu</span>(3)<span style=\"color:red\">Sn</span> and the formation of voids.","authors":[],"categoryName":"|","doi":"","fpage":"1542","id":"20725c28-5f9d-4a41-83c5-f5c4312fedb4","issue":"7","journal":{"abbrevTitle":"JOEM","id":"62aa74b6-b846-4747-bf80-d35bdc65d26f","issnPpub":"0361-5235","publisherId":"JOEM","title":"Journal of Electronic Materials"},"keywords":[{"id":"6e8764e5-2f77-42a4-a497-b5895f395fdb","keyword":"<span style=\"color:red\">Cu</span>(3)<span style=\"color:red\">Sn</span>;void;<span style=\"color:red\">Cu</span> alloys;intermetallic compound (IMC);interfacial;reaction;free solders;mechanisms;diffusion;strength;joints","originalKeyword":"Cu(3)Sn;void;Cu alloys;intermetallic compound (IMC);interfacial;reaction;free solders;mechanisms;diffusion;strength;joints"}],"language":"en","publisherId":"0361-5235_2011_7_1","title":"Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in <span style=\"color:red\">Sn</span>-4 wt.%<span style=\"color:red\">Ag</span>/<span style=\"color:red\">Cu</span>-X (X = Zn, <span style=\"color:red\">Ag</span>, <span style=\"color:red\">Sn</span>) Couples","volume":"40","year":"2011"},{"abstractinfo":"运用莱卡显微镜、X射线衍射仪等仪器设备,研究添加元素Zn对<span style=\"color:red\">Sn3.5Ag0.5Cu</span>钎料组织性能的影响.结果表明:Zn与<span style=\"color:red\">Ag</span>、<span style=\"color:red\">Cu</span>形成AgZn和CuZn3化合物,能显著细化<span style=\"color:red\">Sn3.5Ag0.5Cu</span>钎料组织,降低<span style=\"color:red\">Sn3.5Ag0.5Cu</span>钎料合金的润湿性,同时可提高<span style=\"color:red\">Sn3.5Ag0.5Cu</span>钎料合金抗拉强度.","authors":[{"authorName":"吴敏","id":"46f10df6-1892-434b-bb3d-16bcf6c84b97","originalAuthorName":"吴敏"}],"doi":"10.3969/j.issn.1005-8192.2007.01.009","fpage":"30","id":"78362728-9ad9-44f8-b68b-966a103c6750","issue":"1","journal":{"abbrevTitle":"JSGNCL","coverImgSrc":"journal/img/cover/JSGNCL.jpg","id":"46","issnPpub":"1005-8192","publisherId":"JSGNCL","title":"金属功能材料"},"keywords":[{"id":"a6953f1a-aaec-4010-8f77-649a5e52d766","keyword":"钎料","originalKeyword":"钎料"},{"id":"9a74510d-bbb4-4dd0-9ede-9490ab4b1c2a","keyword":"<span style=\"color:red\">Sn3.5Ag0.5Cu</span>","originalKeyword":"Sn3.5Ag0.5Cu"},{"id":"4fbabc43-1f27-4923-94c7-0e02a12fae9e","keyword":"锌","originalKeyword":"锌"},{"id":"bfd00fef-1dcd-4bcf-8c24-2552bc4bf2b2","keyword":"组织","originalKeyword":"组织"},{"id":"7fb74f96-4bb3-481d-a652-034599674352","keyword":"性能","originalKeyword":"性能"}],"language":"zh","publisherId":"jsgncl200701009","title":"锌对<span style=\"color:red\">Sn3.5Ag0.5Cu</span>钎料组织性能的影响","volume":"14","year":"2007"},{"abstractinfo":"短.<span style=\"color:red\">Ag3Sn</span>和<span style=\"color:red\">Cu6Sn</span>5可强化基体,提高(-<span style=\"color:red\">Sn</span>基体的抗压入蠕变性能.","authors":[{"authorName":"曾明","id":"e7d43d1b-a01e-48d5-9693-370a24ca69d5","originalAuthorName":"曾明"},{"authorName":"陈正周","id":"683bad8a-ccb9-453f-9e5b-909567896adc","originalAuthorName":"陈正周"},{"authorName":"沈保罗","id":"9b735692-c1f8-4566-89e8-17c5b05248e8","originalAuthorName":"沈保罗"},{"authorName":"徐道芬","id":"1da01ffd-9286-4d4f-a5be-1442b0657769","originalAuthorName":"徐道芬"},{"authorName":"廖春丽","id":"3319e4ff-c596-4993-bc3d-fe127c92ac50","originalAuthorName":"廖春丽"}],"doi":"","fpage":"1353","id":"5e7d7f85-71d6-43ad-ba32-f5bee4833558","issue":"8","journal":{"abbrevTitle":"XYJSCLYGC","coverImgSrc":"journal/img/cover/XYJSCLYGC.jpg","id":"69","issnPpub":"1002-185X","publisherId":"XYJSCLYGC","title":"稀有金属材料与工程"},"keywords":[{"id":"01385c85-4378-4c57-8fc4-bf5390a11410","keyword":"<span style=\"color:red\">Sn-3.5Ag-2Bi-0.7Cu</span>","originalKeyword":"Sn-3.5Ag-2Bi-0.7Cu"},{"id":"6d741b92-299d-4f5d-ba6e-75ba1b47e59e","keyword":"无铅焊料","originalKeyword":"无铅焊料"},{"id":"e9d93ef1-8f70-43b4-875e-c929a6d5a699","keyword":"压入蠕变","originalKeyword":"压入蠕变"},{"id":"35e416a9-d44a-43ed-aa25-f15713b994b1","keyword":"应力指数","originalKeyword":"应力指数"},{"id":"f1e54bc0-d430-4b15-b216-14ccebf9fad8","keyword":"激活能","originalKeyword":"激活能"}],"language":"zh","publisherId":"xyjsclygc200908009","title":"<span style=\"color:red\">Sn-3.5Ag-2Bi-0.7Cu</span>无铅焊料压入蠕变性能的研究","volume":"38","year":"2009"},{"abstractinfo":"<p>利用DSC、微焊点强度测试仪、SEM、EDS及XRD,研究了<span style=\"color:red\">Sn0.3Ag0.7Cu</span>、<span style=\"color:red\">Sn1.0Ag0.5Cu</span>和<span style=\"color:red\">Sn3.0Ag0.5Cu</span>钎料的熔化特性、润湿性、力学性能、显微组织及相种类。通过TL-1000型高低温循环试验箱测试了-55~125 ℃循环条件下<span style=\"color:red\">Sn-Ag-Cu</span>焊点的界面层变化。结果表明,随着<span style=\"color:red\">Ag</span>含量的增加,钎料的熔点变化不大,钎料的润湿角显著降低,N<sub>2</sub>氛围条件下,3种钎料的润湿性均出现明显的提高。此外,3种焊点的力学性能也随着<span style=\"color:red\">Ag</span>含量的增加显著提高。<span style=\"color:red\">Sn0.3Ag0.7Cu</span>、<span style=\"color:red\">Sn1.0Ag0.5Cu</span>焊点的基体组织存在着少量的<span style=\"color:red\">Ag</span><sub>3</sub><span style=\"color:red\">Sn</span>和大颗粒<span style=\"color:red\">Cu</span><sub>6</sub><span style=\"color:red\">Sn</span><sub>5</sub>化合物,且分布杂乱,<span style=\"color:red\">Sn3.0Ag0.5Cu</span>焊点的基体组织则相对较为均匀,这也是<span style=\"color:red\">Sn0.3Ag0.7Cu</span>、<span style=\"color:red\">Sn1.0Ag0.5Cu</span>焊点的力学性能低于<span style=\"color:red\">Sn3.0Ag0.5Cu</span>的主要原因。对焊点进行热循环处理,发现3种焊点界面金属间化合物的厚度明显增加,界面层的形貌也由原来扇贝状向层状转化。</p>","authors":[{"authorName":"孙磊","id":"fab1a7a0-f68c-496c-a885-3fc254d25826","originalAuthorName":"孙磊"},{"authorName":"陈明和","id":"9ab030d1-02cd-4bb3-a4b8-7e4ca929d014","originalAuthorName":"陈明和"},{"authorName":"张亮","id":"fa921292-60ef-421d-89b8-c3b81a0df173","originalAuthorName":"张亮"},{"authorName":"杨帆","id":"a92d665c-1c22-4e15-905b-e9a7d383d97e","originalAuthorName":"杨帆"}],"categoryName":"Orginal Article","doi":"10.11900/0412.1961.2016.00332","fpage":"615","id":"893131e1-114f-486d-8cc6-562c8676b1fa","issue":"5","journal":{"abbrevTitle":"JSXB","coverImgSrc":"journal/img/cover/JSXB.jpg","id":"48","issnPpub":"0412-1961","publisherId":"JSXB","title":"金属学报"},"keywords":[{"id":"43275a60-da3d-4ed0-a0d9-f20f95a2f495","keyword":"<span style=\"color:red\">Sn-Ag-Cu</span>","originalKeyword":"Sn-Ag-Cu"},{"id":"bee8cf75-5994-4d85-9276-f9083194c5e2","keyword":"润湿性","originalKeyword":"润湿性"},{"id":"21ad96f7-9190-449d-a3c6-a7af4db2cb7e","keyword":"力学性能","originalKeyword":"力学性能"},{"id":"8cc102a8-175a-4833-9849-40a66b97204f","keyword":"显微组织","originalKeyword":"显微组织"},{"id":"97c3bc44-f5eb-48f2-9dce-c4477b555ded","keyword":"热循环","originalKeyword":"热循环"}],"language":"zh","publisherId":"C20160332","title":"<span style=\"color:red\">Sn-Ag-Cu</span>钎料焊接显微组织演化和性能研究","volume":"53","year":"2017"},{"abstractinfo":"Lead-free <span style=\"color:red\">Sn3.5Ag</span> and <span style=\"color:red\">Sn3.5Ag0.5Cu</span> solder balls were reflowed by laser to form solder bumps. Shear test was performed on the solder bumps, and SEM/EDX (scanning electron microscopy/energy dispersive X-ray spectrometer) was used to analyze the formation of intermetallic compounds (IMCs) at interface region. A finite element modeling on the temperature gradient and distribution at the interface of solder bump during laser reflow process was conducted to elucidate the mechanism of the IMCs growth direction. The results show that the parameters window for laser reflow bumping of <span style=\"color:red\">Sn3.5Ag0.5Cu</span> was wider than that of <span style=\"color:red\">Sn3.5Ag</span>. The shear strength of <span style=\"color:red\">Sn3.5Ag0.5Cu</span> solder bump was comparable to that of <span style=\"color:red\">Sn3.5Ag</span> solder bump, and was not affected obviously by laser power and irradiation time when appropriate parameters were used. Both laser power and heating time had a significant effect on the formation of IMCs. A continuous AuSn4 intermetallic compound layer and some needle-like AuSn4 were observed at the interface of solder and Au/Ni/<span style=\"color:red\">Cu</span> metallization layer when the laser power is small. The formation of needle-like AuSn4 was due to temperature gradient at the interface, and the direction of temperature gradient was the preferred growth direction of AuSn4. With increasing the laser power and heating time, the needle-like AuSn4 IMCs dissolved into the bulk solder, and precipitated out once again during solidification along the grain boundary of the solder bump.","authors":[{"authorName":"Yanhong TIAN","id":"4b9693bb-9cfc-46fa-991f-6a19bd59616f","originalAuthorName":"Yanhong TIAN"}],"categoryName":"|","doi":"","fpage":"220","id":"5e14b1ce-8642-4476-9499-ae00ab522d06","issue":"2","journal":{"abbrevTitle":"CLKXJSY","coverImgSrc":"journal/img/cover/JMST.jpg","id":"11","issnPpub":"1005-0302 ","publisherId":"CLKXJSY","title":"材料科学技术（英文）"},"keywords":[{"id":"ee802c9c-810c-4c25-bc7e-844a071a178f","keyword":"Lead-free bumping","originalKeyword":"Lead-free bumping"},{"id":"709939e4-ebf5-42f6-812b-7f161b690eb3","keyword":"null","originalKeyword":"null"},{"id":"fefd7f85-b2bd-43c5-a6ad-1cec4e4939a1","keyword":"null","originalKeyword":"null"}],"language":"en","publisherId":"1005-0302_2008_2_21","title":"Characteristics of Laser Reflow Bumping of <span style=\"color:red\">Sn3.5Ag</span> and <span style=\"color:red\">Sn3.5Ag0.5Cu</span> Lead-Free Solder Balls","volume":"24","year":"2008"},{"abstractinfo":"利用静滴法研究了<span style=\"color:red\">Sn-Cu-Ag</span>/<span style=\"color:red\">Cu</span>体系熔融焊料的润湿机理,结果发现,700 K是合金焊料铺展机理的转折点.利用DTA分析方法研究了界面反应,采用Kissinger方法计算了界面反应热动力学参数,另外,还研究了元素<span style=\"color:red\">Cu</span>对提高<span style=\"color:red\">Sn-Ag-Cu</span>/<span style=\"color:red\">Cu</span>体系界面反应活化能的影响及对界面反应速率的抑制作用.","authors":[{"authorName":"徐红艳","id":"9eef4403-0965-47cc-99c1-caf6da8bfec3","originalAuthorName":"徐红艳"},{"authorName":"袁章福","id":"614fa450-8597-41fc-b09d-8689517c37f2","originalAuthorName":"袁章福"}],"doi":"","fpage":"2893","id":"d4a308ee-4402-401a-b6b9-bde4eb2b754a","issue":"12","journal":{"abbrevTitle":"XYJSCLYGC","coverImgSrc":"journal/img/cover/XYJSCLYGC.jpg","id":"69","issnPpub":"1002-185X","publisherId":"XYJSCLYGC","title":"稀有金属材料与工程"},"keywords":[{"id":"ea171d6c-45fe-41b2-b401-3b7155741eaa","keyword":"铺展机理","originalKeyword":"铺展机理"},{"id":"ef49a7d6-1d5b-4ae7-ac95-7727781acec6","keyword":"润湿特性","originalKeyword":"润湿特性"},{"id":"994dd584-561f-40a3-8a19-07466ed94df1","keyword":"界面反应","originalKeyword":"界面反应"},{"id":"1782e280-66c7-4462-99e4-41fe4ef76034","keyword":"热动力学","originalKeyword":"热动力学"},{"id":"6165a45d-f34f-47d5-a5ad-3ec541c8edf9","keyword":"动力学","originalKeyword":"动力学"}],"language":"zh","publisherId":"xyjsclygc201412004","title":"<span style=\"color:red\">Sn-Ag-Cu</span>/<span style=\"color:red\">Cu</span>体系界面反应动力学研究","volume":"43","year":"2014"}],"totalpage":1443,"totalrecord":14425}