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THE DESIGN OF AN INTEGRATED SYSTEM FOR PREDICTING AND ANALYZING SOLDER JOINT SHAPE AND RELIABILITY IN SMT

C. Q. Wang , X. J. Zha , C. Q. Zhang , S. Q. Yang , C. Z. Wang( 1)National Lab of Advanced Welding Technology , HIT , Harbin 150001 , China 2)Shanghai Institute of Metallurgy , Chinese Academy of Science , Shanghai 200050 , China)

金属学报(英文版)

Solder joint reliability is one of critical problems detemining whether Sirface Mount Technology (SMT) can be used in the prohotion of important electronic products. Optimizing solder joint shape is one of effective ways to improve SMT solder joint reliability.In this paper. based on the theorem of minimum potential energy, an energy model of 3 - D solder joint shape is established,and the forma- tion of solder joint is numerically simulated by Surface Ecolver program. On the basis of the prediction of SMT solder joint shape,the mechanical model of analyzing solder joint reliability is established. An elasto - plasto - creep mateial model and its mechanical constitutive equaton are established for SnPb solder alloy, and the stress/strain response of SMT solder joint under thermal cyclical loabing is ana- lyzed with nonlinear 3 - D FEM. The fatigue life of solder joint is predicted according to Coffin- Manson fatigue life model. An integrated system for Predicting and analyzing SMT solder joint shape and reliability(PSAR) is developed.The system can analyze efficiently SMT solder joint reliability with the variation of structural parameters in the joint and give the optimal structure.

关键词: SMT , null , null , null

NUMERICAL SIMULATION OF THE TEMPERATURE FIELD IN A SOLDER BALL UNDER PULSED LASER AND ITS EFFECT ON THE VIBRATION OF THE SOLDER

C. Q. Wang , M. Y. Li and L. Fang (National Key Laboratory of Advanced Welding Production Technology , H. I. T. , Harbin 150001 , China)

金属学报(英文版)

The research presented here is focused on the vibration condition of a small volume solder solder ball,which is placed on the surface of a soldering pad and is exerted a pulse modulated continuous wave laser heat source. Finite element method is applied to analyzed the temperature field in the solder ball, and experi- ment is conducted to test the vibration. the results show that,that, the temperature field flucturates with the same frequency as that of the laser pulse, which in turn causes a forced vibration of the same frequency in the liquid solder ball.

关键词: pulse modulated continuous wave laser , null , null

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