{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"在酸性化学镀Ni-P合金镀液中加入硫酸铜和光亮剂, 成功研制了一种钢铁件的全光亮化学镀Ni-Cu-P合金工艺, 检测了镀液和镀层性能, 探讨了主要成分和工艺条件对化学镀Ni-Cu-P合金镀层性能的影响. 结果表明, 所形成的Ni-Cu-P合金镀层结晶细致、光泽高, 具有较高的装饰性, 镀层耐蚀性、耐磨性和镀液稳定性优于酸性化学镀Ni-P合金工艺.","authors":[{"authorName":"肖鑫","id":"e02b29d7-085a-4127-87ee-97d8832d01c7","originalAuthorName":"肖鑫"},{"authorName":"许律","id":"0f5c5dd5-636c-4fda-938f-ea9ee68e0c06","originalAuthorName":"许律"},{"authorName":"李德","id":"f8959e9f-acad-496c-b620-4d6c300d5ba6","originalAuthorName":"李德"},{"authorName":"钟萍","id":"04e491d5-51a9-482c-9c51-1eb139123327","originalAuthorName":"钟萍"}],"categoryName":"|","doi":"","fpage":"337","id":"39e4cc07-7cc0-47e0-952d-293e467d2cf7","issue":"4","journal":{"abbrevTitle":"FSXB","coverImgSrc":"journal/img/cover/腐蚀学报封面.jpg","id":"24","issnPpub":"2667-2669","publisherId":"FSXB","title":"腐蚀学报(英文)"},"keywords":[{"id":"fee29de4-23c2-4a95-a7b7-421720dec0a2","keyword":"钢铁件","originalKeyword":"钢铁件"},{"id":"e565b6bc-3c6f-41df-ae89-98481d9b39b5","keyword":"electroless plating","originalKeyword":"electroless plating"},{"id":"3508f400-e50a-419d-87d8-f040d51b8684","keyword":"Ni-Cu-P alloy","originalKeyword":"Ni-Cu-P alloy"},{"id":"8cc1a5b8-0b58-40bb-b3a5-713cf00b038a","keyword":"brightener","originalKeyword":"brightener"}],"language":"zh","publisherId":"1002-6495_2012_4_20","title":"钢铁件化学镀Ni-Cu-P合金工艺研究","volume":"24","year":"2012"},{"abstractinfo":"为了进一步提高Ni-P镀层的耐蚀性能,在Ni-P化学镀液中加入硫酸铜制备了Ni-Cu-P三元合金化学镀层,测试了镀层的沉积速度,采用扫描电镜(SEM)观察了镀层的表面形貌,测试了镀层在5.0%H:sO。,5.0%NaOH及3.5%NaCl溶液中的动电位极化曲线,并与Ni-P化学镀层进行了比较。结果表明:Ni-Cu-P镀层表面的胞状物比Ni-P镀层的更加细小,镀层致密性更好;Ni-Cu-P镀层在3种介质中均表现出更好的耐均匀腐蚀性和抗点蚀性能,主要是因为Ni-Cu-P镀层的非晶态结构减少了镀层缺陷数量,从而减少了腐蚀发生的敏感位置和腐蚀微电池的数量,同时更加细小的晶粒也使Ni-Cu-P镀层比Ni-P镀层更容易钝化和维持钝态,另外Ni-Cu-P镀层更为致密也减少了腐蚀介质渗入基体的通道。","authors":[{"authorName":"梁平","id":"253c7e55-79ea-4989-824d-a9334ec8f13d","originalAuthorName":"梁平"},{"authorName":"史艳华","id":"1c198d24-bf87-4437-820c-d5c4a8708a0b","originalAuthorName":"史艳华"}],"doi":"","fpage":"8","id":"749b1068-16e9-4e7b-930c-9d66df40bbd6","issue":"3","journal":{"abbrevTitle":"CLBH","coverImgSrc":"journal/img/cover/CLBH.jpg","id":"7","issnPpub":"1001-1560","publisherId":"CLBH","title":"材料保护"},"keywords":[{"id":"a2e4c03d-3333-4f1e-bd23-9a64721ab2a3","keyword":"化学镀","originalKeyword":"化学镀"},{"id":"3eae75a6-f44e-4d4c-9097-74fb6f2ddefb","keyword":"Ni-Cu-P镀层","originalKeyword":"Ni-Cu-P镀层"},{"id":"d137f3e5-bec6-46de-a743-140bd75d46cc","keyword":"Ni-P镀层","originalKeyword":"Ni-P镀层"},{"id":"1ce5aeee-9c28-4cef-997d-8088b2c95e47","keyword":"耐蚀性","originalKeyword":"耐蚀性"}],"language":"zh","publisherId":"clbh201203004","title":"Ni-Cu-P化学镀层的腐蚀行为","volume":"45","year":"2012"},{"abstractinfo":"研究了化学复合镀(Ni-Cu-P)-PTFE复合材料制备工艺,结果表明,控制温度在78~85℃,PTFE的添加量为15~20 g/L,Ni2+/Cu2+=5.6~6.9,添加适量表面活性剂,能够镀覆表面质量良好的(Ni-Cu-P)-PTFE复合材料,工艺稳定.","authors":[{"authorName":"吴玉程","id":"afb0f3f4-cc8f-4344-b559-dfb9537653be","originalAuthorName":"吴玉程"},{"authorName":"黄新民","id":"e566eee3-129a-45a6-85a5-298a31ff2992","originalAuthorName":"黄新民"},{"authorName":"蒋劲勇","id":"ad0f2c76-247d-4c19-808b-5a848c9897bc","originalAuthorName":"蒋劲勇"},{"authorName":"鲍春燕","id":"eaa88eac-2364-46db-bafc-90b02114d62f","originalAuthorName":"鲍春燕"},{"authorName":"韩栋","id":"1a9bf8a9-5b6f-484f-98e2-c46604272cc2","originalAuthorName":"韩栋"},{"authorName":"邓宗钢","id":"ab12816e-1a72-4249-b6a4-aadced0ff163","originalAuthorName":"邓宗钢"},{"authorName":"邱世洵","id":"d4236a4f-0836-4c01-89ad-5db9743b8658","originalAuthorName":"邱世洵"},{"authorName":"朱绍峰","id":"4a98da77-9611-4c21-93a3-3d6b994745bf","originalAuthorName":"朱绍峰"}],"doi":"10.3969/j.issn.1001-3849.1999.01.003","fpage":"8","id":"76bc85f6-5c1b-4234-be8c-3ab2c7e5e110","issue":"1","journal":{"abbrevTitle":"DDYJS","coverImgSrc":"journal/img/cover/DDYJS.jpg","id":"20","issnPpub":"1001-3849","publisherId":"DDYJS","title":"电镀与精饰 "},"keywords":[{"id":"27415005-2c62-4e6a-a600-ffcaf43f951e","keyword":"化学复合镀","originalKeyword":"化学复合镀"},{"id":"1029ec9f-4602-4e65-9fe0-bad0bf413b67","keyword":"(Ni-Cu-P)-PTFE","originalKeyword":"(Ni-Cu-P)-PTFE"},{"id":"6dc9a8cf-f7b6-44c0-8e7a-dd16e7fa795a","keyword":"制备工艺","originalKeyword":"制备工艺"}],"language":"zh","publisherId":"ddjs199901003","title":"化学复合镀(Ni-Cu-P)-PTFE工艺","volume":"","year":"1999"},{"abstractinfo":"利用SEM、DSC、XRD、中性盐雾试验和显微硬度分析等手段,对Ni-10.54%P及Ni-9.25%Cu-10.23%P化学镀层的组织特征、相结构转变、热稳定性、耐蚀性和硬度进行了比较.结果表明:(1)两种镀层均匀致密,均为胞状结构和非晶态组织;(2)Ni-P镀层仅发生从非晶相向稳定的Ni3P相转变,而Ni-Cu-P镀层则先生成Ni-Cu固溶体和亚稳中间相Ni5P2,再向稳定相Ni3P转变;(3)Ni-Cu-P镀层的热稳定性高于Ni-P镀层;(4)镀态和低温热处理条件下两种镀层的硬度相差不大,Ni-P镀层经400 ℃、60 min热处理时硬度达到最高值981.1 HV,但Ni-Cu-P镀层经500 ℃、60 min热处理时硬度达到最高值1 144.8 HV;(5)镀态时Ni-Cu-P镀层的腐蚀速率只有Ni-P镀层腐蚀速率的2.85%;经过400 ℃、120 min相同条件的热处理,Ni-Cu-P镀层的腐蚀速率仅为Ni-P镀层腐蚀速率的0.351%.","authors":[{"authorName":"赵芳霞","id":"175b6e23-d464-4b2b-a61f-4223f7971bfe","originalAuthorName":"赵芳霞"},{"authorName":"刘琛","id":"6abaf622-13c3-47fe-93ff-a8598cf495e4","originalAuthorName":"刘琛"},{"authorName":"张振忠","id":"e8aef12e-fb2c-4674-a877-b8f3a2bacca6","originalAuthorName":"张振忠"},{"authorName":"丘泰","id":"ef6ad705-bd0d-45e1-adac-8191a51dd746","originalAuthorName":"丘泰"}],"doi":"10.3969/j.issn.1001-1560.2006.03.020","fpage":"65","id":"55f9776f-f8e2-4717-bf47-9aa9d93bae41","issue":"3","journal":{"abbrevTitle":"CLBH","coverImgSrc":"journal/img/cover/CLBH.jpg","id":"7","issnPpub":"1001-1560","publisherId":"CLBH","title":"材料保护"},"keywords":[{"id":"6328cb04-7d66-4eba-b916-33a5b9ea926d","keyword":"化学镀","originalKeyword":"化学镀"},{"id":"aacdadbd-3173-46a3-8f08-717560bb5281","keyword":"Ni-P","originalKeyword":"Ni-P"},{"id":"b13604fe-d748-444b-8c5e-93dfff5fc5b8","keyword":"Ni-Cu-P","originalKeyword":"Ni-Cu-P"},{"id":"0986d442-6fe4-49f7-86bc-b238225eaecb","keyword":"热稳定性","originalKeyword":"热稳定性"},{"id":"2cbf91f3-2cf8-4830-a72a-5f3d376b7c46","keyword":"硬度","originalKeyword":"硬度"},{"id":"7c7ea95d-cc92-477b-a609-ab3c18c81fc8","keyword":"耐蚀性","originalKeyword":"耐蚀性"}],"language":"zh","publisherId":"clbh200603020","title":"Ni-P和Ni-Cu-P化学镀层对比研究","volume":"39","year":"2006"},{"abstractinfo":"通过对化学镀Ni-Cu-P合金工艺配方的研究,确定较佳的工艺配方,探讨各种因素对化学镀层的性能的影响.实验结果发现CuSO4的含量对镀层黑度的影响较大.该工艺具有能耗低、工艺简单、不污染环境、成本低等优点.","authors":[{"authorName":"王玲","id":"5d950c53-596e-4b8c-8840-64fbcb3fdea8","originalAuthorName":"王玲"},{"authorName":"沈勇","id":"2c49478d-723c-47c1-b79e-3f84d38dcf1b","originalAuthorName":"沈勇"}],"doi":"","fpage":"3213","id":"d1135fc9-280d-4b62-b4fc-63c287d21d34","issue":"z1","journal":{"abbrevTitle":"GNCL","coverImgSrc":"journal/img/cover/GNCL.jpg","id":"33","issnPpub":"1001-9731","publisherId":"GNCL","title":"功能材料"},"keywords":[{"id":"eb571958-603d-4514-928c-433d5b880546","keyword":"化学镀","originalKeyword":"化学镀"},{"id":"8092493f-8620-48fc-8771-6be359d96c8a","keyword":"Ni-Cu-P三元合金","originalKeyword":"Ni-Cu-P三元合金"},{"id":"69dca702-0229-41f3-89b2-20d09ec27597","keyword":"镀层黑度","originalKeyword":"镀层黑度"}],"language":"zh","publisherId":"gncl2004z1903","title":"化学镀Ni-Cu-P合金的研究","volume":"35","year":"2004"},{"abstractinfo":" 研究了硫酸铜加入量对化学镀Ni-Cu-P合金的镀层成分、组织及热稳定性影响,用中性盐雾实验和在20% H2SO4+20 g/LAl2O3溶液中的冲刷腐蚀实验研究了Ni-P与Ni-Cu-P合金的耐蚀性和耐冲刷腐蚀性能.结果表明,Ni-Cu-P合金镀层具有比Ni-P合金镀层更好的热稳定性、耐蚀性和耐冲刷腐蚀性能.","authors":[{"authorName":"方信贤","id":"a794dbe5-922b-415e-8ba6-130445aaf5a6","originalAuthorName":"方信贤"}],"categoryName":"|","doi":"","fpage":"109","id":"dddbfda8-4dfa-463c-abea-e73454c8a123","issue":"2","journal":{"abbrevTitle":"FSXB","coverImgSrc":"journal/img/cover/腐蚀学报封面.jpg","id":"24","issnPpub":"2667-2669","publisherId":"FSXB","title":"腐蚀学报(英文)"},"keywords":[{"id":"9b33cf20-ad6c-4bf7-b8b2-813d3185f3e5","keyword":"化学镀Ni-P","originalKeyword":"化学镀Ni-P"},{"id":"f39f24fe-57ab-4911-8475-05f50748df57","keyword":"electroless Ni-Cu-P alloy","originalKeyword":"electroless Ni-Cu-P alloy"},{"id":"2cb446f8-bd8e-44a5-95b0-4adc5adf6fff","keyword":"corrosion resistance","originalKeyword":"corrosion resistance"},{"id":"3266ab53-e62e-485f-8c97-a7cca6b5d3f3","keyword":"erosion corrosion","originalKeyword":"erosion corrosion"},{"id":"f9079e2d-ccfb-437c-a748-7e49e54f1af8","keyword":"thermal stability","originalKeyword":"thermal stability"}],"language":"zh","publisherId":"1002-6495_2010_2_15","title":"化学镀Ni-P和Ni-Cu-P合金耐蚀性研究","volume":"22","year":"2010"},{"abstractinfo":"研究了硫酸铜加入量对化学镀Ni-Cu-P合金的镀层成分、组织及热稳定性影响,用中性盐雾实验和在20%H_2SO_4+20 g/LAl_2O_3溶液中的冲刷腐蚀实验研究了Ni-P与Ni-Cu-P合金的耐蚀性和耐冲刷腐蚀性能.结果表明,Ni-Cu-P合金镀层具有比Ni-P合金镀层更好的热稳定性、耐蚀性和耐冲刷腐蚀性能.","authors":[{"authorName":"方信贤","id":"4c3c36ea-c6e3-4fb1-acdd-793f89a1e993","originalAuthorName":"方信贤"}],"doi":"","fpage":"109","id":"94ee402b-ec3c-425e-8f91-c0f09e5addae","issue":"2","journal":{"abbrevTitle":"FSXB","coverImgSrc":"journal/img/cover/腐蚀学报封面.jpg","id":"24","issnPpub":"2667-2669","publisherId":"FSXB","title":"腐蚀学报(英文)"},"keywords":[{"id":"4c79b752-3144-4525-8124-d838f7469a84","keyword":"化学镀Ni-P","originalKeyword":"化学镀Ni-P"},{"id":"43bbac5a-4938-4e7e-a21d-a6f990b23114","keyword":"化学镀Ni-Cu-P合金","originalKeyword":"化学镀Ni-Cu-P合金"},{"id":"7fc3b99f-652a-4b50-b97b-cacc4351f500","keyword":"耐蚀性","originalKeyword":"耐蚀性"},{"id":"4b2352d4-6e95-4be6-b950-408524f1fdc9","keyword":"冲刷腐蚀","originalKeyword":"冲刷腐蚀"},{"id":"b4e4a2c1-7361-45c0-b73f-99d69d8a20c4","keyword":"热稳定性","originalKeyword":"热稳定性"}],"language":"zh","publisherId":"fskxyfhjs201002008","title":"化学镀Ni-P和Ni-Cu-P合金耐蚀性研究","volume":"21","year":"2010"},{"abstractinfo":"研究了Ni-Cu-P化学镀液主要成分、PH值、温度以及时间等工艺参数对化学沉积Ni-Cu-P合金镀层成分及镀速的影响。通过选择适当的镀液成分及工艺参数,得到了Cu含量从0到56.18wt%的Ni-Cu-P合金镀层。利用EDS和XRD研究了镀液中硫酸铜浓度对Ni-Cu-P合金镀层组织结构的影响。在硫酸铜浓度低于3g/L时,Ni-Cu-P合金镀层中P含量高于7.05wt%,合金镀层是非晶态结构。","authors":[{"authorName":"于会生","id":"c9bf5545-c1e8-4ba8-916c-e367b39e0f8b","originalAuthorName":"于会生"},{"authorName":"罗守福","id":"bdc07e37-5797-4b93-be6e-199f2ac75905","originalAuthorName":"罗守福"},{"authorName":"王永瑞","id":"536ea9e2-f3ba-4cc2-ab18-98d8ac0cb8fa","originalAuthorName":"王永瑞"}],"doi":"10.3969/j.issn.1001-4381.2001.02.009","fpage":"30","id":"19530133-157e-4423-8868-993c8b79ca23","issue":"2","journal":{"abbrevTitle":"CLGC","coverImgSrc":"journal/img/cover/CLGC.jpg","id":"9","issnPpub":"1001-4381","publisherId":"CLGC","title":"材料工程"},"keywords":[{"id":"ace3472c-cb7e-44ac-be30-2117ad7d31d8","keyword":"化学沉积","originalKeyword":"化学沉积"},{"id":"b78537be-2c3c-481a-8745-6cca3854e5bc","keyword":"Ni-Cu-P合金","originalKeyword":"Ni-Cu-P合金"},{"id":"12ea9640-57be-4cb8-85e1-3308280ff042","keyword":"工艺","originalKeyword":"工艺"},{"id":"a535cef5-a25c-4c6a-b3f5-93055d1afdda","keyword":"结构","originalKeyword":"结构"}],"language":"zh","publisherId":"clgc200102009","title":"Ni-Cu-P化学镀工艺及组织结构的研究","volume":"","year":"2001"},{"abstractinfo":"采用极化曲线和交流阻抗法,与Ni-P合金镀层对比,研究了化学镀Ni-Cu-P合金镀层在3.5% NaCl水溶液中的电化学行为.极化曲线结果表明,化学镀Ni-Cu-P合金镀层的自腐蚀电流密度(4.037 μA/cm2)远远小于Ni-P合金镀层,说明Ni-Cu-P合金镀层的耐蚀性能比Ni-P合金镀层好.在交流阻抗谱图中,化学镀Ni-Cu-P合金镀层在整个浸泡过程中仅出现一个时间常数的单容抗弧,镀层电阻不断的增大,表明镀层有钝化膜不断生成.","authors":[{"authorName":"黄燕滨","id":"4089e23f-9e99-401b-ab35-d1bf36bbee69","originalAuthorName":"黄燕滨"},{"authorName":"赵艺伟","id":"c709d9ec-9501-4d5c-be84-0f0dee8545ca","originalAuthorName":"赵艺伟"},{"authorName":"刘波","id":"c6b56fb3-2c1d-4ca0-9770-f5418f567bbf","originalAuthorName":"刘波"},{"authorName":"","id":"2600415c-a8a4-4606-a1df-a18789e1372f","originalAuthorName":""},{"authorName":"刘菲菲","id":"d274d270-2a99-4908-9bb7-60a8de312c46","originalAuthorName":"刘菲菲"},{"authorName":"孟昭福","id":"00ec2e36-b17c-4af7-aea7-8d4b0f24754c","originalAuthorName":"孟昭福"}],"doi":"10.3969/j.issn.1001-3849.2007.03.003","fpage":"7","id":"162366ac-9f77-4cf2-820b-d78982b0938a","issue":"3","journal":{"abbrevTitle":"DDYJS","coverImgSrc":"journal/img/cover/DDYJS.jpg","id":"20","issnPpub":"1001-3849","publisherId":"DDYJS","title":"电镀与精饰 "},"keywords":[{"id":"15cb5840-29fe-4b32-81a3-3dcd07b561d4","keyword":"化学镀","originalKeyword":"化学镀"},{"id":"5901ba9c-0284-4496-bf06-a5efbbd34cf9","keyword":"Ni-Cu-P合金镀层","originalKeyword":"Ni-Cu-P合金镀层"},{"id":"d027e02e-89cb-4d3f-a535-aab31c4a88f5","keyword":"耐蚀性","originalKeyword":"耐蚀性"},{"id":"6ecf5ca4-cad3-4d75-9ccd-b2325291f48f","keyword":"钝化膜","originalKeyword":"钝化膜"}],"language":"zh","publisherId":"ddjs200703003","title":"化学镀Ni-Cu-P合金镀层耐蚀性研究","volume":"29","year":"2007"},{"abstractinfo":"在AZ91D镁合金上直接化学镀Ni-Cu-P合金,得到了均匀、致密的镀层,有良好的结合力,其耐磨试验结果表明:Ni-Cu-P镀层的磨损量仅为基体的43%.X-射线衍射图表明热处理后,Ni-Cu-P合金镀层结构发生了变化,耐磨性有所提高,其磨损量仅为基体的15%.","authors":[{"authorName":"马壮","id":"91d5d315-de4a-4989-b18d-ae13ee8718bc","originalAuthorName":"马壮"},{"authorName":"王茺","id":"97782393-62fc-4292-9a8d-595ed6c7a243","originalAuthorName":"王茺"},{"authorName":"李智超","id":"792ae6fb-9e56-4964-afa3-b0d619f67da2","originalAuthorName":"李智超"}],"doi":"10.3969/j.issn.1001-3849.2008.05.002","fpage":"4","id":"09156151-1c02-4164-a5b3-b527702a5352","issue":"5","journal":{"abbrevTitle":"DDYJS","coverImgSrc":"journal/img/cover/DDYJS.jpg","id":"20","issnPpub":"1001-3849","publisherId":"DDYJS","title":"电镀与精饰 "},"keywords":[{"id":"79891dc3-9bff-4c66-82e8-42b800286e96","keyword":"镁合金","originalKeyword":"镁合金"},{"id":"466c6ab5-46f3-45bc-914f-f8a3721e8285","keyword":"化学镀","originalKeyword":"化学镀"},{"id":"70a069b1-19ea-43a1-994d-93466ff14b87","keyword":"Ni-Cu-P","originalKeyword":"Ni-Cu-P"},{"id":"9c42b2fa-95d6-4878-a871-451548c7b50f","keyword":"耐磨性","originalKeyword":"耐磨性"}],"language":"zh","publisherId":"ddjs200805002","title":"镁合金化学镀Ni-Cu-P合金耐磨性研究","volume":"30","year":"2008"}],"totalpage":3185,"totalrecord":31850}