{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"The tensile-shear <span style=\"color:red\">failure</span> zone of the laminated damping steel sheet was investigated by scanning electron microscopy and X-ray photoelectron spectroscopy. It is found that there exists cohesive <span style=\"color:red\">failure</span> in polymer sandwich and sub-boundary <span style=\"color:red\">failure</span> between the steel sheet and the polymer. The sub-boundary layer is dominantly polymer material. The tensile-shear <span style=\"color:red\">failure</span> of the laminated damping steel sheet is a process during which the crazes form, grow up and merge into cracks.","authors":[{"authorName":"Chengguo WANG","id":"86b7219d-405c-40dd-a733-70dbae939965","originalAuthorName":"Chengguo WANG"},{"authorName":" Xitai SUN","id":"63d1c383-0ab0-46fd-a882-9c0226c7bbc8","originalAuthorName":" Xitai SUN"},{"authorName":" Yujun BAI","id":"81e982ab-d308-419a-bfd1-1a0b7297760f","originalAuthorName":" Yujun BAI"}],"categoryName":"|","doi":"","fpage":"80","id":"b41dace0-7716-4e9c-8edb-3f1bc213e7b2","issue":"1","journal":{"abbrevTitle":"CLKXJSY","coverImgSrc":"journal/img/cover/JMST.jpg","id":"11","issnPpub":"1005-0302 ","publisherId":"CLKXJSY","title":"材料科学技术（英文）"},"keywords":[{"id":"cb632598-8048-4d86-89f9-06da6052cb62","keyword":"Laminated damping steel sheet","originalKeyword":"Laminated damping steel sheet"},{"id":"1c555467-f8b7-4bf1-9d08-de5cd3df70e1","keyword":"null","originalKeyword":"null"},{"id":"386edeb7-51d8-4766-8612-33010444d2a6","keyword":"null","originalKeyword":"null"}],"language":"en","publisherId":"1005-0302_2002_1_17","title":"<span style=\"color:red\">Failure</span> <span style=\"color:red\">Mechanism</span> of Laminated Damping Steel Sheet during Tensile-Shearing","volume":"18","year":"2002"},{"abstractinfo":"Abstract： Pulverized coal injection (PCI) is a key technology in modern ironmaking by blast furnace (BF) and the life of injection lance has a great influence on PCI operation and on normal running of blast furnace. It is found that the main reasons for the <span style=\"color:red\">failure</span> of the lances are their outer surface oxidation and the inner surface erosion through monitoring some lances used in BF. The outer surface oxidation of the lances made of lCr18Ni9Ti is inevitable under high hot blast temperature condition through thermodynamics analysis. A mathematical model for calculating the temperature of common monocular coal lance had been developed according to the principles of mass and energy balance. Increasing temperature and flow velocity of the hot blast would cause a rise in the lance temperature. The influence of hot blast temperature is more obvious. The lance temperature would decline when compressed air flux increases. Conveying technology of dense phase pulverized coal is beneficial to extending lance′s life because decreasing solid-gas ratio would intensify erosion and burning loss. The anti-oxidation temperature of lance materials needs to be over 1000 ℃ for BF intensified smelting. In order to increase the resistance to oxidation of the coal lance′s outer surface, oxidation-resistant steel or Al coating stainless steel is the appropriate material for BF use. Employing the metal surface treatment technology to enhance the hardness of the coal lance′s internal surface could prolong the service life of coal lance.","authors":[{"authorName":"XIONG Wei","id":"02343fb5-aaa3-46f4-940c-1cd888ddcd62","originalAuthorName":"XIONG Wei"},{"authorName":"JIA Juan","id":"cf93e4c5-982c-44bd-820b-54e5cd3f88b5","originalAuthorName":"JIA Juan"},{"authorName":"CHEN Jia-chao","id":"d79565dc-6cd8-443e-bba5-5b1f11838275","originalAuthorName":"CHEN Jia-chao"},{"authorName":"SHANG He-ming","id":"88fb5a69-705b-4212-82fe-fe4535c529fb","originalAuthorName":"SHANG He-ming"}],"categoryName":"|","doi":"","fpage":"11","id":"77cce781-9911-41a3-97b6-0a31ff9b7d9e","issue":"4","journal":{"abbrevTitle":"GTYJXBYWB","coverImgSrc":"journal/img/cover/GTYJXBEN.jpg","id":"1","issnPpub":"1006-706X","publisherId":"GTYJXBYWB","title":"钢铁研究学报(英文版)"},"keywords":[{"id":"d7326a06-1a99-4d98-af78-820ae01fcd46","keyword":"Key words: blast furnace ","originalKeyword":"Key words: blast furnace "},{"id":"24beab08-0e40-449b-9991-0382645c52eb","keyword":"  coal lance ","originalKeyword":"  coal lance "},{"id":"91aa0d11-1935-4f73-a907-9f09668d40ab","keyword":"  <span style=\"color:red\">failure</span> <span style=\"color:red\">mechanism</span> ","originalKeyword":"  failure mechanism "},{"id":"1e7bf6d2-42ff-41cc-9964-14a4468807dc","keyword":"  material requirements","originalKeyword":"  material requirements"}],"language":"en","publisherId":"1006-706X_2012_4_7","title":"<span style=\"color:red\">Failure</span> <span style=\"color:red\">Mechanism</span> and Material Requirements for Coal Lance in Blast Furnac","volume":"19","year":"2012"},{"abstractinfo":"用电子束物理气相沉积方法(EB-PVD)制备了双层结构热障涂层，对其在热循环过程中的组织结构变化与失效模式用扫描电镜(SEM)与交流阻抗法进行了测试分析.结果表明，与双面沉积热障涂层的失效模式不同，单面沉积热障涂层的剥落发生在陶瓷层内，而不是发生在热氧化生长层内.应力分析表明，双面沉积的热障涂层在热循环过程中主要受到由于热不匹配所产生的平行于样品表面的剪切力的作用，而单面沉积的热障涂层则不仅受到剪切力的作用，而且还将受到沿样品法线方向应力的作用，从而导致在陶瓷层内产生开裂.用交流阻抗法可以有效地表征上述横向裂纹的萌生及其扩展.","authors":[{"authorName":"李云端","id":"2df6714a-31a4-45d0-a567-e5834a396b7e","originalAuthorName":"李云端"},{"authorName":"张春霞","id":"003755c7-d1c5-414d-8627-7e5632ac921c","originalAuthorName":"张春霞"},{"authorName":"宫声凯","id":"85809484-af38-41a5-8277-1b6a712c42f6","originalAuthorName":"宫声凯"},{"authorName":"徐惠彬","id":"f78078d6-d425-438a-abe9-6af0a859fe8c","originalAuthorName":"徐惠彬"}],"categoryName":"|","doi":"","fpage":"146","id":"8723e72b-0647-4f4b-8cef-7d8d0e297484","issue":"3","journal":{"abbrevTitle":"ZGFSYFHXB","coverImgSrc":"journal/img/cover/中国腐蚀封面19-3期-01.jpg","id":"81","issnPpub":"1005-4537","publisherId":"ZGFSYFHXB","title":"中国腐蚀与防护学报"},"keywords":[{"id":"7e6a3e1c-b630-451f-be4b-970e9684a7eb","keyword":"热障涂层","originalKeyword":"热障涂层"},{"id":"e7651b3e-c565-4b02-b7e5-7394f0708fbd","keyword":"<span style=\"color:red\">failure</span> <span style=\"color:red\">mechanism</span>","originalKeyword":"failure mechanism"},{"id":"3cf7f455-0455-4853-923f-ddaa2efd6597","keyword":"impedance spectroscopy","originalKeyword":"impedance spectroscopy"},{"id":"a24ae68d-4219-4dbe-8ce4-1016f700dbf4","keyword":"thermal cycling","originalKeyword":"thermal cycling"}],"language":"zh","publisherId":"1005-4537_2006_3_5","title":"单面沉积热障涂层失效模式的研究","volume":"26","year":"2006"},{"abstractinfo":"对粉末冶金法制备的尺寸分别为3．5，10，20μm的Sicp增强Al-Cu基复合材料的拉伸断口及EDX成分分析表明，增强相尺寸大于10μm时，复合材料的破坏归因于SiCp解理形成的裂纹；增强相尺寸为3．5μm时，复合材料的破坏则归因为SiC-Al界面撕裂形成空洞和裂纹.拉伸试验表明，小尺寸SiCp增强的复合材料具有高的拉伸强度及延伸率.低强度复合材料由于基体强度降低，塑性增加，破坏过程主要表现在拉伸载荷下SiCp附近铝基体的空洞形核、长大和聚合.","authors":[{"authorName":"吕毓雄","id":"2a6c8173-4149-4b22-85b3-6a5f726faf4c","originalAuthorName":"吕毓雄"},{"authorName":"毕敬","id":"76c5f339-225d-4c16-b6d6-570d9dd7d575","originalAuthorName":"毕敬"},{"authorName":"陈礼清","id":"365daaf8-dfed-4830-b3e3-d70c9f7b5656","originalAuthorName":"陈礼清"},{"authorName":"赵明久","id":"7c083c3c-7ac2-40e2-9306-058a3cf3e62d","originalAuthorName":"赵明久"}],"categoryName":"|","doi":"","fpage":"1188","id":"88fe229c-0469-4755-b9c3-f089edb9b75f","issue":"11","journal":{"abbrevTitle":"JSXB","coverImgSrc":"journal/img/cover/JSXB.jpg","id":"48","issnPpub":"0412-1961","publisherId":"JSXB","title":"金属学报"},"keywords":[{"id":"6d5daa28-a27d-4c14-83a6-ac694726afd0","keyword":"铝基复合材料","originalKeyword":"铝基复合材料"},{"id":"35bc6edb-10fc-4985-ba4a-49dbd69c5edc","keyword":"powder metallurgy","originalKeyword":"powder metallurgy"},{"id":"1e751b2d-7886-45ca-9405-48d4b6ae2759","keyword":"particle size","originalKeyword":"particle size"},{"id":"ac8fc6eb-89f5-4637-b504-90aaeb9dddf5","keyword":"matrix strength","originalKeyword":"matrix strength"},{"id":"3a3ea5fa-314f-4718-b8f1-955122387608","keyword":"<span style=\"color:red\">failure</span> <span style=\"color:red\">mechanism</span>","originalKeyword":"failure mechanism"}],"language":"zh","publisherId":"0412-1961_1998_11_13","title":"SiC_p尺寸及基体强度对铝基复合材料破坏机制的影响","volume":"34","year":"1998"},{"abstractinfo":"本文简要评述了中国科学院金属研究所在新型复合材料研究方面的一些新近进展。阐述了连续纤维、晶须和颗粒增强的金属基复舍材料,介绍了碳基复合材料。探讨了增强模型、热应力损毁机理和性能测试。讨论了复合材料的仿生设计。","authors":[{"authorName":"周本濂","id":"d9dde35d-0663-42ad-be94-65c016885249","originalAuthorName":"周本濂"}],"categoryName":"|","doi":"","fpage":"524","id":"01d7cff6-19c2-426d-9f12-d1762285e9aa","issue":"6","journal":{"abbrevTitle":"CLYJXB","coverImgSrc":"journal/img/cover/CLYJXB.jpg","id":"16","issnPpub":"1005-3093","publisherId":"CLYJXB","title":"材料研究学报"},"keywords":[{"id":"53088faf-3a37-4a00-b3a0-286ffaf649b2","keyword":"复合材料","originalKeyword":"复合材料"},{"id":"c09218c7-0def-42f8-a48e-7758188bc243","keyword":"<span style=\"color:red\">failure</span> <span style=\"color:red\">mechanism</span>","originalKeyword":"failure mechanism"},{"id":"111b9bf3-858e-4a9b-9402-11abe1180c5c","keyword":"bionic design","originalKeyword":"bionic design"}],"language":"zh","publisherId":"1005-3093_1991_6_11","title":"新型复合材料研究的一些进展","volume":"5","year":"1991"},{"abstractinfo":"利用电化学方法以及扫描电镜(SEM)、扫描隧道显微镜(STM) 等技术，研究了离子镀TiN薄膜涂层在05 mol/L NaCl和1 mol/L H2SO4溶液中的保护 性能和失效机制.结果表明:TiN涂层可以提高材料在中性和酸性溶液中的耐蚀性能，TiN涂层 的保护机制为物理屏障作用；镀层的微观结构缺陷是涂层失效的主要原因,涂层下金属的腐 蚀行为与孔蚀类似.","authors":[{"authorName":"李瑛","id":"972c0592-d118-4352-b683-af676e3cd351","originalAuthorName":"李瑛"},{"authorName":"王福会","id":"bbed8d46-cff6-4fe2-b8dc-b16a7bc2728a","originalAuthorName":"王福会"},{"authorName":"邵忠宝","id":"cc6f32db-8cb8-4d58-bbee-ed600f71b9d9","originalAuthorName":"邵忠宝"}],"categoryName":"|","doi":"","fpage":"65","id":"5eb509c3-d198-4ac6-bb65-fff4ea8b5565","issue":"2","journal":{"abbrevTitle":"ZGFSYFHXB","coverImgSrc":"journal/img/cover/中国腐蚀封面19-3期-01.jpg","id":"81","issnPpub":"1005-4537","publisherId":"ZGFSYFHXB","title":"中国腐蚀与防护学报"},"keywords":[{"id":"6491af2a-d29e-48bc-9b9d-e29f2ae4fa6d","keyword":"TiN涂层","originalKeyword":"TiN涂层"},{"id":"c85e056d-250c-4063-a6e3-3fd4254e819d","keyword":"corrosion resistance","originalKeyword":"corrosion resistance"},{"id":"509127ab-9031-48d8-b805-2c30a00d6782","keyword":"<span style=\"color:red\">failure</span> <span style=\"color:red\">mechanism</span>","originalKeyword":"failure mechanism"}],"language":"zh","publisherId":"1005-4537_2003_2_9","title":"TiN涂层电化学腐蚀行为研究Ⅰ.TiN涂层的保护性能与失效机制","volume":"23","year":"2003"},{"abstractinfo":"The shear <span style=\"color:red\">failure</span> modes and respective <span style=\"color:red\">failure</span> <span style=\"color:red\">mechanism</span> of Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder bumping on Au/Ni/Cu metallization formed by induction spontaneous heating reflow process have been investigated through the shear test after aging at 120±C for 0, 1, 4, 9 and 16 d. Different typical shear <span style=\"color:red\">failure</span> behaviors have been found in the loading curves (shear force vs displacement). From the results of interfacial morphology analysis of the fracture surfaces and cross-sections, two main typical <span style=\"color:red\">failure</span> modes have been identified. The probabilities of the <span style=\"color:red\">failure</span> modes occurrence are inconsistent when the joints were aged for different times. The evolution of the brittle Ni3Sn4 and Cu-Ni-Au-Sn layers and the grains coarsening of the solder bulk are the basic reasons for the change of shear <span style=\"color:red\">failure</span> modes.","authors":[{"authorName":"Mingyu LI","id":"bfe12666-44c9-49e8-83b1-7d91bd73bb0e","originalAuthorName":"Mingyu LI"},{"authorName":" Hongbo XU","id":"65bb5c89-c562-4f7d-817c-23516183a15e","originalAuthorName":" Hongbo XU"}],"categoryName":"|","doi":"","fpage":"61","id":"ab975e2e-c174-4110-995f-1ca96dd7ceee","issue":"1","journal":{"abbrevTitle":"CLKXJSY","coverImgSrc":"journal/img/cover/JMST.jpg","id":"11","issnPpub":"1005-0302 ","publisherId":"CLKXJSY","title":"材料科学技术（英文）"},"keywords":[{"id":"2e1c7311-9bef-48cf-8bea-64c4e02f6688","keyword":"Induction spontaneous heating reflow","originalKeyword":"Induction spontaneous heating reflow"},{"id":"b946f0f8-1419-424c-a39a-9bdf82eb0242","keyword":"Self","originalKeyword":"Self"},{"id":"7c3dc005-3707-4d90-8e31-67cd72041a2a","keyword":"Heat","originalKeyword":"Heat"},{"id":"286b9507-e3e3-484b-a64d-47e7c7efcb76","keyword":"Reflow","originalKeyword":"Reflow"},{"id":"e4ac4c57-c713-40a8-87b0-40b1373eef45","keyword":"lead","originalKeyword":"lead"},{"id":"bcde296c-e7fb-4dbd-9828-4ea4d302918d","keyword":"free","originalKeyword":"free"},{"id":"b58beb58-4701-487e-a852-cd2458bb9383","keyword":"sol","originalKeyword":"sol"}],"language":"en","publisherId":"1005-0302_2007_1_10","title":"<span style=\"color:red\">Failure</span> Modes of Lead Free Solder Bumps Formed by Induction Spontaneous Heating Reflow","volume":"23","year":"2007"},{"abstractinfo":"200-nm-thick Au interconnects on a quartz substrate were tested in-situ inside a dual-beam microscope by applying direct current, alternating current and alternating current with a small direct current component. The <span style=\"color:red\">failure</span> behavior of the Au interconnects under three kinds of electric currents were characterized in-situ by scanning electron microscopy. It is found that the formation of voids and subsequent growth perpendicular to the interconnect direction is the fatal <span style=\"color:red\">failure</span> mode for all the Au interconnects under three kinds of electric currents. The <span style=\"color:red\">failure</span> <span style=\"color:red\">mechanism</span> of the ultrathin metal lines induced by the electric currents was analyzed.","authors":[{"authorName":"Bin ZHANG","id":"26b6d110-c082-43f1-a175-a6748b72e76a","originalAuthorName":"Bin ZHANG"},{"authorName":" Qingyuan YU","id":"aee088c1-341b-4320-8fd8-70426ad6cef9","originalAuthorName":" Qingyuan YU"},{"authorName":" Jun TAN","id":"e9e08bd8-96fd-4db2-9f61-0a58d4e91fd8","originalAuthorName":" Jun TAN"},{"authorName":" Guangping ZHANG","id":"0b24aa9f-fff2-43c8-bde8-86703c966c67","originalAuthorName":" Guangping ZHANG"}],"categoryName":"|","doi":"","fpage":"895","id":"7b35cfbf-f366-4e11-b475-5ce80f160d11","issue":"6","journal":{"abbrevTitle":"CLKXJSY","coverImgSrc":"journal/img/cover/JMST.jpg","id":"11","issnPpub":"1005-0302 ","publisherId":"CLKXJSY","title":"材料科学技术（英文）"},"keywords":[{"id":"0038a758-8532-463c-9fcf-422f904d4ab1","keyword":"Au interconnect","originalKeyword":"Au interconnect"},{"id":"06e7f084-e5b8-4198-8bb3-0bbcb8405ebc","keyword":"null","originalKeyword":"null"},{"id":"2fc81064-e6b3-437e-885a-baa0446dfdc0","keyword":"null","originalKeyword":"null"},{"id":"8f426716-0913-49d5-a6e3-fe6a76b86331","keyword":"null","originalKeyword":"null"}],"language":"en","publisherId":"1005-0302_2008_6_17","title":"Electric Current-induced <span style=\"color:red\">Failure</span> of 200-nm-thick Gold Interconnects","volume":"24","year":"2008"},{"abstractinfo":"200-nm-thick Au interconnects on a quartz substrate were tested in-situ inside a dual-beam microscope by applying direct current, alternating current and alternating current with a small direct current component. The <span style=\"color:red\">failure</span> behavior of the Au interconnects under three kinds of electric currents were characterized in-situ by scanning electron microscopy. It is found that the formation of voids and subsequent growth perpendicular to the interconnect direction is the fatal <span style=\"color:red\">failure</span> mode for all the Au interconnects under three kinds of electric currents. The <span style=\"color:red\">failure</span> <span style=\"color:red\">mechanism</span> of the ultrathin metal lines induced by the electric currents was analyzed.","authors":[],"categoryName":"|","doi":"","fpage":"895","id":"90380750-b093-4ba4-94f3-76d34c35ba4c","issue":"6","journal":{"abbrevTitle":"CLKXJSY","coverImgSrc":"journal/img/cover/JMST.jpg","id":"11","issnPpub":"1005-0302 ","publisherId":"CLKXJSY","title":"材料科学技术（英文）"},"keywords":[{"id":"ae47fcfe-e085-4f65-8765-15fcbfa5a98f","keyword":"Au interconnect;Electric current;Thermal fatigue;<span style=\"color:red\">Failure</span>;thin copper-films;bamboo al;electromigration;mechanisms;damage","originalKeyword":"Au interconnect;Electric current;Thermal fatigue;Failure;thin copper-films;bamboo al;electromigration;mechanisms;damage"}],"language":"en","publisherId":"1005-0302_2008_6_4","title":"Electric Current-induced <span style=\"color:red\">Failure</span> of 200-nm-thick Gold Interconnects","volume":"24","year":"2008"},{"abstractinfo":"","authors":[{"authorName":"DING Qingjun","id":"574adf5f-74ee-434a-918a-305518813042","originalAuthorName":"DING Qingjun"},{"authorName":"ZHAO Mingyu","id":"6d924952-0673-4ad7-8de4-e9080dd031ce","originalAuthorName":"ZHAO Mingyu"},{"authorName":"SHEN Fan","id":"89d05914-6e58-44fb-80ea-71f297b79814","originalAuthorName":"SHEN Fan"},{"authorName":"ZHANG Xiaoqiang","id":"a9499e1f-06e3-4d5b-866b-2a16b47f15c4","originalAuthorName":"ZHANG Xiaoqiang"}],"doi":"10.1007/s11595-015-1261-z","fpage":"981","id":"0d737a28-79fb-45a0-98f5-b1874a6925ec","issue":"5","journal":{"abbrevTitle":"WHLGDXXBCLKXBYWB","coverImgSrc":"journal/img/cover/20081008102608458.jpg","id":"63","issnPpub":"1000-2413","publisherId":"WHLGDXXBCLKXBYWB","title":"武汉理工大学学报-材料科学版(英文版)"},"keywords":[{"id":"0ed87e5f-91f6-4b26-8d30-af69493bb711","keyword":"","originalKeyword":""}],"language":"zh","publisherId":"whgydxxb-e201505019","title":"Mechanical Behavior and <span style=\"color:red\">Failure</span> <span style=\"color:red\">Mechanism</span> of Recycled Semi-lfexible Pavement Material","volume":"","year":"2015"}],"totalpage":225,"totalrecord":2250}